公开(公告)号：US12080614B2

公开(公告)日：2024-09-03

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H01L23/31 ,  H01L23/4006 ,  H01L23/473 ,  H05K5/0052 ,  H05K5/0221 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US11621211B2

公开(公告)日：2023-04-04

申请号：US16881206

申请日：2020-05-22

Applicant: MEDIATEK INC.

Inventor： Ya-Jui Hsieh ,  Chia-Hao Hsu ,  Tai-Yu Chen ,  Yao-Pang Hsu

IPC: H01L23/373 ,  H01L23/367

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die, a molding material, a first bonding layer, and a thermal interface material. The semiconductor die is disposed over the substrate. The molding material surrounds the semiconductor die. The first bonding layer is disposed over the semiconductor die. The thermal interface material is disposed over the molding material.

公开(公告)号：US20240429113A1

公开(公告)日：2024-12-26

申请号：US18822254

申请日：2024-09-01

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20230307849A1

公开(公告)日：2023-09-28

申请号：US18113606

申请日：2023-02-23

Applicant: MEDIATEK INC.

Inventor： Ya-Jui Hsieh ,  Chi-Yuan Chen ,  Shih-Chao Chiu ,  Yao-Pang Hsu

IPC: H01Q21/08 ,  H01Q9/04 ,  H01L25/16

CPC classification number: H01Q21/08 ,  H01Q9/0407 ,  H01L25/16

Abstract: An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip. Conductive elements are disposed between the antenna package and the chip package to electrically interconnect the chip package and the antenna package. A radiative antenna element is disposed on the bottom surface of the antenna package. At least one air trench is disposed on the bottom surface of the antenna package.

公开(公告)号：US20220130734A1

公开(公告)日：2022-04-28

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H05K5/02 ,  H05K5/00 ,  H01L23/473

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.