公开(公告)号：US10027912B2

公开(公告)日：2018-07-17

申请号：US15414019

申请日：2017-01-24

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H04N5/363 ,  H03M1/56 ,  H03M1/08 ,  H03M1/12 ,  H04N5/359 ,  H04N5/378 ,  H04N5/225 ,  H04N5/374 ,  H04N5/3745 ,  H01L27/146

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

公开(公告)号：US20170171487A1

公开(公告)日：2017-06-15

申请号：US15442566

申请日：2017-02-24

Applicant: Sony Corporation

Inventor： Hayato Wakabayashi ,  Yoshiaki Inada ,  Ken Koseki

IPC: H04N5/378 ,  H04N5/361 ,  H04N5/357 ,  H04N5/3745 ,  H04N5/365

CPC classification number: H04N5/378 ,  H04N5/335 ,  H04N5/3575 ,  H04N5/361 ,  H04N5/3655 ,  H04N5/3658 ,  H04N5/3745 ,  H04N5/37455

Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.

公开(公告)号：US20160227145A1

公开(公告)日：2016-08-04

申请号：US15078984

申请日：2016-03-23

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H04N5/378 ,  H01L27/146 ,  H04N5/225

CPC classification number: H04N5/363 ,  H01L27/14612 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L2924/0002 ,  H03M1/08 ,  H03M1/0863 ,  H03M1/123 ,  H03M1/56 ,  H04N5/2253 ,  H04N5/359 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378 ,  H01L2924/00

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

Abstract translation: 一种半导体装置，固态图像感测装置和能够减少通过相邻通孔传播的信号之间的干扰的照相机系统，防止了通孔数量的增加，减少了具有传感器的芯片的面积和 其安装步骤的数量。 第一芯片和第二芯片被结合在一起以形成层叠结构，第一芯片和第二芯片之间的布线通过通孔连接，第一芯片通过时间离散由各个传感器产生的模拟信号获得的信号到第二芯片 对应的通孔，第二芯片在与第一芯片对信号进行采样的定时不同的定时对通过通孔的第一芯片发送的信号进行采样，并量化采样信号以获得数字信号。

公开(公告)号：US09350929B2

公开(公告)日：2016-05-24

申请号：US14348722

申请日：2012-10-10

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H04N5/374 ,  H04N5/378 ,  H03M1/08 ,  H04N5/359 ,  H03M1/56 ,  H03M1/12 ,  H01L27/146

CPC classification number: H04N5/363 ,  H01L27/14612 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L2924/0002 ,  H03M1/08 ,  H03M1/0863 ,  H03M1/123 ,  H03M1/56 ,  H04N5/2253 ,  H04N5/359 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378 ,  H01L2924/00

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. A first chip and a second chip are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip having a function of sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and a function of quantizing the sampled signals to obtain digital signals.

Abstract translation: 一种半导体装置，固态图像感测装置和能够减少通过相邻通孔传播的信号之间的干扰的照相机系统，防止了通孔数量的增加，减少了具有传感器的芯片的面积和 其安装步骤的数量。 第一芯片和第二芯片被结合在一起以形成层叠结构，第一芯片和第二芯片之间的布线通过通孔连接，第一芯片通过时间离散由各个传感器产生的模拟信号获得的信号到 第二芯片通过对应的通孔，第二芯片具有在与第一芯片对信号采样的定时不同的定时通过通孔对从第一芯片发送的信号进行采样的功能，以及量化 采样信号以获得数字信号。

公开(公告)号：US10200642B2

公开(公告)日：2019-02-05

申请号：US15562079

申请日：2016-03-01

Applicant: Sony Corporation ,  ROHM CO., LTD.

Inventor： Takahiro Akahane ,  Ken Koseki ,  Kenichi Shigenami ,  Go Asayama ,  Rei Takamori ,  Tatsuya Ninomiya ,  Masato Nishinouchi ,  Masanori Onodera ,  Tatsuro Shimizu

IPC: H04N5/357 ,  G02B7/04 ,  H04N5/232 ,  H04N5/378 ,  H04N5/217 ,  H04N5/376

Abstract: A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.

公开(公告)号：US20180255259A1

公开(公告)日：2018-09-06

申请号：US15969372

申请日：2018-05-02

Applicant: Sony Corporation

Inventor： Hayato Wakabayashi ,  Yoshiaki Inada ,  Ken Koseki

IPC: H04N5/378 ,  H04N5/365 ,  H04N5/361 ,  H04N5/3745 ,  H04N5/357

CPC classification number: H04N5/378 ,  H04N5/335 ,  H04N5/3575 ,  H04N5/361 ,  H04N5/3655 ,  H04N5/3658 ,  H04N5/3745 ,  H04N5/37455

Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.

公开(公告)号：US20180124340A1

公开(公告)日：2018-05-03

申请号：US15800744

申请日：2017-11-01

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H04N5/363 ,  H04N5/378 ,  H01L27/146 ,  H04N5/374 ,  H04N5/359 ,  H04N5/225 ,  H03M1/56 ,  H03M1/12 ,  H03M1/08 ,  H04N5/3745

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

公开(公告)号：US20170288691A1

公开(公告)日：2017-10-05

申请号：US15630608

申请日：2017-06-22

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H03M1/56 ,  H03M1/12 ,  H03M1/08

CPC classification number: H04N5/363 ,  H01L27/14612 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L2924/0002 ,  H03M1/08 ,  H03M1/0863 ,  H03M1/123 ,  H03M1/56 ,  H04N5/2253 ,  H04N5/359 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378 ,  H01L2924/00

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

公开(公告)号：US09654708B2

公开(公告)日：2017-05-16

申请号：US15264272

申请日：2016-09-13

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H04N5/363 ,  H04N5/378 ,  H04N5/374 ,  H01L27/146

CPC classification number: H04N5/363 ,  H01L27/14612 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L2924/0002 ,  H03M1/08 ,  H03M1/0863 ,  H03M1/123 ,  H03M1/56 ,  H04N5/2253 ,  H04N5/359 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378 ,  H01L2924/00

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

公开(公告)号：US20170134679A1

公开(公告)日：2017-05-11

申请号：US15414028

申请日：2017-01-24

Applicant: Sony Corporation

Inventor： Toshiaki Nagai ,  Ken Koseki ,  Yosuke Ueno ,  Atsushi Suzuki

IPC: H04N5/363 ,  H04N5/378 ,  H03M1/08 ,  H03M1/56 ,  H01L27/146 ,  H04N5/3745 ,  H03M1/12

CPC classification number: H04N5/363 ,  H01L27/14612 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L2924/0002 ,  H03M1/08 ,  H03M1/0863 ,  H03M1/123 ,  H03M1/56 ,  H04N5/2253 ,  H04N5/359 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378 ,  H01L2924/00

Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.