公开(公告)号：US20190232438A1

公开(公告)日：2019-08-01

申请号：US16223952

申请日：2018-12-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROHISA HINO ,  NAOMICHI OHASHI ,  YASUHIRO SUZUKI ,  KOSO MATSUNO

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/26 ,  C22C13/02 ,  H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/40 ,  B23K2101/42 ,  C22C13/02 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/81815 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/069 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3494 ,  H05K2201/10636 ,  H05K2201/10734

Abstract: Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured product of excellent properties, for example, high insulation against humidity. Amount structure including an electronic component mounted with the solder paste is also provided. The solder paste contains a solder powder and a flux. The flux contains an epoxy resin, a reactive diluent, a curing agent, an organic acid, and a rubber modified epoxy resin. The reactive diluent contains a compound having two or more epoxy groups, and has a viscosity of 150 mPa·s or more and 700 mPa·s or less. The reactive diluent has a total chlorine content of 0.5 weight % or less, and is contained in a proportion of 5 weight % or more and 45 weight % or less with respect to a total weight of the flux.

公开(公告)号：US20180305546A1

公开(公告)日：2018-10-25

申请号：US15922841

申请日：2018-03-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HONAMI NISHINO ,  HIROHISA HINO

IPC: C08L83/04 ,  C08K3/22 ,  C08L43/04 ,  C08K3/14 ,  C08K3/36

CPC classification number: C08L83/04 ,  C08K3/14 ,  C08K3/22 ,  C08K3/36 ,  C08K2003/2217 ,  C08K2003/2227 ,  C08L43/04 ,  C08L2203/20 ,  H05K1/03

Abstract: A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.

公开(公告)号：US20170120396A1

公开(公告)日：2017-05-04

申请号：US15265336

申请日：2016-09-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOMICHI OHASHI ,  YUKI YOSHIOKA ,  YASUHIRO SUZUKI ,  HIROHISA HINO ,  MASATO MORI ,  KAZUHIRO NISHIKAWA

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/26 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L23/00 ,  H01L23/31 ,  B23K1/00 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/264 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H01L21/563 ,  H01L23/3142 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81815 ,  H01L2924/0665 ,  H01L2924/20102 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/048 ,  Y02P70/613

Abstract: A solder paste having improved self alignment for soldering is provided. The solder paste includes a solder powder; a composite epoxy resin containing a first epoxy resin that is solid at 25° C., and a second epoxy resin that is liquid at 25° C.; and a curing agent, wherein the first epoxy resin has a softening point that is at least 10° C. lower than the melting point of the solder powder, and is contained in a range of 10 weight parts to 75 weight parts with respect to the total 100 weight parts of the composite epoxy resin.