公开(公告)号：US20230411831A1

公开(公告)日：2023-12-21

申请号：US18334375

申请日：2023-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak LEE ,  SangHo SONG ,  YeonJee LEE

IPC: H01Q1/24 ,  H01L23/66 ,  H01L23/64 ,  H01L23/498

CPC classification number: H01Q1/243 ,  H01L23/66 ,  H01L23/645 ,  H01L23/49816 ,  H01L2223/6677

Abstract: An antenna module comprises: an antenna body comprising a first surface for attaching the antenna module to an external substrate, and a second surface through which the antenna module transmits and receives electromagnetic signals, wherein the first surface is opposite to the second surface; an antenna conductive pattern formed within the antenna body; and a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences.

公开(公告)号：US20230411346A1

公开(公告)日：2023-12-21

申请号：US18332023

申请日：2023-06-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JoonYoung CHOI ,  WooSoon KIM ,  SeongKwon HONG ,  GaYeon KIM

IPC: H01L23/00 ,  H01L23/373 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L24/81 ,  H01L2224/81986 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L21/4882 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/35121 ,  H01L2924/1616 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L23/3736

Abstract: A semiconductor device and a method for forming the same are provided. The method includes: providing a substrate; providing a semiconductor die having a first die surface and a second die surface opposite to the first die surface; attaching the first die surface to the substrate via an interconnect structure comprising solder; and irradiating the second die surface with a laser beam, wherein the laser beam passes through the semiconductor die and reflows the solder of the interconnect structure. In the method, laser-assisted bonding can is used to reflow solder bumps, and thermal interface material can be formed after the laser-assisted bonding.

公开(公告)号：US20230411305A1

公开(公告)日：2023-12-21

申请号：US18315479

申请日：2023-05-10

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SeongHwan PARK ,  Bom LEE ,  KyoungHee PARK

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L2225/06537 ,  H01L21/56 ,  H01L25/0657

Abstract: A method for selectively forming a shielding layer on a semiconductor device comprises: attaching a tape stack onto a predetermined area of a substrate of the semiconductor device, wherein the tape stack comprises a lower tape layer that covers the predetermined area and an upper tape layer that extends beyond the predetermined area and overhangs above an intermediate area adjacent to the predetermined area; applying a shielding layer to the substrate of the semiconductor device; and removing the tape stack and a portion of the shielding layer formed on the tape stack from the substrate of the semiconductor device.

公开(公告)号：US20230402401A1

公开(公告)日：2023-12-14

申请号：US18455419

申请日：2023-08-24

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L21/311 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L21/31144 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/09 ,  H01L24/17 ,  H01L23/66 ,  H01L21/563

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

公开(公告)号：US20230395477A1

公开(公告)日：2023-12-07

申请号：US17805096

申请日：2022-06-02

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  HeeSoo Lee ,  SangHyun Son ,  Bokyeong Hwang

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a side surface of the interconnect substrate. The electrical interconnect compound can be applied with a tilt nozzle oriented at an angle. A second electrical component is disposed on the electrical interconnect compound on the conductive via exposed from the side surface of the interconnect substrate. A plurality of second electrical components can be disposed on two or more side surfaces of the interconnect substrate. The interconnect substrate can have a plurality of stacked conductive vias and the second electrical component is disposed over the stacked conductive vias. An encapsulant is deposited over the first electrical component and interconnect substrate. A shielding layer can be formed over the encapsulant.

公开(公告)号：US20230361103A1

公开(公告)日：2023-11-09

申请号：US18355906

申请日：2023-07-20

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung

IPC: H01L25/00 ,  H01L21/78 ,  H01L21/56 ,  H01L25/065 ,  H01L23/552

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L21/56 ,  H01L25/0652 ,  H01L23/552 ,  H01L2225/06524

Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US20230343732A1

公开(公告)日：2023-10-26

申请号：US18343606

申请日：2023-06-28

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Choon Heung Lee ,  JunHo Ye

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/565 ,  H01Q1/2283 ,  H01L23/552 ,  H01L2223/6677

Abstract: A semiconductor device has an electrical component assembly, and a plurality of discrete antenna modules disposed over the electrical component assembly. Each discrete antenna module is capable of providing RF communication for the electrical component assembly. RF communication can be enabled for a first one of the discrete antenna modules, while RF communication is disabled for a second one of the discrete antenna modules. Alternatively, RF communication is enabled for the second one of the discrete antenna modules, while RF communication is disabled for the first one of the discrete antenna modules. A bump is formed over the discrete antenna modules. An encapsulant is deposited around the discrete antenna modules. A shielding layer is formed over the electrical components assembly. A stud or core ball can be formed internal to a bump connecting the discrete antenna modules to the electrical component assembly.

公开(公告)号：US20230326769A1

公开(公告)日：2023-10-12

申请号：US18184670

申请日：2023-03-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyoWang KOO ,  SeoJun BAE ,  JungSub LEE

IPC: H01L21/56 ,  H01L25/00

CPC classification number: H01L21/565 ,  H01L25/50

Abstract: A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a top surface and a bottom surface; a top electronic component mounted on the top surface of the substrate; at least one conductive pillar formed on the bottom surface of the substrate; and a protection layer attached on the bottom surface of the substrate and covering the at least one conductive pillar; providing a molding apparatus including a top chase and a bottom chase, wherein a molding material is held in the bottom chase; attaching the protection layer onto the top chase of the molding apparatus; and moving the top chase and the bottom chase close to each other to compress the molding material to cover the top electronic component on the top surface of the substrate, thereby forming a top encapsulation on the top surface of the substrate.

公开(公告)号：US20230307414A1

公开(公告)日：2023-09-28

申请号：US18315991

申请日：2023-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Wagno Alves Braganca, JR. ,  KyungOe Kim

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L24/81 ,  H01L24/16 ,  H01L21/6835 ,  H01L21/78 ,  H01L2224/81005 ,  H01L2924/3511 ,  H01L2224/16235 ,  H01L2224/81224 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/95001

Abstract: A semiconductor device has a semiconductor die and a support tape disposed over a back surface of the semiconductor die opposite an active surface of the semiconductor die. A portion of the back surface of the semiconductor wafer is removed to reduce its thickness. The semiconductor die is part of a semiconductor wafer, and the wafer is singulated to provide the semiconductor die with the support tape disposed on the back surface of the semiconductor die. The support tape can be a polyimide tape. A dicing tape is disposed over the support tape. The semiconductor die is disposed over a substrate. A laser emission is projected onto the semiconductor die to bond the semiconductor die to the substrate. The support tape provides stress relief to avoid warpage of the semiconductor die during the laser emission. The support tape is removed from the back surface of the semiconductor die.

公开(公告)号：US20230275034A1

公开(公告)日：2023-08-31

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.