公开(公告)号：US12046464B2

公开(公告)日：2024-07-23

申请号：US17719561

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ga Young Song ,  Mi Hyun Park ,  Jong Kyoung Park ,  Jung Youl Lee ,  Hyun Jin Kim ,  Hyo San Lee ,  Han Sol Lim ,  Hoon Han

IPC: C11D1/00 ,  C11D3/20 ,  C11D3/37 ,  H01L21/02

CPC classification number: H01L21/02041 ,  C11D3/2003 ,  C11D3/2079 ,  C11D3/3749

Abstract: A substrate cleaning composition, a method of cleaning a substrate using the same, and a method of fabricating a semiconductor device using the same, the substrate cleaning composition including a styrene copolymer including a first repeating unit represented by Formula 1-1a and a second repeating unit represented by Formula 1-1b; an additive represented by Formula 2-1; and an alcoholic solvent having a solubility of 500 g/L or less in deionized water,

公开(公告)号：US11149234B2

公开(公告)日：2021-10-19

申请号：US16250069

申请日：2019-01-17

Applicant: Samsung Electronics Co., Ltd. ,  SEMES Co., Ltd.

Inventor： Mi Hyun Park ,  Jung-Min Oh ,  Young-Hoo Kim ,  Hyo San Lee ,  Tae Keun Kim ,  Ye Rim Yeon ,  Hae Rim Oh ,  Ji Soo Jeong ,  Min Hee Cho

IPC: B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  C11D17/00 ,  C11D3/28 ,  C11D3/20 ,  C11D3/34 ,  C11D3/32 ,  C11D1/14 ,  C11D1/12 ,  C11D1/29

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.

公开(公告)号：US10435234B2

公开(公告)日：2019-10-08

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Choi

IPC: B05B5/025 ,  B05C11/10 ,  B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  H01L21/67 ,  C08F14/26 ,  C08K3/04 ,  C08F14/22

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.

公开(公告)号：US20180334318A1

公开(公告)日：2018-11-22

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Jun

IPC: B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  C08F14/22 ,  C08F14/26 ,  C08K3/04 ,  H01L21/67

CPC classification number: B65D85/70 ,  B05B5/025 ,  B05C11/10 ,  B65D90/46 ,  C08F14/22 ,  C08F14/26 ,  C08G2261/1424 ,  C08G2261/312 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/3422 ,  C08G2261/51 ,  C08K3/041 ,  C08K3/042 ,  C08L27/20 ,  C08L65/00 ,  C09D5/24 ,  G01R29/24 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67253

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.