知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

26 records (took 0.018 seconds)

    Semiconductor apparatus, solid-state image sensing apparatus, and camera system
    11.
    发明授权
    Semiconductor apparatus, solid-state image sensing apparatus, and camera system 有权

    公开(公告)号：US10554912B2

    公开(公告)日：2020-02-04

    申请号：US15800744

    申请日：2017-11-01

    Applicant: Sony Corporation

    Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

    IPC: H04N5/363 ,  H04M1/56 ,  H04N5/359 ,  H01L27/146 ,  H03M1/56 ,  H03M1/08 ,  H03M1/12 ,  H04N5/378 ,  H04N5/225 ,  H04N5/374 ,  H04N5/3745

    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

    Solid state imaging apparatus, electronic apparatus, and pixel reading method
    13.
    发明授权
    Solid state imaging apparatus, electronic apparatus, and pixel reading method 有权
    固态成像装置，电子装置和像素读取方法

    公开(公告)号：US09131175B2

    公开(公告)日：2015-09-08

    申请号：US13926613

    申请日：2013-06-25

    Applicant: Sony Corporation

    Inventor： Kenya Kondou ,  Haruhisa Naganokawa ,  Daijiro Anai ,  Makoto Aoki ,  Syouhei Taguchi ,  Ken Koseki ,  Nobuo Nakamura

    IPC: H04N5/369

    CPC classification number: H04N5/3696

    Abstract: There is provided a solid state imaging apparatus, including a plurality of line sensors including a plurality of pixels arrayed in a line, each of the pixels including an amplifier which amplifies a signal corresponding to a charge accumulated in a photoelectric transducer, and signal lines each for reading a signal of each pixel of the line sensors. The plurality of line sensors are discretely arranged, and the signal lines are gathered and wired along a region in which a circuit block including the line sensors is arranged.

    Abstract translation: 提供了一种固态成像装置，其包括多个线阵列传感器，其包括排列成一行的多个像素，每个像素包括放大器，该放大器放大对应于在光电转换器中累积的电荷的信号，以及各信号线 用于读取线传感器的每个像素的信号。 多个线传感器被离散地布置，并且信号线沿着布置有包括线传感器的电路块的区域聚集和布线。

    SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM
    14.
    发明申请
    SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 有权
    半导体设备，固态图像感应装置和相机系统

    公开(公告)号：US20140232916A1

    公开(公告)日：2014-08-21

    申请号：US14348722

    申请日：2012-10-10

    Applicant: SONY CORPORATION

    Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

    IPC: H04N5/378 ,  H04N5/359

    CPC classification number: H04N5/363 ,  H01L27/14612 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L2924/0002 ,  H03M1/08 ,  H03M1/0863 ,  H03M1/123 ,  H03M1/56 ,  H04N5/2253 ,  H04N5/359 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378 ,  H01L2924/00

    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. A first chip and a second chip are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip having a function of sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and a function of quantizing the sampled signals to obtain digital signals.

    Abstract translation: 一种半导体装置，固态图像感测装置和能够减少通过相邻通孔传播的信号之间的干扰的照相机系统，防止了通孔数量的增加，减少了具有传感器的芯片的面积和 其安装步骤的数量。 第一芯片和第二芯片被结合在一起以形成层叠结构，第一芯片和第二芯片之间的布线通过通孔连接，第一芯片通过时间离散由各个传感器产生的模拟信号获得的信号到 第二芯片通过对应的通孔，第二芯片具有在与第一芯片对信号采样的定时不同的定时通过通孔对从第一芯片发送的信号进行采样的功能，以及量化 采样信号以获得数字信号。

    SOLID STATE IMAGING APPARATUS, ELECTRONIC APPARATUS, AND PIXEL READING METHOD
    15.
    发明申请
    SOLID STATE IMAGING APPARATUS, ELECTRONIC APPARATUS, AND PIXEL READING METHOD 有权
    固态成像装置，电子装置和像素读取方法

    公开(公告)号：US20140009657A1

    公开(公告)日：2014-01-09

    申请号：US13926613

    申请日：2013-06-25

    Applicant: Sony Corporation

    Inventor： Kenya Kondou ,  Haruhisa Naganokawa ,  Daijiro Anai ,  Makoto Aoki ,  Syouhei Taguchi ,  Ken Koseki ,  Nobuo Nakamura

    IPC: H04N5/369

    CPC classification number: H04N5/3696

    Abstract: There is provided a solid state imaging apparatus, including a plurality of line sensors including a plurality of pixels arrayed in a line, each of the pixels including an amplifier which amplifies a signal corresponding to a charge accumulated in a photoelectric transducer, and signal lines each for reading a signal of each pixel of the line sensors. The plurality of line sensors are discretely arranged, and the signal lines are gathered and wired along a region in which a circuit block including the line sensors is arranged.

    Abstract translation: 提供了一种固态成像装置，其包括多个线阵列传感器，其包括排列成一行的多个像素，每个像素包括放大器，该放大器放大对应于在光电转换器中累积的电荷的信号，以及各信号线 用于读取线传感器的每个像素的信号。 多个线传感器被离散地布置，并且信号线沿着布置有包括线传感器的电路块的区域聚集和布线。

Patent Agency Ranking