公开(公告)号：US20160005618A1

公开(公告)日：2016-01-07

申请号：US14476991

申请日：2014-09-04

Applicant: Applied Materials, Inc.

Inventor： Chih Hung CHEN ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: H01L21/306 ,  B24B41/047 ,  H01L21/67 ,  B24B37/10

CPC classification number: B24B41/047 ,  B24B37/10

Abstract: A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

Abstract translation: 抛光装置包括壳体，联接到壳体的柔性基座和设置在柔性基座的第一侧面上的接触区域，其中柔性基座基于容纳在壳体内的压力而膨胀和收缩，并且柔性基座的第二侧 以在第一侧上形成小于柔性基底的表面积的接触区域。

公开(公告)号：US20240363371A1

公开(公告)日：2024-10-31

申请号：US18309314

申请日：2023-04-28

Applicant: Applied Materials, Inc.

Inventor： Edward GOLUBOVSKY ,  Steven M. ZUNIGA ,  Jagan RANGARAJAN ,  Avyay PANCHAPAKESAN

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  H01L21/02

CPC classification number: H01L21/67046 ,  B08B1/12 ,  B08B1/32 ,  H01L21/02052

Abstract: A substrate cleaning apparatus is provided including: a shaft having an outer body and an interior volume, the shaft having a length in a first direction; and a pad carrier assembly comprising: a housing connected to the outer body in a fixed position relative to the outer body of the shaft, the housing having an inner volume; a piston disposed in the inner volume of the housing, the piston movable in the first direction based on pressure changes in the inner volume of the shaft; a pad carrier; and a flexible member connected between the housing and the pad carrier, the flexible member configured to extend or retract in the first direction with the pad carrier based on the pressure changes in the interior volume of the shaft.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20220134505A1

公开(公告)日：2022-05-05

申请号：US17510111

申请日：2021-10-25

Applicant: Applied Materials, Inc.

Inventor： Edward GOLUBOVSKY ,  Clinton SAKATA ,  Jagan RANGARAJAN ,  Ekaterina A. MIKHAYLICHENKO ,  Steven M. ZUNIGA

IPC: B24B37/04 ,  B24B37/30 ,  B24B37/10 ,  B24B37/34

Abstract: A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including an array of channels defined in a supporting surface thereof. The module includes a pad conditioning station disposed proximate to the rotatable vacuum table. The module includes a pad carrier positioning arm coupled to a pad carrier assembly. The module includes an actuator coupled to the pad carrier positioning arm and configured to position the pad carrier assembly between a first position over the rotatable vacuum table and a second position over the pad conditioning station.

公开(公告)号：US20220111483A1

公开(公告)日：2022-04-14

申请号：US17087941

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B37/32 ,  B24B49/16

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.

公开(公告)号：US20210323118A1

公开(公告)日：2021-10-21

申请号：US16871588

申请日：2020-05-11

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Edward GOLUBOVSKY ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B24B37/34 ,  B24B37/04 ,  H01L21/67 ,  H01L21/677 ,  H01L21/306 ,  B24B37/30

Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.

公开(公告)号：US20200086456A1

公开(公告)日：2020-03-19

申请号：US16552901

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Dmitry SKLYAR ,  Jeonghoon OH ,  Gerald J. ALONZO ,  Jonathan DOMIN ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B49/04 ,  H01L21/321 ,  H01L21/67 ,  B24B37/005 ,  B24B57/04

Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

公开(公告)号：US20200043756A1

公开(公告)日：2020-02-06

申请号：US16532730

申请日：2019-08-06

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Adrian BLANK ,  Edward GOLUBOVSKY ,  Balasubramaniam Coimbatore JAGANATHAN ,  Steven M. ZUNIGA ,  Ekaterina MIKHAYLICHENKO ,  Michael A. ANDERSON ,  Jonathan P. DOMIN

IPC: H01L21/67 ,  B08B3/02 ,  B08B5/02 ,  H01L21/687 ,  H01L21/02

Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

公开(公告)号：US20190030677A1

公开(公告)日：2019-01-31

申请号：US16037783

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  David J. LISCHKA ,  Erik RONDUM ,  Jay GURUSAMY ,  Robert D. TOLLES ,  Steven M. ZUNIGA ,  Steven M. REEDY ,  Wai- Ming KAN

IPC: B24B37/24 ,  B24B37/005

Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.