Invention Publication
- Patent Title: Semiconductor Device and Method of Forming Embedded Magnetic Shielding
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Application No.: US17810028Application Date: 2022-06-30
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Publication No.: US20240006335A1Publication Date: 2024-01-04
- Inventor: ChangOh Kim , JinHee Jung , OMin Kwon
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L23/538 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulant, and second encapsulant.
Information query
IPC分类:
