Abstract:
The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.
Abstract:
Several embodiments for ejecting a SIM tray from an electronic device are disclosed. In some embodiments, a lever positioned behind the tray can be actuated to eject the tray. In some embodiments, a pivot mechanism can be actuated to eject the tray. In other embodiments, a gear mechanism can be actuated to eject the tray. In other embodiments, a spring element can be actuated to eject the tray. In some embodiments, the electronic device may include a key feature that allows the tray to eject only when a tool is used having a mating key feature with the key feature of the electronic device.
Abstract:
This application relates to methods and apparatus pertaining to a SIM tray that includes a deformable portion. When the SIM tray is subjected to stresses that result from tolerance stacking, the deformable portion accommodates the differences tolerance errors by allowing the non-deformable portion of the SIM tray to move substantially independently from one another. Creating the deformable portion can be accomplished by utilizing materials with lower relative moduli of elasticity, dovetails, magnets, or other means.
Abstract:
The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.
Abstract:
This application relates to methods and apparatus pertaining to a SIM tray that includes a deformable portion. When the SIM tray is subjected to stresses that result from tolerance stacking, the deformable portion accommodates the differences tolerance errors by allowing the non-deformable portion of the SIM tray to move substantially independently from one another. Creating the deformable portion can be accomplished by utilizing materials with lower relative moduli of elasticity, dovetails, magnets, or other means.
Abstract:
The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.
Abstract:
An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.
Abstract:
An antenna may be formed from a peripheral conductive housing structure in an electronic device that is separated from an antenna ground by a gap. An antenna feed may be formed from a metal trace on a flexible printed circuit that spans the gap. The metal trace may have a line segment that joins a wider pad portion of the trace at a junction. A stiffener on the flexible printed circuit may have a protrusion that overlaps the junction. A metal bracket attached to the peripheral housing structure may be soldered to the pad. A metal member with meandering paths may form a return path in the antenna. The meandering path may have parallel segments that extend along an inner surface of the peripheral conductive housing structure to prevent the metal member from rotating when a screw is used to screw the metal member to the peripheral conductive housing structure.
Abstract:
An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.
Abstract:
Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.