发明申请
- 专利标题: LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- 专利标题(中): 激光加工设备和激光加工方法
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申请号: US15104627申请日: 2014-07-30
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公开(公告)号: US20160325376A1公开(公告)日: 2016-11-10
- 发明人: Kiyotaka NAKAGAWA , Yoshihito FUJITA , Tsugumaru YAMASHITA
- 申请人: MITSUBISHI HEAVY INDUSTRIES, LTD.
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI HEAVY INDUSTRIES, LTD.
- 当前专利权人: MITSUBISHI HEAVY INDUSTRIES, LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2013-261597 20131218
- 国际申请: PCT/JP2014/070122 WO 20140730
- 主分类号: B23K26/06
- IPC分类号: B23K26/06 ; B23K26/38 ; B23K26/00
摘要:
Provided is a laser processing apparatus provided with: a first optical system including a first prism and a second prism; a second optical system including a third prism and a fourth prism; a condensing optical system that condenses laser light to guide the condensed laser light to a workpiece; a first driving device that rotates the first prism and rotates the second prism synchronously with the first prism; a second driving device that rotates the third prism and rotates the fourth prism synchronously with the third prism; and a controller that controls the first driving device and the second driving device such that the workpiece is irradiated with the laser light while the laser light turns. The controller adjusts irradiation conditions of the laser light including an incidence position and an incidence angle of the laser light with respect to the workpiece, by adjusting a relative position between the first prism and the second prism and a relative position between the third prism and the fourth prism in a rotational direction.
公开/授权文献
- US10189115B2 Laser processing apparatus and laser processing method 公开/授权日:2019-01-29
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