公开(公告)号：US08351215B2

公开(公告)日：2013-01-08

申请号：US12320523

申请日：2009-01-28

申请人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

发明人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

IPC分类号： H05K3/00

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155

摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.

摘要翻译： 芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种嵌入式芯片的印刷电路板及其制造方法。 本发明提供了一种芯片嵌入式印刷电路板，其包括嵌入在上部设置有柱的芯片的绝缘层，通过绝缘层形成的通孔，形成在要连接到柱的绝缘层的上部的上部图案， 形成在绝缘层的与通孔连接的下部的通孔和下部图案及其制造方法。

公开(公告)号：US09087837B2

公开(公告)日：2015-07-21

申请号：US13572833

申请日：2012-08-13

申请人： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

发明人： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

IPC分类号： H01L23/28 ,  H01L21/52 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/538 ,  H01L21/768 ,  H01L23/544 ,  H01L21/54 ,  H01L21/78

CPC分类号： H01L21/52 ,  H01L21/54 ,  H01L21/561 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.

摘要翻译： 这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。

公开(公告)号：US08802999B2

公开(公告)日：2014-08-12

申请号：US13478802

申请日：2012-05-23

申请人： Jong In Ryu ,  Yul Kyo Chung ,  Tae Sung Jeong

发明人： Jong In Ryu ,  Yul Kyo Chung ,  Tae Sung Jeong

IPC分类号： H05K1/09

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K2201/10477 ,  H05K2203/1461 ,  H01L2924/00

摘要： An embedded printed circuit board (PCB) includes: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate.

摘要翻译： 嵌入式印刷电路板（PCB）包括：铜箔层压板; 插入铜箔层压体中的内部电子部件; 形成在所述内部电子部件的表面上的第一电路图案; 以及形成在铜箔层叠体上的第二电路图案。

公开(公告)号：US20110083892A1

公开(公告)日：2011-04-14

申请号：US12631578

申请日：2009-12-04

申请人： Hong Bok WE ,  Tae Sung Jeong ,  Dae Jun Kim

发明人： Hong Bok WE ,  Tae Sung Jeong ,  Dae Jun Kim

IPC分类号： H05K1/18 ,  C23C14/48

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/005 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0108 ,  H01L2924/00

摘要： Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板，其包括绝缘基底，形成在绝缘基底的一个表面上的绝缘层，嵌入在绝缘层中的电子部件，使得电子部件的有源表面具有连接端子 面对绝缘基底，形成在绝缘基底中以暴露连接端子的沟槽以及形成并嵌入沟槽中的连接图案，并且其中嵌入式连接图案通过压印过程精细地形成并连接到连接端子 的电子元件，从而避免需要额外的再分配层并降低制造成本。 还提供了制造这种印刷电路板的方法。

公开(公告)号：US20100078204A1

公开(公告)日：2010-04-01

申请号：US12320012

申请日：2009-01-14

申请人： Hong Bok We ,  Tae Sung Jeong

发明人： Hong Bok We ,  Tae Sung Jeong

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/30

CPC分类号： H05K1/188 ,  H01L24/18 ,  H01L2224/2518 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K1/189 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/1469 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board including an electronic component embedded therein and a method of manufacturing the printed circuit board. The electronic component is disposed in a cavity of a resin layer including circuit layers formed on both sides thereof. The resin layer, the electronic component and the circuit layers are attached to each other via adhesive layers disposed therebetween. The printed circuit board is manufactured by a compression process, thus shortening a production time and simplifying a manufacturing process.

摘要翻译： 这里公开了一种包括嵌入其中的电子部件的印刷电路板和制造印刷电路板的方法。 电子部件设置在包括形成在其两侧的电路层的树脂层的空腔中。 树脂层，电子部件和电路层通过设置在其间的粘合层彼此附接。 印刷电路板通过压缩工艺制造，从而缩短生产时间并简化制造过程。

公开(公告)号：US20130320516A1

公开(公告)日：2013-12-05

申请号：US13572833

申请日：2012-08-13

申请人： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

发明人： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

IPC分类号： H01L21/52 ,  H01L21/54 ,  H01L23/24 ,  H01L21/60 ,  H01L23/498 ,  H01L23/055

CPC分类号： H01L21/52 ,  H01L21/54 ,  H01L21/561 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.

摘要翻译： 这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。

公开(公告)号：US20100142170A1

公开(公告)日：2010-06-10

申请号：US12320492

申请日：2009-01-27

申请人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

发明人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/18 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01078 ,  H05K3/426 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/1461 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49165

摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.

摘要翻译： 芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种芯片嵌入式印刷电路板及其制造方法，其特征在于，提供一种芯片嵌入式印刷电路板，其具备：具有通孔形成的绝缘层; 嵌入绝缘层中的第一芯片和第二芯片，并且在其一个表面上分别暴露于绝缘层的上表面和下表面的焊盘; 形成在绝缘层的上表面上以连接到第一芯片的焊盘和通孔的上部图案; 以及形成在绝缘层的下表面上以连接到第二芯片的焊盘和通孔的下图案。 另外，本发明提供一种嵌入式芯片的印刷电路板的制造方法。

公开(公告)号：US20100134991A1

公开(公告)日：2010-06-03

申请号：US12320523

申请日：2009-01-28

申请人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

发明人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155

摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The prevent invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.

摘要翻译： 芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种嵌入式芯片的印刷电路板及其制造方法。 本发明提供了一种芯片嵌入式印刷电路板，其包括：绝缘层，其嵌入在上部设置有柱的芯片，通过绝缘层形成的通孔，形成在要连接到柱的绝缘层的上部的上部图案;以及 形成在绝缘层的与通孔连接的下部的通孔和下部图案及其制造方法。

公开(公告)号：US6060778A

公开(公告)日：2000-05-09

申请号：US60981

申请日：1998-04-15

申请人： Tae Sung Jeong ,  Ki Tae Ryu ,  Tae Keun Lee ,  Keun Hyoung Choi ,  Han Shin Youn ,  Jum Sook Park

发明人： Tae Sung Jeong ,  Ki Tae Ryu ,  Tae Keun Lee ,  Keun Hyoung Choi ,  Han Shin Youn ,  Jum Sook Park

IPC分类号： H01L23/28 ,  H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L23/36 ,  H01L23/10 ,  H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/36 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/20753 ,  H01L2924/3025

摘要： Disclosed is a packaged integrated circuit device with high heat dissipation performance and low weight. The packaged integrated circuit device includes an interconnection substrate having at least one layer of conductive trace material and at least one layer of insulating material and also having a first surface and a second surface disposed opposite to the first surface and having a plurality of electrical contacts formed on the second surface. At least one metal thermal conductive layer having a first surface is attached on the first surface of the interconnection substrate and having a second surface exposed to an exterior. A through hole region is formed in the interconnection substrate and the thermal conductive layer. An integrated circuit chip having a first surface exposed to an exterior and having also a second surface with a plurality of bond pads, opposite to the first surface of the integrated circuit chip, is placed within the through hole region. A plurality of bond wires make an electrical connection of the bond pads with the conductive trace layers. The bond wires and the integrated circuit chip are enclosed with an insulating encapsulant material. The through hole region is also filled with the insulating encapsulant material.

摘要翻译： 公开了一种具有高散热性能和低重量的封装集成电路器件。 封装的集成电路器件包括互连衬底，其具有至少一层导电迹线材料和至少一层绝缘材料，并且还具有与第一表面相对设置的第一表面和第二表面，并且具有形成的多个电触头 在第二个表面。 具有第一表面的至少一个金属导热层附着在互连基板的第一表面上并具有暴露于外部的第二表面。 在互连基板和导热层中形成通孔区域。 集成电路芯片具有暴露于外部的第一表面，并且具有与集成电路芯片的第一表面相对的多个接合焊盘的第二表面放置在通孔区域内。 多个接合线使接合焊盘与导电迹线层电连接。 接合线和集成电路芯片用绝缘密封材料封装。 通孔区域也填充有绝缘密封剂材料。