公开(公告)号：US10081862B2

公开(公告)日：2018-09-25

申请号：US14012916

申请日：2013-08-28

Applicant: Samsung Display Co., Ltd.

Inventor： Sun-Ho Kim ,  Myung-Soo Huh ,  Jeong-Ho Yi ,  Cheol-Rae Jo ,  Hyun-Woo Joo ,  Yong-Suk Lee

IPC: C23C14/24 ,  C23C14/56 ,  C23C16/44 ,  H01L21/56 ,  H01L51/00

CPC classification number: C23C14/564 ,  C23C14/24 ,  C23C16/4412 ,  H01L21/56 ,  H01L51/0008

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

公开(公告)号：US09932672B2

公开(公告)日：2018-04-03

申请号：US14590491

申请日：2015-01-06

Applicant: Samsung Display Co., Ltd.

Inventor： Choel-Min Jang ,  Myung-Soo Huh ,  Jeong-Ho Yi ,  Cheol-Rae Jo ,  Sang-Joon Seo ,  Seung-Hun Kim ,  Jin-Kwang Kim

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/46

CPC classification number: C23C16/46 ,  C23C16/45551 ,  C23C16/45563 ,  C23C16/4583

Abstract: A vapor deposition apparatus includes a stage on which a substrate is mounted; a heater unit that is disposed at a side of the stage and includes a first heater and a second heater, wherein the first heater and the second heater are movable so that the first heater and the second heater are spaced apart from each other or are disposed adjacent to each other; and a nozzle unit that is disposed at a side opposite to the side at which the heater unit is disposed about the stage and includes one or more nozzles.

公开(公告)号：US09853192B2

公开(公告)日：2017-12-26

申请号：US13973954

申请日：2013-08-22

Applicant: Samsung Display Co., Ltd.

Inventor： Myung-Soo Huh ,  Jeong-Ho Yi ,  Yong-Suk Lee

IPC: H01L33/52 ,  H01L51/52 ,  H01L51/56 ,  H01L21/67 ,  B05D1/00

CPC classification number: H01L33/52 ,  B05D1/60 ,  B05D1/62 ,  H01L21/67207 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/56

Abstract: An apparatus and method for manufacturing a thin film encapsulation includes: a first cluster configured to form a first inorganic layer on a display substrate using a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the display substrate using a monomer deposition process; and a third cluster configured to form a second inorganic layer on the first organic layer on the display substrate using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.

公开(公告)号：US20170016109A1

公开(公告)日：2017-01-19

申请号：US15277977

申请日：2016-09-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yong-Suk Lee ,  Myung-Soo Huh ,  Cheol-Rae Jo ,  Sang-Hyuk Hong ,  Jeong-Ho Yi ,  Suk-Won Jung ,  Sun-Ho Kim ,  Mi-Ra An

IPC: C23C14/12 ,  C23C14/58 ,  C23C14/24 ,  C23C14/22

CPC classification number: C23C14/12 ,  C23C14/228 ,  C23C14/246 ,  C23C14/58 ,  C23C14/584

Abstract: A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.

Abstract translation: 一种薄膜沉积设备和使用该设备的薄膜沉积方法。 该薄膜沉积设备包括：一个被配置为具有安装在其中的基板的腔室;喷射单元，被配置为在腔室中移动并将沉积蒸气喷射到基底;以及源供应单元，其构造成将沉积蒸气源供应到 喷射单元。

公开(公告)号：US20150368790A1

公开(公告)日：2015-12-24

申请号：US14839035

申请日：2015-08-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Myung-Soo Huh ,  Tae-Seung Yoon ,  Jeong-Ho Yi

IPC: C23C14/34 ,  C23C16/04

CPC classification number: C23C14/34 ,  C23C14/541 ,  C23C14/568 ,  C23C16/042 ,  C23C16/463 ,  C23C16/54 ,  H01L51/001 ,  H01L51/5253 ,  H01L51/56

Abstract: A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.

Abstract translation: 一种薄膜封装制造装置，包括：第一簇，被配置为通过溅射工艺在其上形成发光单元的第一基板上形成第一无机层; 第二簇，被配置为通过有机沉积工艺从所述第一簇输送的所述第一基板上的所述第一无机层上形成第一有机层; 第一连接模块，被配置为连接所述第一集群和所述第二集群，所述第一连接模块被配置为将其上形成有所述第一无机层的所述第一基板从所述第一集群传送到所述第二集群，并且被配置为以非接触方式冷却所述第一衬底 方式; 以及第三簇，其被配置为通过化学气相沉积（CVD）工艺或等离子体增强化学气相沉积（PECVD）工艺在由第二簇传送的第一有机层上的第一有机层上形成第二无机层。

公开(公告)号：US20150064825A1

公开(公告)日：2015-03-05

申请号：US14298795

申请日：2014-06-06

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Myung-Soo Huh ,  Tae-Seung Yoon ,  Jeong-Ho Yi

IPC: H01L51/00 ,  H01L51/56

CPC classification number: C23C14/34 ,  C23C14/541 ,  C23C14/568 ,  C23C16/042 ,  C23C16/463 ,  C23C16/54 ,  H01L51/001 ,  H01L51/5253 ,  H01L51/56

Abstract: A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.

Abstract translation: 一种薄膜封装制造装置，包括：第一簇，被配置为通过溅射工艺在其上形成发光单元的第一基板上形成第一无机层; 第二簇，被配置为通过有机沉积工艺从所述第一簇输送的所述第一基板上的所述第一无机层上形成第一有机层; 第一连接模块，被配置为连接所述第一集群和所述第二集群，所述第一连接模块被配置为将其上形成有所述第一无机层的所述第一基板从所述第一集群传送到所述第二集群，并且被配置为以非接触方式冷却所述第一衬底 方式; 以及第三簇，其被配置为通过化学气相沉积（CVD）工艺或等离子体增强化学气相沉积（PECVD）工艺在由第二簇传送的第一有机层上的第一有机层上形成第二无机层。

公开(公告)号：US20140302624A1

公开(公告)日：2014-10-09

申请号：US14012916

申请日：2013-08-28

Applicant: Samsung Display Co., ltd.

Inventor： Sun-Ho Kim ,  Myung-Soo Huh ,  Jeong-Ho Yi ,  Cheol-Rae Jo ,  Hyun-Woo Joo ,  Yong-Suk Lee

IPC: H01L21/56 ,  H01L51/00

CPC classification number: H01L21/56 ,  C23C14/24 ,  C23C14/564 ,  C23C16/4412 ,  H01L51/0008

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

Abstract translation: 一种沉积装置，被配置为在基板上进行沉积处理，所述沉积装置包括：具有在表面中具有排气开口的室，所述室中的沉积源构造成朝向所述基板排出一个或多个沉积材料;对应于 形成有排气口的室的内表面，与冷却板接触的冰箱以及连接到排气口的泵。