Focused ion beam apparatus and liquid metal ion source
    21.
    发明授权
    Focused ion beam apparatus and liquid metal ion source 失效
    聚焦离子束装置和液态金属离子源

    公开(公告)号:US07435972B2

    公开(公告)日:2008-10-14

    申请号:US11714235

    申请日:2007-03-06

    IPC分类号: H01J49/00 H01J27/00 G21K5/10

    摘要: In an aperture for use in an ion beam optical system having its surface coated with a liquid metal, instability of an ion source attributable to sputtering and re-deposition of an aperture base material is prevented. A focused ion beam apparatus using a liquid metal ion source has an aperture for limiting an ion beam diameter. The aperture has a vessel formed with a recess having, at its surface lowermost point, an aperture hole through which the ion beam passes and a liquid metal mounted on the recess, the liquid metal being used for the liquid metal ion source. Preferably, the aperture may be minimized in area of aperture entrance hole inner surface which exposes the base material by tapering an aperture hole portion, by which the ion beam passes, on the downstream side.

    摘要翻译: 在用于其表面涂覆有液态金属的离子束光学系统的孔中,防止归因于溅射的离子源的不稳定性和孔基材的再沉积。 使用液体金属离子源的聚焦离子束装置具有用于限制离子束直径的孔。 孔具有形成有凹槽的容器,凹槽在其表面的最低点处具有离子束通过的孔眼和安装在凹部上的液态金属,液态金属用于液体金属离子源。 优选地,孔径可以在孔径入口孔内表面的面积中最小化,孔面内表面通过使下游侧的离子束通过的孔眼部分变细而露出基底材料。

    Method and apparatus for specimen fabrication
    23.
    发明授权
    Method and apparatus for specimen fabrication 有权
    用于样品制造的方法和装置

    公开(公告)号:US07268356B2

    公开(公告)日:2007-09-11

    申请号:US10898592

    申请日:2004-07-26

    IPC分类号: G21G5/00

    摘要: A sample fabricating method of irradiating a sample with a focused ion beam at an incident angle less than 90 degrees with respect to the surface of the sample, eliminating the peripheral area of a micro sample as a target, turning a specimen stage around a line segment perpendicular to the sample surface as a turn axis, irradiating the sample with the focused ion beam while the incident angle on the sample surface is fixed, and separating the micro sample or preparing the micro sample to be separated. A sample fabricating apparatus for forming a sample section in a sample held on a specimen stage by scanning and deflecting an ion beam, wherein an angle between an optical axis of the ion beam and the surface of the specimen stage is fixed and formation of a sample section is controlled by turning the specimen stage.

    摘要翻译: 相对于样品表面以小于90度的入射角照射具有聚焦离子束的样品的样品制造方法,消除作为目标的微量样品的周边区域,将样品台围绕线段 垂直于样品表面作为转动轴线,同时在样品表面上的入射角被固定的同时用聚焦离子束照射样品,并分离微量样品或制备待分离的微量样品。 一种样品制造装置,用于通过扫描和偏转离子束来形成保持在样品台上的样品中的样品部分,其中离子束的光轴与样品台的表面之间的角度被固定并形成样品 通过转动样品台来控制切片。

    Focused ion beam apparatus and aperture
    26.
    发明授权
    Focused ion beam apparatus and aperture 有权
    聚焦离子束装置和孔径

    公开(公告)号:US07189982B2

    公开(公告)日:2007-03-13

    申请号:US11205086

    申请日:2005-08-17

    IPC分类号: H01J37/08

    摘要: In an aperture for use in an ion beam optical system having its surface coated with a liquid metal, instability of an ion source attributable to sputtering and re-deposition of an aperture base material is prevented. A focused ion beam apparatus using a liquid metal ion source has an aperture for limiting an ion beam diameter. The aperture has a vessel formed with a recess having, at its surface lowermost point, an aperture hole through which the ion beam passes and a liquid metal mounted on the recess, the liquid metal being used for the liquid metal ion source. Preferably, the aperture may be minimized in area of aperture entrance hole inner surface which exposes the base material by tapering an aperture hole portion, by which the ion beam passes, on the downstream side.

    摘要翻译: 在用于其表面涂覆有液态金属的离子束光学系统的孔中,防止归因于溅射的离子源的不稳定性和孔基材的再沉积。 使用液体金属离子源的聚焦离子束装置具有用于限制离子束直径的孔。 孔具有形成有凹槽的容器,凹槽在其表面的最低点处具有离子束通过的孔眼和安装在凹部上的液态金属,液态金属用于液体金属离子源。 优选地,孔径可以在孔径入口孔内表面的面积中最小化,孔面内表面通过使下游侧的离子束通过的孔眼部分变细而露出基底材料。

    Liquid metal ion gun
    28.
    发明申请
    Liquid metal ion gun 有权
    液态金属离子枪

    公开(公告)号:US20060097186A1

    公开(公告)日:2006-05-11

    申请号:US11312367

    申请日:2005-12-21

    IPC分类号: H01J27/00

    摘要: An emitter of a Ga liquid metal ion source is constituted to include W12 of a base material and Ga9 of an ion source element covering a surface as construction materials. By making back-sputtered particles become elements (W and Ga) of the Ga liquid metal ion sour source, if back-sputtered particles attach to the Ga liquid metal ion source, contamination which may change physical characteristics of Ga9 does not occur. A W aperture is used as a beam limiting (GUN) aperture to place Ga of approx. 25 mg (of melting point of 30° C.) on a surface of a portion included in a beam emission region (Ga store). When emitting ions to the beam limiting (GUN) aperture, Ga in the emission region melts and diffuses on a surface of the beam emission region of the W aperture.

    摘要翻译: Ga液体金属离子源的发射极构成为包括基材的W12和覆盖表面的离子源元素的Ga9作为构造材料。 通过使反溅射的颗粒成为Ga液态金属离子源的元素(W和Ga),如果反溅射的颗粒附着到Ga液态金属离子源,则不会发生可能改变Ga9的物理特性的污染物。 使用W光圈作为光束限制(GUN)光圈来放置大约的Ga。 在束发射区域(Ga储存)中包含的部分的表面上25mg(熔点为30℃))。 当将离子发射到光束限制(GUN)孔径时,发射区域中的Ga在W光阑的束发射区域的表面上熔化并扩散。

    Liquid metal ion gun
    29.
    发明授权
    Liquid metal ion gun 失效
    液态金属离子枪

    公开(公告)号:US07005651B2

    公开(公告)日:2006-02-28

    申请号:US11004903

    申请日:2004-12-07

    IPC分类号: G21G5/00 H01J27/00

    摘要: An emitter of a Ga liquid metal ion source is constituted to include W12 of a base material and Ga9 of an ion source element covering a surface as construction materials. By making back-sputtered particles become elements (W and Ga) of the Ga liquid metal ion source, if back-sputtered particles attach to the Ga liquid metal ion source, contamination which may change physical characteristics of Ga9 does not occur. A W aperture is used as a beam limiting (GUN) aperture to place Ga of approx. 25 mg (of melting point of 30° C.) on a surface of a portion included in a beam emission region (Ga store). When emitting ions to the beam limiting (GUN) aperture, Ga in the emission region melts and diffuses on a surface of the beam emission region of the W aperture.

    摘要翻译: Ga液体金属离子源的发射极构成为包括基材的W12和覆盖表面的离子源元素的Ga9作为构造材料。 通过使反溅射的粒子成为Ga液态金属离子源的元素(W和Ga),如果反溅射的粒子附着到Ga液态金属离子源,则不会发生可能改变Ga9的物理特性的污染。 使用W光圈作为光束限制(GUN)光圈来放置大约的Ga。 在束发射区域(Ga储存)中包含的部分的表面上25mg(熔点为30℃))。 当将离子发射到光束限制(GUN)孔径时,发射区域中的Ga在W光阑的束发射区域的表面上熔化并扩散。