公开(公告)号：US20220157739A1

公开(公告)日：2022-05-19

申请号：US16950295

申请日：2020-11-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US11862478B2

公开(公告)日：2024-01-02

申请号：US17806924

申请日：2022-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L21/683 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/544

CPC classification number: H01L21/4814 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L23/552 ,  H01L2221/6835 ,  H01L2221/68322 ,  H01L2223/54413

Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US11990424B2

公开(公告)日：2024-05-21

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20230275034A1

公开(公告)日：2023-08-31

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20220199423A1

公开(公告)日：2022-06-23

申请号：US17127079

申请日：2020-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L23/552 ,  H01L21/683

Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US20240021536A1

公开(公告)日：2024-01-18

申请号：US17812339

申请日：2022-07-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  OMin Kwon

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/66 ,  H01L21/4853 ,  H01L21/565 ,  H01L2223/6677

Abstract: A semiconductor device has a substrate and encapsulant deposited over the substrate. An electrical connector is disposed over the substrate outside the encapsulant. An antenna can be formed over the substrate. A first shielding material is disposed over a portion of the encapsulant without covering the electrical connector with the first shielding material. The first shielding material is disposed over the portion of the encapsulant and the portion of the substrate using a direct jet printer. A cover is disposed over the electrical connector. A second shielding material is disposed over the encapsulant to prevent the second shielding material from reaching the electrical connector. The second shielding material overlaps the first shielding material and covers a side surface of the encapsulant and a side surface of the substrate. The cover is removed to expose the electrical connector free of shielding material.

公开(公告)号：US20240014093A1

公开(公告)日：2024-01-11

申请号：US17810901

申请日：2022-07-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  OMin Kwon ,  HeeSoo Lee

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L23/3672 ,  H01L23/373 ,  H01L23/4334

Abstract: A semiconductor device has a first substrate and electrical component disposed over the first substrate. A graphene layer is disposed over the electrical component, and a thermal interface material is disposed between the graphene layer. A heat sink is disposed over the thermal interface material. The graphene layer, in combination with the thermal interface material, aids with the heat transfer between the electrical component and heat sink. The graphene layer may be disposed over a second substrate made of copper. An encapsulant is deposited over the first substrate and around the electrical component and graphene substrate. The thermal interface material and heat sink may extend over the encapsulant. The heat sink can have vertical or angled extensions from the horizontal portion of the heat sink down to the substrate. The heat sink can extend over multiple modules.

公开(公告)号：US11664327B2

公开(公告)日：2023-05-30

申请号：US16950295

申请日：2020-11-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20220199545A1

公开(公告)日：2022-06-23

申请号：US17126621

申请日：2020-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/033

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US20240006335A1

公开(公告)日：2024-01-04

申请号：US17810028

申请日：2022-06-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  OMin Kwon

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulant, and second encapsulant.