公开(公告)号：US20230345665A1

公开(公告)日：2023-10-26

申请号：US18249573

申请日：2021-11-01

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Masanori Hayashibara ,  Yasuhiro Ootori ,  Keiichi Aoki

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  H05K7/20136

Abstract: Provided is an electronic apparatus that acquires an ambient temperature of the electronic apparatus and operates a cooling device to cool a component that generates heat during an operation. When the ambient temperature is lower than a predetermined reference temperature, the electronic apparatus exercises control to increase an output of the cooling device to a value higher than that obtained when the ambient temperature is equal to or higher than the reference temperature.

公开(公告)号：US10820431B2

公开(公告)日：2020-10-27

申请号：US16086452

申请日：2017-02-10

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: H05K5/02 ,  H05K7/20 ,  G06F1/20 ,  G11B33/14 ,  G11B33/02

Abstract: The ventilation efficiency is improved while exposure of a part disposed at the inner side of an electronic apparatus is suppressed. An electronic apparatus has a first shielding portion and a second shielding portion disposed behind a circuit board. The first shielding portion and the second shielding portion are juxtaposed in an upward and downward direction. Further, the first shielding portion and the second shielding portion are disposed in a displaced relationship from each other in a forward and rearward direction, and a first exhaust port is provided between the first shielding portion and the second shielding portion.

公开(公告)号：US20190132969A1

公开(公告)日：2019-05-02

申请号：US16086452

申请日：2017-02-10

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: H05K5/02 ,  G11B33/14 ,  H05K7/20

Abstract: The ventilation efficiency is improved while exposure of a part disposed at the inner side of an electronic apparatus is suppressed. An electronic apparatus has a first shielding portion and a second shielding portion disposed behind a circuit board. The first shielding portion and the second shielding portion are juxtaposed in an upward and downward direction. Further, the first shielding portion and the second shielding portion are disposed in a displaced relationship from each other in a forward and rearward direction, and a first exhaust port is provided between the first shielding portion and the second shielding portion.

公开(公告)号：US20180082718A1

公开(公告)日：2018-03-22

申请号：US15827046

申请日：2017-11-30

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Kazuto Nakagawa ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: G11B33/14 ,  H05K7/20 ,  G06F1/16 ,  H05K7/14 ,  G06F1/18

CPC classification number: G11B33/142 ,  G06F1/1616 ,  G06F1/181 ,  G06F1/184 ,  G06F1/188 ,  G06F1/20 ,  H01L23/467 ,  H05K7/1422 ,  H05K7/20136

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

公开(公告)号：US12298823B2

公开(公告)日：2025-05-13

申请号：US17911874

申请日：2021-03-25

Applicant: Sony Interactive Entertainment Inc.

Inventor： Yujin Morisawa ,  Yasuhiro Ootori ,  Keiichi Aoki ,  Shinya Tsuchida

IPC: G06F1/20 ,  H05K5/03 ,  H05K7/20

Abstract: There is provided an electronic apparatus which improves an external appearance and which easily ensures the strength of an exterior member. In the electronic apparatus, an upper surface of an exterior panel (20A) has, on a peripheral portion of the upper surface, a first position (P1), a second position (P2) defined on an opposite side of a center (P0) of the upper surface from the first position (P1), a third position (P3), and a fourth position (P4) defined on an opposite side of the center (P0) of the upper surface from the third position (P3). A line (L1) that connects the first position (P1) and the second position (P2) to each other and is formed along the upper surface is a curve bulging to a lower side, and a line (L2) that connects the third position (P3) and the fourth position (P4) to each other and is formed along the upper surface is a curve bulging to an upper side.

公开(公告)号：US20230328940A1

公开(公告)日：2023-10-12

申请号：US18191921

申请日：2023-03-29

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Katsushi Ito ,  Nobuyuki Sugawara ,  Tetsufumi Nozawa

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0032 ,  H05K1/181 ,  H05K2201/10371

Abstract: Provided is an electronic device including a circuit board having a first surface and a second surface, a first member covering the first surface to function as a shield of the circuit board and having a first encompassing region having, in at least a portion thereof, a first outer region, and a second member that is placed on a side of the second surface that has a second outer region. One of the first and the second outer regions has at least one outer fixed portion fixed to another of the first and the second outer regions and at least one projection located away from the at least one outer fixed portion in a direction along an outer edge of the circuit board. The first and the second members are in contact with each other with the at least one outer fixed portion and the at least one projection.

公开(公告)号：US20180350408A1

公开(公告)日：2018-12-06

申请号：US16058040

申请日：2018-08-08

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Kazuto Nakagawa ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: G11B33/14 ,  H05K7/20 ,  H05K7/14 ,  G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  H01L23/467

CPC classification number: G11B33/142 ,  G06F1/1616 ,  G06F1/181 ,  G06F1/184 ,  G06F1/188 ,  G06F1/20 ,  H01L23/467 ,  H05K7/1422 ,  H05K7/20136

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

公开(公告)号：US10090021B2

公开(公告)日：2018-10-02

申请号：US15827046

申请日：2017-11-30

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Kazuto Nakagawa ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: G11B33/14 ,  H05K7/20 ,  G06F1/16 ,  H05K7/14 ,  G06F1/18

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

公开(公告)号：US20180255633A1

公开(公告)日：2018-09-06

申请号：US15902071

申请日：2018-02-22

Applicant: Sony Interactive Entertainment Inc.

Inventor： Tetsufumi Nozawa ,  Shinya Tsuchida

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01R12/724 ,  H05K1/0224 ,  H05K9/0033 ,  H05K2201/0715 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: Electronic equipment includes a printed board having a front surface on which a ground pattern is formed and a shield member disposed opposed to the front surface of the printed board. The shield member has a strip-shaped region that is opposed to the ground pattern and protrudes toward the printed board, and is fastened to the printed board by screws that pass through a respective one of a plurality of screw holes made in the strip-shaped region. Either one of the shield member and the printed board has a protruding part that is formed projectingly toward the other and causes the strip-shaped region and the ground pattern to get contact with each other at a position sandwiched by adjacent two screw holes in the strip-shaped region in plan view.

公开(公告)号：US20180247881A1

公开(公告)日：2018-08-30

申请号：US15559111

申请日：2016-04-04

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hitomi Iizuka ,  Hiroaki Tsurumi ,  Shinya Tsuchida ,  Kenji Hirose ,  Yuta Tamaki

IPC: H01L23/40 ,  H05K9/00 ,  H01L23/433 ,  H05K1/18 ,  H05K1/02 ,  A63F13/90

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.