发明授权
- 专利标题： Method for forming an etched recess package on package system
- 专利标题（中）： 在封装系统上形成蚀刻凹槽封装的方法
-
申请号： US12185058申请日： 2008-08-01
-
公开(公告)号： US07932130B2公开(公告)日： 2011-04-26
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44
摘要：
An integrated circuit package system includes: providing a die attach paddle with interconnection pads connected to a bottom surface of the die attach paddle; connecting a first device to the interconnection pads with a bond wire; connecting a lead to the interconnection pad or to the first device; encapsulating the first device and the die attach paddle with an encapsulation having a top surface; and etching the die attach paddle leaving a recess in the top surface of the encapsulation.
公开/授权文献
信息查询
IPC分类:
