公开(公告)号：US20110101524A1

公开(公告)日：2011-05-05

申请号：US12985559

申请日：2011-01-06

申请人： Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Henry D. Bathan ,  Jeffrey D. Punzalan

发明人： Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Henry D. Bathan ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/24226 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor die having contact pads disposed over a surface of the semiconductor die, a die attach adhesive layer disposed under the semiconductor die, and an encapsulant material disposed around and over the semiconductor die. The semiconductor device further includes bumps disposed in the encapsulant material around a perimeter of the semiconductor die. The bumps are partially enclosed by the encapsulant material. The semiconductor device further comprises first vias disposed in the encapsulant. The first vias expose surfaces of the contact pads. The semiconductor device further includes a first redistribution layer (RDL) disposed over the encapsulant and in the first vias, and a second RDL disposed under the encapsulant material and the die attach adhesive layer. The first RDL electrically connects each contact pad of the semiconductor die to one of the bumps, and the second RDL is electrically connected to one of the bumps.

摘要翻译： 半导体器件包括具有设置在半导体管芯的表面上的接触焊盘的半导体管芯，设置在半导体管芯下方的管芯附着粘合剂层，以及设置在半导体管芯周围和上方的密封材料。 半导体器件还包括围绕半导体管芯的周边设置在密封剂材料中的凸块。 凸起部分被密封剂材料封闭。 半导体器件还包括设置在密封剂中的第一通孔。 第一个通孔暴露接触垫的表面。 半导体器件还包括设置在密封剂和第一通孔中的第一再分配层（RDL），以及设置在密封剂材料下方的第二RDL和管芯附着粘合剂层。 第一RDL将半导体管芯的每个接触焊盘电连接到凸块中的一个，并且第二RDL电连接到凸块之一。

公开(公告)号：US07932130B2

公开(公告)日：2011-04-26

申请号：US12185058

申请日：2008-08-01

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49551 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/495 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An integrated circuit package system includes: providing a die attach paddle with interconnection pads connected to a bottom surface of the die attach paddle; connecting a first device to the interconnection pads with a bond wire; connecting a lead to the interconnection pad or to the first device; encapsulating the first device and the die attach paddle with an encapsulation having a top surface; and etching the die attach paddle leaving a recess in the top surface of the encapsulation.

摘要翻译： 集成电路封装系统包括：提供具有连接到管芯附接板的底表面的互连焊盘的管芯附接焊盘; 用接合线将第一器件连接到互连焊盘; 将引线连接到所述互连焊盘或所述第一设备; 用具有顶表面的封装封装第一器件和管芯附接焊盘; 并且蚀刻在封装的顶表面中留下凹槽的管芯附接焊盘。

公开(公告)号：US07919850B2

公开(公告)日：2011-04-05

申请号：US12331416

申请日：2008-12-09

申请人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/04 ,  H01L23/02

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 安装内部封装，使得引线是内部封装的周边，并且内部封装具有连接焊盘; 在连接焊盘上形成暴露的端子互连; 并封装内部封装，并用封装部分地封装暴露的端子互连。

公开(公告)号：US20110068458A1

公开(公告)日：2011-03-24

申请号：US12565144

申请日：2009-09-23

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49575 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first device having a first exposed side and a first inward side; connecting a second device having a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device; connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal; and applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant, the exposed foot on an end of the system connector opposite the first device.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有第一暴露侧和第一内侧的第一器件; 将具有第二暴露侧和面向所述第一内侧的第二内侧的第二装置连接到所述第一装置，所述第二装置具有小于所述第一装置的平面尺寸的平面尺寸; 将系统连接器连接到第一内侧的周边，系统连接器具有部分垂直的暴露的腿和暴露的脚部分水平; 以及施加暴露所述第一暴露侧，所述第二暴露侧，所述暴露腿和所述暴露的脚的密封剂，暴露的腿偏离所述密封剂，所述暴露的脚在所述系统连接器的与所述第一装置相对的端部上。

公开(公告)号：US20110049662A1

公开(公告)日：2011-03-03

申请号：US12941683

申请日：2010-11-08

申请人： Zigmund R. Camacho ,  Henry D. Bathan ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Zigmund R. Camacho ,  Henry D. Bathan ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L31/0203

CPC分类号： H01L31/0203 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/82039 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00

摘要： A semiconductor device includes a carrier and semiconductor die having an optically active region. The semiconductor die is mounted to the carrier to form a separation between the carrier and the semiconductor die. The semiconductor device further includes a passivation layer disposed over a surface of the semiconductor die and a glass layer disposed over a surface of the passivation layer. The passivation layer has a clear portion for passage of light to the optically active region of the semiconductor die. The semiconductor device further includes an encapsulant disposed over the carrier within the separation to form an expansion region around a periphery of the semiconductor die, a first via penetrating the expansion region, glass layer, and passivation layer, a second via penetrating the glass layer and passivation layer to expose a contact pad on the semiconductor die, and a conductive material filling the first and second vias.

摘要翻译： 半导体器件包括具有光学活性区域的载流子和半导体管芯。 半导体管芯安装到载体上以形成载体和半导体管芯之间的间隔。 半导体器件还包括设置在半导体管芯的表面上的钝化层和设置在钝化层表面上的玻璃层。 钝化层具有用于将光通过到半导体管芯的光学活性区域的透明部分。 该半导体器件还包括一个密封剂，该密封剂设置在分离器内部的载体上，以形成围绕半导体管芯周围的扩张区域，穿过膨胀区域的第一通孔，玻璃层和钝化层，穿透玻璃层的第二通孔， 钝化层以暴露半导体管芯上的接触焊盘，以及填充第一和第二通孔的导电材料。

公开(公告)号：US07888181B2

公开(公告)日：2011-02-15

申请号：US12235000

申请日：2008-09-22

申请人： Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Henry D. Bathan ,  Jeffrey D. Punzalan

发明人： Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Henry D. Bathan ,  Jeffrey D. Punzalan

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/24226 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00

摘要： A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.

摘要翻译： 通过设置用于支撑半导体器件的金属基板来制造半导体器件。 焊接凸块连接到基板。 在一个实施例中，导电材料沉积在衬底上并被回流以形成焊料凸块。 使用芯片附着粘合剂将半导体管芯安装到基板上。 半导体管芯具有形成在半导体管芯的表面上的多个接触焊盘。 在焊料凸块和半导体管芯上沉积密封材料。 蚀刻密封剂以暴露半导体管芯的接触焊盘。 第一再分配层（RDL）形成在密封剂上方以将半导体管芯的每个接触焊盘连接到焊料凸块之一。 去除衬底以暴露芯片附着粘合剂和焊料凸块的底表面。

公开(公告)号：US20100320590A1

公开(公告)日：2010-12-23

申请号：US12488043

申请日：2009-06-19

申请人： Zigmund Ramirez Camacho ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/4951 ,  H01L23/3135 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the leadfingers only on portions of the continuously decreasing widths; and encapsulating the integrated circuit device and the leadfingers with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，其特征在于包括：沿其长度方向向其内端提供具有连续减小的宽度的向内会聚的引线管; 仅在连续减小宽度的部分上将导线器上的集成电路器件电连接; 并用封装封装集成电路器件和引线管。

公开(公告)号：US07851246B2

公开(公告)日：2010-12-14

申请号：US11965160

申请日：2007-12-27

申请人： Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Henry D. Bathan ,  Arnel Senosa Trasporto

发明人： Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Henry D. Bathan ,  Arnel Senosa Trasporto

IPC分类号： H01L29/72

CPC分类号： H01L31/0203 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/82039 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00

摘要： A semiconductor package has a semiconductor die with an optically active region which converts light to an electrical signal. An expansion region is formed around the semiconductor die. A through hole via (THV) is formed in the expansion region. Conductive material is deposited in the THV. A passivation layer is formed over the semiconductor die. The passivation layer allows for passage of light to the optically active region of the semiconductor die. A glass layer is applied to the passivation layer. A first RDL is electrically connected between the THV and a contact pad of the semiconductor die. Additional RDLs are formed on a front and back side of the semiconductor die. An under bump metallization (UBM) layer is formed over and electrically connected to the intermediate conduction layer. Solder material is deposited on the UBM and reflowed to form a solder bump.

摘要翻译： 半导体封装具有将光转换成电信号的具有光学有效区域的半导体管芯。 在半导体管芯周围形成扩展区域。 在膨胀区域形成通孔通孔（THV）。 导电材料沉积在THV中。 在半导体管芯上形成钝化层。 钝化层允许光通过半导体管芯的光学活性区域。 玻璃层被施加到钝化层。 第一RDL电连接在THV和半导体管芯的接触焊盘之间。 另外的RDL形成在半导体管芯的前侧和后侧。 在中间导电层之上形成并电连接凹凸金属化（UBM）层。 焊料沉积在UBM上并回流以形成焊料凸点。

公开(公告)号：US20100308467A1

公开(公告)日：2010-12-09

申请号：US12858593

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L23/538 ,  H01L21/78 ,  H01L21/50

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.

公开(公告)号：US07750451B2

公开(公告)日：2010-07-06

申请号：US11672164

申请日：2007-02-07

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Arnel Trasporto

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Arnel Trasporto

IPC分类号： H01L23/02

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package system is provided including providing a first carrier having a first integrated circuit die thereover, providing a second carrier, placing the first carrier coplanar with the second carrier, and molding a package encapsulation around and exposing the first carrier.

摘要翻译： 提供了一种多芯片封装系统，包括提供第一载体，其上具有第一集成电路管芯，提供第二载体，将第一载体与第二载体共面，并将封装封装模制在第一载体周围并暴露第一载体。