Semiconductor device
    11.
    发明授权

    公开(公告)号:US12113109B2

    公开(公告)日:2024-10-08

    申请号:US17313638

    申请日:2021-05-06

    CPC classification number: H01L29/41791 H01L27/0924

    Abstract: A semiconductor device includes a first active (e.g., PMOSFET) region and an adjacent second active (e.g., NMOSFET) region on a substrate, a device isolation layer on the substrate and defining a first active pattern on the first active region and a second active pattern on the second active region, a gate electrode crossing the first and second active patterns, a first source/drain pattern and a second source/drain pattern adjacent to a side of the gate electrode, an interlayer insulating layer on the gate electrode, a first active contact penetrating the interlayer insulating layer to connect the first source/drain pattern and a second active contact penetrating the interlayer insulating layer to connect the second source/drain pattern and a buffer layer provided in an upper region of the interlayer insulating layer and interposed between the first active contact and the second active contact, wherein the buffer layer includes a material having etch selectivity with respect to the interlayer insulating layer.

    Integrated circuit devices and methods of manufacturing the same

    公开(公告)号:US11646316B2

    公开(公告)日:2023-05-09

    申请号:US17700590

    申请日:2022-03-22

    CPC classification number: H01L27/0924 H01L29/6656 H01L29/7851

    Abstract: Integrated circuit devices may include a fin-type active region extending on a substrate in a first horizontal direction, a gate line extending on the fin-type active region in a second horizontal direction, a source/drain region on the fin-type active region and adjacent to the gate line, and a source/drain contact pattern connected to the source/drain region. The source/drain contact pattern may include a first portion and a second portion, the first portion having a first height, and the second portion having a second height less than the first height. The source/drain contact pattern may include a metal plug in the first and second portions and a conductive barrier film on sidewalls of the metal plug in the first and second portions. A first top surface of the conductive barrier film in the second portion is lower than a top surface of the metal plug in the second portion.

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