公开(公告)号：US11967570B2

公开(公告)日：2024-04-23

申请号：US17687350

申请日：2022-03-04

Applicant: MediaTek Inc.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01Q1/02 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L23/3672 ,  H01L23/3733 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/02 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/18161

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

公开(公告)号：US11908767B2

公开(公告)日：2024-02-20

申请号：US17545015

申请日：2021-12-08

Applicant: MEDIATEK INC.

Inventor： Che-Hung Kuo ,  Hsing-Chih Liu ,  Chia-Hao Hsu

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/49822

Abstract: A semiconductor package structure includes a first redistribution layer, a semiconductor die, a thermal spreader, and a molding material. The semiconductor die is disposed over the first redistribution layer. The thermal spreader is disposed over the semiconductor die. The molding material surrounds the semiconductor die and the thermal spreader.

公开(公告)号：US11640930B2

公开(公告)日：2023-05-02

申请号：US16989919

申请日：2020-08-11

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/16 ,  H01L23/00

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US20220285297A1

公开(公告)日：2022-09-08

申请号：US17687350

申请日：2022-03-04

Applicant: MediaTek Inc.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

公开(公告)号：US11302657B2

公开(公告)日：2022-04-12

申请号：US16802576

申请日：2020-02-27

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L27/14 ,  H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

公开(公告)号：US20180143903A1

公开(公告)日：2018-05-24

申请号：US15620794

申请日：2017-06-12

Applicant: MediaTek Inc.

Inventor： Ming-Ju Wu ,  Chien-Hung Lin ,  Chia-Hao Hsu ,  Pi-Cheng Hsiao ,  Shao-Yu Wang

IPC: G06F12/0804 ,  G06F12/0815 ,  G06F12/121

CPC classification number: G06F12/0804 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/0833 ,  G06F12/12 ,  G06F12/121 ,  G06F2212/60 ,  G06F2212/621

Abstract: A multi-cluster, multi-processor computing system performs a cache flushing method. The method begins with a cache maintenance hardware engine receiving a request from a processor to flush cache contents to a memory. In response, the cache maintenance hardware engine generates commands to flush the cache contents to thereby remove workload of generating the commands from the processors. The commands are issued to the clusters, with each command specifying a physical address that identifies a cache line to be flushed.

公开(公告)号：US09639467B2

公开(公告)日：2017-05-02

申请号：US14935477

申请日：2015-11-09

Applicant: MediaTek Inc.

Inventor： Chia-Hao Hsu ,  Fan-Lei Liao ,  Shun-Chih Yu

IPC: G06F12/00 ,  G06F12/0804 ,  G06F12/0806 ,  G06F12/0808 ,  G06F12/0802

CPC classification number: G06F12/0804 ,  G06F12/0802 ,  G06F12/0806 ,  G06F12/0808 ,  G06F12/0817 ,  G06F12/0866 ,  G06F2212/62

Abstract: A computing system performs an environment-aware cache flushing method. When a processor in the system receives a signal to flush at least a portion of the caches to the system memory, the processor determines a flushing mechanism among multiple candidate flushing mechanisms. The processor also determines one or more of the active processors in the system for performing the flushing mechanism. The determinations are based on the extent of flushing indicated in the signal and a runtime environment that includes the number of active processors. The system then flushes the caches to the system memory according to the flushing mechanism.

公开(公告)号：US20160246619A1

公开(公告)日：2016-08-25

申请号：US15024852

申请日：2015-08-31

Applicant: MEDIATEK INC.

Inventor： Ya-Ting Chang ,  Jia-Ming Chen ,  Hung-Lin Chou ,  Yu-Ming Lin ,  Yu-Ting Chen ,  Nicholas Ching Hui Tang ,  Chia-Hao Hsu

IPC: G06F9/445 ,  G06F9/30

CPC classification number: G06F9/44505 ,  G06F9/30098 ,  G06F9/461

Abstract: A mode switching handling method includes: when an operating system mode is switched from a first mode to a second mode, saving only a portion of register data that are stored in registers into a storage device, wherein an M-bit register length is used in the first mode, an N-bit register length is used in the second mode, and M and N are different integers.

Abstract translation: 一种模式切换处理方法包括：当操作系统模式从第一模式切换到第二模式时，仅将存储在寄存器中的一部分寄存器数据保存到存储装置中，其中使用M位寄存器长度 在第一模式中，在第二模式中使用N位寄存器长度，并且M和N是不同的整数。

公开(公告)号：US20230238302A1

公开(公告)日：2023-07-27

申请号：US18129061

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/16 ,  H01L23/00

CPC classification number: H01L23/473 ,  H01L23/16 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/3511

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US11621211B2

公开(公告)日：2023-04-04

申请号：US16881206

申请日：2020-05-22

Applicant: MEDIATEK INC.

Inventor： Ya-Jui Hsieh ,  Chia-Hao Hsu ,  Tai-Yu Chen ,  Yao-Pang Hsu

IPC: H01L23/373 ,  H01L23/367

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die, a molding material, a first bonding layer, and a thermal interface material. The semiconductor die is disposed over the substrate. The molding material surrounds the semiconductor die. The first bonding layer is disposed over the semiconductor die. The thermal interface material is disposed over the molding material.