公开(公告)号：US20230128492A1

公开(公告)日：2023-04-27

申请号：US18049732

申请日：2022-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkeun CHO ,  Hee Young Park ,  Jin Hyung Park ,  Kun Tack Lee ,  Jung Hyuk Jang ,  Chun Hyung Chung

IPC: H01L27/108

Abstract: There is provided a semiconductor memory device capable of improving the performance and/or the reliability of a device. The semiconductor memory device includes a substrate having a cell area and a peripheral area defined along a periphery of the cell area, wherein the cell area includes an active area defined by a cell element separation film, a cell area separation film in the substrate and defining the cell area, and a plurality of storage contacts connected to the active area, and arranged along a first direction. The plurality of storage contacts includes a first storage contact, a second storage contact, and a third storage contact, wherein the second storage contact is between the first storage contact and the third storage contact, each of the first storage contact and the third storage contact contains or surrounds or defines an airgap, and the second storage contact is free of an airgap.

公开(公告)号：US12042828B2

公开(公告)日：2024-07-23

申请号：US18299279

申请日：2023-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Min Shin ,  Hun Jae Jang ,  Seok Hoon Kim ,  Young-Hoo Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC: B08B7/00 ,  B08B3/10 ,  H01L21/311 ,  H01L21/67 ,  H01L21/687

CPC classification number: B08B7/0042 ,  B08B3/10 ,  B08B7/0064 ,  H01L21/31111 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67098 ,  H01L21/67248 ,  H01L21/68764

Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

公开(公告)号：US11862457B2

公开(公告)日：2024-01-02

申请号：US18098330

申请日：2023-01-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： SeongKeun Cho ,  Young Hoo Kim ,  Seung Min Shin ,  Tae Min Earmme ,  Kun Tack Lee ,  Hun Jae Jang ,  Eun Hee Jeang

IPC: H01L21/02 ,  B08B3/08 ,  H01L21/428 ,  H01L21/687

CPC classification number: H01L21/02057 ,  B08B3/08 ,  H01L21/428 ,  H01L21/68764

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

公开(公告)号：US20230249230A1

公开(公告)日：2023-08-10

申请号：US18299279

申请日：2023-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Min SHIN ,  Hun Jae Jang ,  Seok Hoon Kim ,  Young-Hoo Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC: B08B7/00 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/311

CPC classification number: B08B7/0042 ,  B08B3/10 ,  B08B7/0064 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/31111 ,  H01L21/67098

Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

公开(公告)号：US10435234B2

公开(公告)日：2019-10-08

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Choi

IPC: B05B5/025 ,  B05C11/10 ,  B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  H01L21/67 ,  C08F14/26 ,  C08K3/04 ,  C08F14/22

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.

公开(公告)号：US20180334318A1

公开(公告)日：2018-11-22

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Jun

IPC: B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  C08F14/22 ,  C08F14/26 ,  C08K3/04 ,  H01L21/67

CPC classification number: B65D85/70 ,  B05B5/025 ,  B05C11/10 ,  B65D90/46 ,  C08F14/22 ,  C08F14/26 ,  C08G2261/1424 ,  C08G2261/312 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/3422 ,  C08G2261/51 ,  C08K3/041 ,  C08K3/042 ,  C08L27/20 ,  C08L65/00 ,  C09D5/24 ,  G01R29/24 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67253

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.