THIN FILM TRANSISTOR PANEL AND MANUFACTURING METHOD THEREOF
    13.
    发明申请
    THIN FILM TRANSISTOR PANEL AND MANUFACTURING METHOD THEREOF 审中-公开
    薄膜晶体管面板及其制造方法

    公开(公告)号:US20160197190A1

    公开(公告)日:2016-07-07

    申请号:US14754213

    申请日:2015-06-29

    CPC classification number: H01L29/7869 H01L27/124 H01L29/401 H01L29/78696

    Abstract: Provided is a thin film transistor panel including: a substrate; a gate electrode positioned on the substrate; a gate insulating layer positioned on the gate electrode; an oxide semiconductor positioned on the gate insulating layer and including an oxide layer; and a source electrode and a drain electrode positioned on the oxide semiconductor and facing each other based on a channel of the oxide semiconductor, in which the oxide layer overlaps the gate electrode and is positioned on the oxide semiconductor.

    Abstract translation: 提供一种薄膜晶体管面板,包括:基板; 位于所述基板上的栅电极; 位于所述栅电极上的栅极绝缘层; 位于所述栅极绝缘层上且包括氧化物层的氧化物半导体; 以及位于所述氧化物半导体上的源电极和漏极,并且基于所述氧化物半导体的沟道彼此相对,所述氧化物层与所述栅电极重叠并位于所述氧化物半导体上。

    SPUTTERING DEVICE
    14.
    发明申请
    SPUTTERING DEVICE 有权
    喷射装置

    公开(公告)号:US20140076714A1

    公开(公告)日:2014-03-20

    申请号:US13760758

    申请日:2013-02-06

    Abstract: A sputtering device includes: a sputtering target; a substrate supporter facing the sputtering target and upon which a substrate is disposed; an anode mask between the sputtering target and the substrate which is on the substrate supporter; and a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other. Each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber configured to receive the sputtering device.

    Abstract translation: 溅射装置包括:溅射靶; 面向溅射靶的衬底支撑件,并且衬底被设置在衬底支撑件上; 位于所述基板支撑体上的所述溅射靶和所述基板之间的阳极掩模; 以及位于阳极掩模和溅射靶之间的气体分配构件,并且包括彼此分离的多个气体分配管。 每个气体分配管包括限定在其中的多个排放孔,并且气体被排出到被配置为接收溅射装置的真空室。

    SPUTTERING DEVICE AND METHOD OF FORMING LAYER USING THE SAME
    18.
    发明申请
    SPUTTERING DEVICE AND METHOD OF FORMING LAYER USING THE SAME 有权
    溅射装置及其使用形成层的方法

    公开(公告)号:US20160160340A1

    公开(公告)日:2016-06-09

    申请号:US14670403

    申请日:2015-03-26

    CPC classification number: C23C14/044 H01J37/34 H01J37/3447

    Abstract: The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.

    Abstract translation: 使用溅射装置形成层的方法包括:将基板放置在室内; 使用溅射工艺将从面向衬底的靶发射的靶颗粒沉积在衬底上; 并且水平移动多个屏蔽杆,其安装在设置在基板和靶之间的屏蔽掩模中,并且在溅射过程期间沿着第一方向彼此分离。

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