公开(公告)号：US09604306B2

公开(公告)日：2017-03-28

申请号：US14775572

申请日：2013-04-25

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Yoshinori Kato

IPC分类号： B23K20/12 ,  B23K37/02

CPC分类号： B23K20/1255 ,  B23K20/122 ,  B23K20/1225 ,  B23K20/1245 ,  B23K20/126 ,  B23K37/0235

摘要： A friction-stir welding tool includes a front shoulder; a rear shoulder in contact with plate materials; and a probe penetrating the plate materials between the front and rear shoulders, the probe connecting the front shoulder and the rear shoulder to each other. The probe has a first screw part provided on at least one axial end section, and at least one of the front shoulder and the rear shoulder has a second screw part in threaded engagement with the first screw part, the threaded engagement changing so that the rear shoulder and the front shoulder approach each other along the axial direction as the front shoulder and the rear shoulder rotate relative to each other, and the threaded engagement with the first screw part linking at least one of the rear shoulder and the front shoulder with the probe.

公开(公告)号：US09540196B2

公开(公告)日：2017-01-10

申请号：US14057619

申请日：2013-10-18

申请人： TRUMPF Sachsen GmbH

发明人： Heiko Bauch ,  Christoph Protze

IPC分类号： B25J15/02 ,  B65H5/14 ,  B21D43/06 ,  B21D43/10 ,  B25J15/00 ,  B25B5/06 ,  B23K37/02 ,  B23K37/04 ,  B23K37/047 ,  B23K26/08 ,  B23K26/38

CPC分类号： B65H5/14 ,  B21D43/06 ,  B21D43/10 ,  B23K26/0869 ,  B23K26/38 ,  B23K37/0235 ,  B23K37/0443 ,  B23K37/047 ,  B23K2101/18 ,  B25B5/064 ,  B25J15/0047 ,  B25J15/0226

摘要： Devices and methods for handling workpieces, in particular workpieces in the form of processing products of a metal sheet processing operation, are described. The devices include one or more retention members that are movably supported by a retention member bearing and a transverse guide device. If the transverse guide device is moved relative to the retention member along a lifting axis out of a non-operative lifting position into an operative lifting position or out of an operative lifting position into a non-operative lifting position on a fixed retention member bearing, the retention member is thereby moved from a non-operative position into an operative position or out of an operative position into a non-operative position. In the operative position, the retention member can engage behind an edge of a workpiece, but cannot do so in the non-operative position. By means of a drive motor, the retention member moved into the operative position can be moved with a lifting movement along the lifting axis together with the retention member bearing and the transverse guide device which is moved into the operative lifting position.

摘要翻译： 描述了用于处理工件的装置和方法，特别是处理金属板加工操作的产品形式的工件。 这些装置包括一个或多个保持构件，其被保持构件轴承和横向引导装置可移动地支撑。 如果横向引导装置相对于保持构件沿着提升轴线从非操作提升位置移动到操作提升位置或从可操作提升位置移动到固定保持构件轴承上的非操作提升位置， 因此保持构件从非操作位置移动到操作位置或从操作位置移动到非操作位置。 在操作位置，保持构件可以接合在工件的边缘后面，但是在非操作位置不能这样做。 借助于驱动马达，移动到操作位置的保持构件可随着移动到操作提升位置的保持构件轴承和横向引导装置一起沿着提升轴线的提升运动而移动。

公开(公告)号：US20160325376A1

公开(公告)日：2016-11-10

申请号：US15104627

申请日：2014-07-30

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Kiyotaka NAKAGAWA ,  Yoshihito FUJITA ,  Tsugumaru YAMASHITA

IPC分类号： B23K26/06 ,  B23K26/38 ,  B23K26/00

CPC分类号： B23K26/0652 ,  B23K26/0093 ,  B23K26/083 ,  B23K26/0876 ,  B23K26/389 ,  B23K37/0235

摘要： Provided is a laser processing apparatus provided with: a first optical system including a first prism and a second prism; a second optical system including a third prism and a fourth prism; a condensing optical system that condenses laser light to guide the condensed laser light to a workpiece; a first driving device that rotates the first prism and rotates the second prism synchronously with the first prism; a second driving device that rotates the third prism and rotates the fourth prism synchronously with the third prism; and a controller that controls the first driving device and the second driving device such that the workpiece is irradiated with the laser light while the laser light turns. The controller adjusts irradiation conditions of the laser light including an incidence position and an incidence angle of the laser light with respect to the workpiece, by adjusting a relative position between the first prism and the second prism and a relative position between the third prism and the fourth prism in a rotational direction.

摘要翻译： 本发明提供一种激光加工装置，具备：第一光学系统，包括第一棱镜和第二棱镜; 第二光学系统，包括第三棱镜和第四棱镜; 聚光光学系统，其凝结激光以将聚光的激光导向工件; 旋转第一棱镜并与第一棱镜同步地旋转第二棱镜的第一驱动装置; 旋转第三棱镜并与第三棱镜同步地旋转第四棱镜的第二驱动装置; 以及控制器，其控制第一驱动装置和第二驱动装置，使得在激光转动的同时用激光照射工件。 所述控制器通过调整所述第一棱镜与所述第二棱镜之间的相对位置以及所述第三棱镜与所述第二棱镜之间的相对位置来调整包括入射位置和所述激光相对于所述工件的入射角的激光的照射条件， 第四棱镜在旋转方向上。

公开(公告)号：US09468992B2

公开(公告)日：2016-10-18

申请号：US14429527

申请日：2013-09-26

申请人： JENOPTIK Automatisierungstechnik GmbH

发明人： Stefan Vogt ,  Thomas Doering ,  Pierre Geipel ,  Robert Michel-Triller

IPC分类号： B23K26/12 ,  B23K26/70 ,  B23K37/00 ,  B23K37/04 ,  B23Q7/04 ,  B23K26/08 ,  B23K26/38

CPC分类号： B23K26/0884 ,  B23K26/0861 ,  B23K26/0876 ,  B23K26/12 ,  B23K26/38 ,  B23K26/70 ,  B23K37/00 ,  B23K37/0235 ,  B23K37/04 ,  B23K37/0443 ,  B23K2101/06 ,  B23Q7/04

摘要： A device and a method for machining workpieces (5, 6) by means of a laser beam. Said device has a delivery means (3) for delivering the workpieces (5,6) to a first machining position (8.1) and a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5,6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). At least one clamping means (9,10) is disposed in order to accommodate a workpiece (5,6) delivered by the delivery means (3), wherein respective machining position is defined by each clamping means (9,10). The machining head (2.1) can be delivered to each machining position for machining of the workpieces (5,6).

摘要翻译： 一种用于通过激光束加工工件（5,6）的装置和方法。 所述装置具有用于将工件（5,6）输送到第一加工位置（8.1）的输送装置（3）和具有用于加工工件（5）的至少一个加工头（2.1）的加工装置（2） ，6）输送到第一加工位置（8.1）。 输送装置（3）是具有夹紧装置（3.2）的夹紧机器人。 设置至少一个夹紧装置（9,10）以便容纳由输送装置（3）输送的工件（5,6），其中各个加工位置由每个夹紧装置（9,10）限定。 加工头（2.1）可以输送到每个加工位置，用于加工工件（5,6）。

公开(公告)号：US20160288255A1

公开(公告)日：2016-10-06

申请号：US15085218

申请日：2016-03-30

申请人： FANUC CORPORATION

发明人： Kazuhiro Suzuki

IPC分类号： B23K26/08 ,  B23K26/04 ,  B23K26/38

CPC分类号： B23K26/08 ,  B23K26/032 ,  B23K26/048 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/38 ,  B23K37/006 ,  B23K37/0235 ,  B23K37/0408 ,  H01S3/005 ,  H01S3/104 ,  H01S3/2232

摘要： A laser processing system able to realize both reduction of the power consumption and shortening of the cycle time. The laser processing system is provided with a laser oscillator, a laser processing machine which has a movement mechanism which makes the irradiation position of the laser light on the workpiece move, a mode switching part which switches an operation mode of the laser oscillator between a standard-standby mode and an energy saving mode, a movement controller controlling the movement mechanism so as to place the irradiation position at a process start point placed at a non-product region of the workpiece, and a switching controller controlling the mode switching part to switch the operation mode from the energy saving mode to the standard-standby mode when placing the irradiation position at the process start point.

摘要翻译： 激光处理系统能够实现功耗的降低和循环时间的缩短。 激光加工系统设置有激光振荡器，激光加工机器，其具有使激光在工件上的照射位置移动的移动机构，将激光振荡器的操作模式切换到标准 - 待机模式和节能模式，控制所述移动机构以便将所述照射位置放置在位于所述工件的非产品区域的处理开始点的移动控制器，以及控制所述模式切换部分以切换 当在处理起始点放置照射位置时从节能模式到标准待机模式的操作模式。

公开(公告)号：US20160250718A1

公开(公告)日：2016-09-01

申请号：US14768237

申请日：2014-09-03

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Kunihiro TANAHASHI ,  Kenji SARUTA ,  Yuuki TAMURA ,  Komaki SASAKI

IPC分类号： B23K26/359 ,  B23K26/082 ,  B23K26/10

CPC分类号： B23K26/359 ,  B23K26/0093 ,  B23K26/032 ,  B23K26/082 ,  B23K26/083 ,  B23K26/0876 ,  B23K26/10 ,  B23K26/355 ,  B23K26/38 ,  B23K37/0235 ,  B23K37/0408 ,  B23K37/0461

摘要： A laser machining apparatus includes: an optical-scanning laser machining device that includes a machining head, which moves in a first direction and a second direction intersecting the first direction and emits laser light on a workpiece to machine the workpiece; a first marking device that is provided on one side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; a second marking device that is provided on another side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; and a pallet on which the workpiece to be machined by the optical-scanning laser machining device is loaded and which moves in the first direction between the first marking device and the second marking device.

摘要翻译： 一种激光加工装置，包括：光扫描激光加工装置，其包括加工头，所述加工头沿与第一方向相交的第一方向和第二方向移动，并在工件上发射激光以加工所述工件; 第一标记装置，其在所述第一方向上设置在所述光学扫描激光加工装置的一侧，并且在所述工件上标记; 第二标记装置，其在第一方向上设置在光扫描激光加工装置的另一侧，并在工件上标记; 以及托盘，其上加载由光学扫描激光加工装置加工的工件，并且在第一标记装置和第二标记装置之间沿第一方向移动。

公开(公告)号：US20160249411A1

公开(公告)日：2016-08-25

申请号：US15049593

申请日：2016-02-22

申请人： FANUC CORPORATION

发明人： Kazuhiro Suzuki

IPC分类号： H05B1/02 ,  B23K26/062 ,  B23K26/042

CPC分类号： B23K26/062 ,  B23K26/042 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/38 ,  B23K37/0235 ,  B23K37/0408

摘要： A laser processing system capable of appropriately adjusting a timing to switch a laser output command with respect to the movement of an axis, and improving synchronization accuracy between the movement of the axis and a cutting position. A block remaining time of a block in execution is compared to a predetermined switching time. When the block remaining time is equal to or larger than the switching time, a laser output command of the current block is continued. On the other hand, when the block remaining time is smaller than the switching time, the laser output command to a laser oscillator is switched from the command of the current block to a command of a block subsequent to the current block.

摘要翻译： 一种激光处理系统，其能够适当地调整相对于轴的移动切换激光输出命令的定时，并且提高轴的移动和切割位置之间的同步精度。 将执行中的块的块剩余时间与预定的切换时间进行比较。 当块的剩余时间等于或大于切换时间时，继续执行当前块的激光输出命令。 另一方面，当块剩余时间小于切换时间时，激光振荡器的激光输出命令从当前块的命令切换到当前块之后的块的命令。

公开(公告)号：US20160228982A1

公开(公告)日：2016-08-11

申请号：US15029753

申请日：2014-10-09

申请人： AMADA HOLDINGS CO., LTD.

发明人： Shigeyuki HAJI ,  Taisuke HIRASAWA

IPC分类号： B23K26/00 ,  B23K26/02 ,  B23K26/70

CPC分类号： B23K26/00 ,  B23K26/02 ,  B23K26/08 ,  B23K26/38 ,  B23K26/706 ,  B23K37/0235 ,  B23K37/0408 ,  B23K2101/18

摘要： A laser processing machine includes a machine main body that has a laser processing head, a processing table on which a workpiece to be processed is laid; and a light-shielding cover that is provided above the processing table, and covers an upper surface of the processing table. The cover is transformable between a deployed state and retracted state, and can adjust an area covering the upper surface of the processing table. According to the laser processing machine, it is possible to cover only a necessary area for laser processing by its compact cover without inhibiting workability for carrying in/out the workpiece.

摘要翻译： 激光加工机包括具有激光加工头的机器主体，放置待处理工件的加工台; 以及遮光罩，其设置在处理台的上方，覆盖处理台的上表面。 盖可在展开状态和缩回状态之间变形，并且可以调整覆盖处理台的上表面的区域。 根据激光加工机，可以仅通过其紧凑的盖覆盖激光加工所需的区域，而不会妨碍用于进出工件的加工性。

公开(公告)号：US20160221118A1

公开(公告)日：2016-08-04

申请号：US14914795

申请日：2014-05-23

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Tsugumaru YAMASHITA ,  Yoshihito FUJITA ,  Kiyotaka NAKAGAWA ,  Shinnosuke OSAFUNE ,  Haruhiko NIITANI ,  Yoshikatsu SATO

IPC分类号： B23K26/00 ,  F02M61/16 ,  B23K26/382 ,  B23P23/04 ,  B23K26/08 ,  B23K26/06

CPC分类号： B23K26/0093 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/0652 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/389 ,  B23K37/0235 ,  B23P23/04 ,  F02M61/168 ,  F02M2200/8069

摘要： Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.

摘要翻译： 提供了能够以更高的精度和高速进行加工的组合加工装置和组合加工方法。 该装置具有舞台单元; 机械加工单元，包括机械加工头，所述机械加工头具有构造成加工工件的工具; 激光加工单元，其包括激光加工头，其被配置为发射用于加工所述工件的激光; 移动单元 以及控制单元，其控制每个单元的操作，其中所述激光加工头具有相对于所述工件转动激光的激光转向单元，以及聚焦光学系统，其对由所述激光旋转单元转动的激光进行聚焦，以及位置 用激光照射工件的激光转动单元旋转。

公开(公告)号：US09393638B2

公开(公告)日：2016-07-19

申请号：US14163764

申请日：2014-01-24

申请人： Plasma Automation Inc.

发明人： Matthew Walsh

IPC分类号： B23K10/00 ,  B23K37/04 ,  B23K37/02 ,  B23K26/08 ,  B23K26/38 ,  B23K26/40

CPC分类号： B23K10/00 ,  B23K26/0869 ,  B23K26/38 ,  B23K26/40 ,  B23K37/0235 ,  B23K37/0408 ,  B23K2101/16 ,  B23K2101/34 ,  B23K2101/35 ,  B23K2103/50

摘要： A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.

摘要翻译： 可以集成到HVAC线圈中并提高切割精度的全自动等离子钣金切割机减少了切割特定部件钣金零件所花费的时间，并提供了切割不同尺寸和形状的孔的灵活性， 开口 此外，由于该系统是完全自动化的，因此消除了迄今与手工劳动者相关联的切割过程的一部分所引起的误差或成本。