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    Electronic assembly architectures using multi-cable assemblies
    1.
    发明授权
    Electronic assembly architectures using multi-cable assemblies 有权

    公开(公告)号：US10349565B2

    公开(公告)日：2019-07-09

    申请号：US15423466

    申请日：2017-02-02

    Applicant: Apple Inc.

    Inventor： Kurtis J. Mundell ,  Sina Bigdeli

    IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  G06F1/16

    Abstract: An electronic assembly having a printed circuit board (PCB) formed of a substrate of electrically isolating material that electrically isolates conductive traces carried therein and an electrical contact electrically coupled to an electrical trace and including, an electrical component that uses a high current/low loss signal, the electrical component being mounted at the substrate and electrically coupled to the electrical contact, a flex assembly having a housing formed of electrically isolating material, the housing carrying lines in a stacked arrangement each of which is capable of providing a high current/low loss path for carrying the high current/low loss signal, the flex assembly having a terminal having contacts arranged in a low-noise pattern where a contact is electrically connected to a corresponding transmission line and capable of forming an electrical connection between the transmission line and at least one electrical trace.

    PORTABLE ELECTRONIC DEVICE
    2.
    发明申请
    PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20200084310A1

    公开(公告)日：2020-03-12

    申请号：US16297389

    申请日：2019-03-08

    Applicant: Apple Inc.

    Inventor： Bryan D. Keen ,  Sina Bigdeli ,  Sawyer I. Cohen ,  William A. Counts ,  Lucy E. Browning ,  Devon A. Monaco ,  Jian Yang ,  Eric W. Bates

    IPC: H04M1/02 ,  G06F1/16 ,  H01M2/10 ,  H05K5/03

    Abstract: Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.

    Component shielding structures with magnetic shielding
    5.
    发明授权
    Component shielding structures with magnetic shielding 有权

    公开(公告)号：US10225964B2

    公开(公告)日：2019-03-05

    申请号：US15250066

    申请日：2016-08-29

    Applicant: Apple Inc.

    Inventor： James B. Smith ,  Daniel W. Jarvis ,  David A. Pakula ,  Gregory N. Stephens ,  Nicholas G. L. Merz ,  Shayan Malek ,  Sina Bigdeli

    IPC: H05K9/00 ,  H05K1/18 ,  H01L23/552

    Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

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