公开(公告)号：US20240429113A1

公开(公告)日：2024-12-26

申请号：US18822254

申请日：2024-09-01

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US12080614B2

公开(公告)日：2024-09-03

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H01L23/31 ,  H01L23/4006 ,  H01L23/473 ,  H05K5/0052 ,  H05K5/0221 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20220130734A1

公开(公告)日：2022-04-28

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H05K5/02 ,  H05K5/00 ,  H01L23/473

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.