公开(公告)号：US10432884B2

公开(公告)日：2019-10-01

申请号：US15987363

申请日：2018-05-23

Applicant: SONY CORPORATION

Inventor： Atsumi Niwa ,  Yosuke Ueno ,  Shimon Teshima ,  Daijiro Anai ,  Yoshinobu Furusawa ,  Taishin Yoshida ,  Takahiro Uchimura ,  Eiji Hirata

IPC: H04N5/374 ,  H01L27/146 ,  H04N5/378 ,  H04N5/3745 ,  H04N9/04 ,  H03M1/12 ,  H03M1/56

Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

公开(公告)号：US10021335B2

公开(公告)日：2018-07-10

申请号：US15313645

申请日：2015-05-21

Applicant: SONY CORPORATION

Inventor： Atsumi Niwa ,  Yosuke Ueno ,  Shimon Teshima ,  Daijiro Anai ,  Yoshinobu Furusawa ,  Taishin Yoshida ,  Takahiro Uchimura ,  Eiji Hirata

IPC: H04N5/378 ,  H04N5/374 ,  H01L27/146 ,  H04N5/3745 ,  H04N9/04

CPC classification number: H04N5/378 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14636 ,  H01L27/14645 ,  H03M1/123 ,  H03M1/1295 ,  H03M1/56 ,  H04N5/37455 ,  H04N5/37457 ,  H04N9/045 ,  H04N2209/045

Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

公开(公告)号：US11483509B2

公开(公告)日：2022-10-25

申请号：US17119084

申请日：2020-12-11

Applicant: SONY CORPORATION

Inventor： Atsumi Niwa ,  Yosuke Ueno ,  Shimon Teshima ,  Daijiro Anai ,  Yoshinobu Furusawa ,  Taishin Yoshida ,  Takahiro Uchimura ,  Eiji Hirata

IPC: H04N5/378 ,  H04N5/369 ,  H04N5/374 ,  H04N9/04 ,  H01L27/146 ,  H04N5/3745 ,  H03M1/12 ,  H03M1/56

Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

公开(公告)号：US10348987B2

公开(公告)日：2019-07-09

申请号：US16007542

申请日：2018-06-13

Applicant: SONY CORPORATION

Inventor： Yusuke Ikeda ,  Daijiro Anai ,  Rei Yoshikawa

IPC: H04N5/363 ,  H04N5/357 ,  H04N5/378 ,  H04N5/374 ,  H01L27/146

Abstract: The present disclosure relates to a solid-state imaging device, an AD converter, and an electronic apparatus that improve a crosstalk characteristic. The AD converter includes a comparator that compares the pixel signal with the reference signal, a pixel signal side capacitor, and a reference signal side capacitor. The pixel signal side capacitor and the reference signal side capacitor are formed such that a first parasitic capacity and a second parasitic capacity are substantially the same. The present technology is applicable to a CMOS image sensor, for example.

公开(公告)号：US10044954B2

公开(公告)日：2018-08-07

申请号：US15326542

申请日：2015-07-10

Applicant: SONY CORPORATION

Inventor： Yusuke Ikeda ,  Daijiro Anai ,  Rei Yoshikawa

IPC: H04N5/363 ,  H04N5/378 ,  H01L27/146

Abstract: The present disclosure relates to a solid-state imaging device, an AD converter, and an electronic apparatus that improve a crosstalk characteristic. The AD converter includes a comparator that compares the pixel signal with the reference signal, a pixel signal side capacitor, and a reference signal side capacitor. The pixel signal side capacitor and the reference signal side capacitor are formed such that a first parasitic capacity, and a second parasitic capacity are substantially the same. The present technology is applicable to a CMOS image sensor, for example.

公开(公告)号：US10911707B2

公开(公告)日：2021-02-02

申请号：US16840077

申请日：2020-04-03

Applicant: SONY CORPORATION

Inventor： Atsumi Niwa ,  Yosuke Ueno ,  Shimon Teshima ,  Daijiro Anai ,  Yoshinobu Furusawa ,  Taishin Yoshida ,  Takahiro Uchimura ,  Eiji Hirata

IPC: H04N5/378 ,  H04N5/374 ,  H04N9/04 ,  H01L27/146 ,  H03M1/12 ,  H03M1/56 ,  H04N5/369 ,  H04N5/3745

Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

公开(公告)号：US10659716B2

公开(公告)日：2020-05-19

申请号：US16559795

申请日：2019-09-04

Applicant: SONY CORPORATION

Inventor： Atsumi Niwa ,  Yosuke Ueno ,  Shimon Teshima ,  Daijiro Anai ,  Yoshinobu Furusawa ,  Taishin Yoshida ,  Takahiro Uchimura ,  Eiji Hirata

IPC: H04N5/378 ,  H04N5/374 ,  H04N9/04 ,  H01L27/146 ,  H04N5/3745

Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

公开(公告)号：US09131175B2

公开(公告)日：2015-09-08

申请号：US13926613

申请日：2013-06-25

Applicant: Sony Corporation

Inventor： Kenya Kondou ,  Haruhisa Naganokawa ,  Daijiro Anai ,  Makoto Aoki ,  Syouhei Taguchi ,  Ken Koseki ,  Nobuo Nakamura

IPC: H04N5/369

CPC classification number: H04N5/3696

Abstract: There is provided a solid state imaging apparatus, including a plurality of line sensors including a plurality of pixels arrayed in a line, each of the pixels including an amplifier which amplifies a signal corresponding to a charge accumulated in a photoelectric transducer, and signal lines each for reading a signal of each pixel of the line sensors. The plurality of line sensors are discretely arranged, and the signal lines are gathered and wired along a region in which a circuit block including the line sensors is arranged.

Abstract translation: 提供了一种固态成像装置，其包括多个线阵列传感器，其包括排列成一行的多个像素，每个像素包括放大器，该放大器放大对应于在光电转换器中累积的电荷的信号，以及各信号线 用于读取线传感器的每个像素的信号。 多个线传感器被离散地布置，并且信号线沿着布置有包括线传感器的电路块的区域聚集和布线。

公开(公告)号：US20140009657A1

公开(公告)日：2014-01-09

申请号：US13926613

申请日：2013-06-25

Applicant: Sony Corporation

Inventor： Kenya Kondou ,  Haruhisa Naganokawa ,  Daijiro Anai ,  Makoto Aoki ,  Syouhei Taguchi ,  Ken Koseki ,  Nobuo Nakamura

IPC: H04N5/369

CPC classification number: H04N5/3696

Abstract: There is provided a solid state imaging apparatus, including a plurality of line sensors including a plurality of pixels arrayed in a line, each of the pixels including an amplifier which amplifies a signal corresponding to a charge accumulated in a photoelectric transducer, and signal lines each for reading a signal of each pixel of the line sensors. The plurality of line sensors are discretely arranged, and the signal lines are gathered and wired along a region in which a circuit block including the line sensors is arranged.

Abstract translation: 提供了一种固态成像装置，其包括多个线阵列传感器，其包括排列成一行的多个像素，每个像素包括放大器，该放大器放大对应于在光电转换器中累积的电荷的信号，以及各信号线 用于读取线传感器的每个像素的信号。 多个线传感器被离散地布置，并且信号线沿着布置有包括线传感器的电路块的区域聚集和布线。