公开(公告)号：US20230395477A1

公开(公告)日：2023-12-07

申请号：US17805096

申请日：2022-06-02

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  HeeSoo Lee ,  SangHyun Son ,  Bokyeong Hwang

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a side surface of the interconnect substrate. The electrical interconnect compound can be applied with a tilt nozzle oriented at an angle. A second electrical component is disposed on the electrical interconnect compound on the conductive via exposed from the side surface of the interconnect substrate. A plurality of second electrical components can be disposed on two or more side surfaces of the interconnect substrate. The interconnect substrate can have a plurality of stacked conductive vias and the second electrical component is disposed over the stacked conductive vias. An encapsulant is deposited over the first electrical component and interconnect substrate. A shielding layer can be formed over the encapsulant.

公开(公告)号：US20230238376A1

公开(公告)日：2023-07-27

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L25/00 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L21/6835 ,  H01L21/568 ,  H01L21/4846 ,  H01L21/4853 ,  H01L2225/1041 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2221/68359

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.

公开(公告)号：US12176335B2

公开(公告)日：2024-12-24

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.