公开(公告)号：US09950392B2

公开(公告)日：2018-04-24

申请号：US14196727

申请日：2014-03-04

申请人： Rohr, Inc.

发明人： Sean Tiwari ,  Song Chiou

IPC分类号： B23K26/38 ,  B23K26/388 ,  B23K26/402 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K103/16 ,  B23K103/00

CPC分类号： B23K26/388 ,  B23K26/082 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/16 ,  B23K2103/50

摘要： A process is provided for forming a plurality of apertures in a fiber-reinforced composite object using a laser. The apertures include at least a first aperture and a second aperture. During the process, a scanner head of the laser is operated from a location to selectively scan a laser beam over the object to form a first portion of the first aperture and to form a first portion of the second aperture. The scanner head is also operated from the location to selectively scan the laser beam over the object to form a second portion of the first aperture and to form a second portion of the second aperture.

公开(公告)号：US20180023399A1

公开(公告)日：2018-01-25

申请号：US15550931

申请日：2016-02-17

申请人： Siemens Aktiengesellschaft

发明人： Gary B. Merrill ,  Jonathan E. Shipper, Jr. ,  Cora Hitchman

IPC分类号： F01D5/18 ,  B23H1/00 ,  B23K26/382 ,  F01D5/28 ,  B23P15/02

CPC分类号： F01D11/122 ,  B22C7/02 ,  B22C9/24 ,  B22D25/02 ,  B22D29/001 ,  B23H1/00 ,  B23K26/382 ,  B23P15/02 ,  C23C4/02 ,  C23C4/073 ,  C23C4/18 ,  C23C28/3215 ,  C23C28/3455 ,  F01D5/14 ,  F01D5/18 ,  F01D5/186 ,  F01D5/28 ,  F01D5/288 ,  F01D11/08 ,  F01D11/127 ,  F04D29/526 ,  F04D29/685 ,  F05D2230/10 ,  F05D2230/30 ,  F05D2230/90 ,  F05D2250/12 ,  F05D2250/15 ,  F05D2250/182 ,  F05D2250/183 ,  F05D2250/184 ,  F05D2250/185 ,  F05D2250/23 ,  F05D2250/282 ,  F05D2250/292 ,  F05D2250/294 ,  F05D2250/75 ,  F05D2260/202 ,  F05D2260/22141 ,  F05D2300/175 ,  F05D2300/611

摘要： Delamination of thermal barrier coatings (“TBC's”) (276) from superalloy substrates (262) of components (260) for turbine engines (80), such as engine blades (92), vanes (104, 106), or castings in transitions (85), is inhibited during subsequent cooling passage (270) formation. Partially completed cooling passages (264), which have skewed passage paths that end at a terminus (268), which is laterally offset from the passage entrance (266), are formed in the superalloy component (260) prior to application of the TBC layer(s) (276). The skewed, laterally offset path of each partially completed cooling passage (264) establishes an overhanging shield layer (269) of superalloy material that protects the TBC layer (276) during completion of the cooling passage (270).

公开(公告)号：US20170361401A1

公开(公告)日：2017-12-21

申请号：US15527124

申请日：2016-08-12

申请人： LASER ENGINEERING APPLICATIONS

发明人： Sébastien ESTIVAL ,  Paul-Etienne MARTIN ,  Axel KUPISIEWICZ

IPC分类号： B23K26/06 ,  G02B5/122 ,  B23K26/02 ,  B23K26/382 ,  B23K26/38 ,  B23K26/046 ,  G02B27/28 ,  G02B26/10

CPC分类号： B23K26/0643 ,  B23K26/02 ,  B23K26/046 ,  B23K26/082 ,  B23K26/38 ,  B23K26/382 ,  B23K26/384 ,  G02B5/122 ,  G02B26/0816 ,  G02B26/101 ,  G02B26/105 ,  G02B27/286

摘要： Machining device (100) comprising: a light source (33); an optial system (2) for obtaining a spatially offest outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro refletion system (21) able to provide a second incident light beam (8) parallel to a first refelected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).

公开(公告)号：US20170326688A1

公开(公告)日：2017-11-16

申请号：US15658944

申请日：2017-07-25

申请人： IMRA America, Inc.

发明人： Mark Turner ,  Alan Y. Arai ,  Michiharu Ota

IPC分类号： B23K26/382 ,  B23K26/142 ,  B23K26/402 ,  B23K26/0622 ,  B23K26/146 ,  B23K26/082 ,  B23K26/067 ,  B23K103/00

CPC分类号： B23K26/382 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/122 ,  B23K26/142 ,  B23K26/146 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54

摘要： The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

公开(公告)号：US09802855B2

公开(公告)日：2017-10-31

申请号：US14972352

申请日：2015-12-17

申请人： CORNING INCORPORATED

发明人： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

IPC分类号： C03B33/08 ,  B23K26/386 ,  C03C15/02 ,  C03C15/00 ,  C03C23/00 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/402 ,  G02B6/122 ,  G02B6/136 ,  B23K103/00

CPC分类号： C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

摘要： A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

公开(公告)号：US20170291850A1

公开(公告)日：2017-10-12

申请号：US15503492

申请日：2015-10-29

申请人： NIPPON ELECTRIC GLASS CO., LTD.

发明人： Masanori WADA ,  Toru HIRAO

IPC分类号： C03C23/00 ,  B23K26/122 ,  B23K26/00 ,  B23K26/382 ,  B23K26/402

CPC分类号： C03C23/0025 ,  B23K26/009 ,  B23K26/122 ,  B23K26/382 ,  B23K26/402 ,  B23K2103/54 ,  B32B3/266 ,  G02B6/36

摘要： Provided are a micro-hole array capable of accurately holding optical fibers or the like and a method for manufacturing a micro-hole array by which micro-holes having high shape accuracy can be formed. A micro-hole array has thirty or more through holes 3 formed per cm2 in a glass plate 2 with a thickness of 0.5 mm to 5 mm, both inclusive, the through holes 3 each having a cylindrical portion 5 having a cylindricity of 5% or less of a hole diameter d1 of the through hole 3.

公开(公告)号：US09782861B2

公开(公告)日：2017-10-10

申请号：US14043696

申请日：2013-10-01

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Choong-Ho Lee ,  Sung-Sik Yun ,  Tong-Jin Park ,  Doh-Hyoung Lee

IPC分类号： B23Q3/154 ,  B23K37/04 ,  B23K26/18 ,  B23K26/382 ,  B23K26/0622

CPC分类号： B23K37/0408 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/382

摘要： A metal sheet holding device for manufacturing a pattern mask used in manufacturing processes of a flat panel displays include a first holder and second holder. The first holder includes an adhesive layer contacting edge portions of a metal sheet, and a first frame supporting the metal sheet using the adhesive layer. The second holder includes a second frame below the first frame, a supported plate positioned at the center of the second frame, and an adhered unit positioned between the central portion of a metal sheet and the supported plate. The adhered unit generates an electrostatic force or a magnetic force to hold the central portion of the metal sheet.

公开(公告)号：US20170282299A1

公开(公告)日：2017-10-05

申请号：US15472636

申请日：2017-03-29

申请人： Asahi Glass Company, Limited

发明人： Motoshi ONO

IPC分类号： B23K26/382 ,  B23K26/00 ,  C03B33/08

CPC分类号： B23K26/382 ,  B23K26/402 ,  B23K2103/54

摘要： A manufacturing method for a glass substrate having a hole with a depth of d (μm) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (μsec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (μsec) satisfies t≧10×d/Pd)1/2.

公开(公告)号：US20170274477A1

公开(公告)日：2017-09-28

申请号：US15458417

申请日：2017-03-14

申请人： Messer Cutting Systems GmbH

发明人： Murat Cetin Bayram ,  Thomas Müller

IPC分类号： B23K26/38 ,  B23K26/082 ,  B23K7/00 ,  G01R25/00

CPC分类号： B23K26/38 ,  B23K7/002 ,  B23K26/0342 ,  B23K26/048 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/12 ,  G01R25/005

摘要： In known methods for through-cut detection in the thermally assisted through cutting of a workpiece, the workpiece is subjected to a first alternating signal. Starting therefrom, to indicate a method which allows a fast and accurate detection of a through-cut made, it is suggested according to the invention that the method comprises the following method steps:a) detecting a second alternating electrical signal caused by the first alternating electrical signal in a measurement electrode spaced from the workpiece,b) determining the phase shift between first and second alternating electrical signal with output of a phase shift signal,c) detecting a temporal evolution of the phase shift electrical signal or a measurement variable derived therefrom in a predetermined time interval,wherein a workpiece through-cut made is detected in that the phase shift signal or the measurement variable derived therefrom is in the time interval within a predetermined fluctuation range.

公开(公告)号：US09764426B2

公开(公告)日：2017-09-19

申请号：US14559709

申请日：2014-12-03

申请人： Microlution Inc.

发明人： Andrew Honegger ,  Andrew Phillip ,  Onik Bhattacharyya ,  Grzegorz Nowobilski ,  Brendon DiVincenzo ,  Alexander Kim ,  Michael Howard ,  Jeremy VonHatten ,  Daniel Roti

IPC分类号： B23K26/382 ,  B23K26/388 ,  B23K26/00 ,  B23K26/06 ,  B23P23/04 ,  B23K26/384

CPC分类号： B23K26/388 ,  B23K26/0093 ,  B23K26/0604 ,  B23K26/382 ,  B23K26/384 ,  B23K26/389 ,  B23P23/04 ,  Y10T408/05

摘要： The present disclosure is directed toward a machine tool configured to perform small-scale, high-accuracy drilling operations for small-hole applications. The small-hole applications for which the machine tool is designed includes holes with one or more diameters. A part may have a larger-diameter hole that penetrates through a fraction of the thickness of a part and a smaller-diameter hole that penetrates from the bottom of the larger-diameter hole through the remainder of the part thickness. Additionally, the machine tool may be used with parts in any of the following categories: (i) both the step-hole and the flow-hole are created using the machine tool; or, (ii) the step-hole is created with an up-stream process and the machine tool may accept the part, measure the step-holes and create the flow-holes; or, (iii) no step-hole is used and the machine tool may accept the part, measure the raw surface and create the flow-holes.