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    High Throughput Thin Film Characterization And Defect Detection
    11.
    发明申请
    High Throughput Thin Film Characterization And Defect Detection 有权
    高通量薄膜表征和缺陷检测

    公开(公告)号：US20130083320A1

    公开(公告)日：2013-04-04

    申请号：US13626023

    申请日：2012-09-25

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Xiang Gao ,  Philip D. Flanner, III ,  Leonid Poslavsky ,  Zhiming Jiang ,  Jun-Jie (Julien) Ye ,  Torsten Kaack ,  Qiang Zhao

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/211 ,  G01N21/8422 ,  G01N21/8851 ,  H01L22/12

    Abstract: Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical dispersion metrics are determined based on the spectral data. Band structure characteristics such as band gap, band edge, and defects are determined based on optical dispersion metric values. In some embodiments a band structure characteristic is determined by curve fitting and interpolation of dispersion metric values. In some other embodiments, band structure characteristics are determined by regression of a selected dispersion model. In some examples, band structure characteristics indicative of band broadening of high-k dielectric films are also determined. The electrical performance of finished wafers is estimated based on the band structure characteristics identified early in the manufacturing process.

    Abstract translation: 提出了基于光谱响应数据确定沉积在衬底上的高k电介质膜的带结构特性的方法和系统。 高产量光谱仪用于在制造过程早期快速测量半导体晶圆。 基于光谱数据确定光色散度量。 基于光学色散度量值来确定带隙，带边缘和缺陷之类的带结构特性。 在一些实施例中，通过曲线拟合和色散度量值的插值来确定带结构特征。 在一些其它实施例中，通过所选色散模型的回归来确定带结构特征。 在一些实例中，还确定了指示高k电介质膜的带宽变宽的带结构特性。 基于在制造过程早期确定的带结构特性来估计成品晶圆的电性能。

    Adaptive numerical aperture control method and system
    13.
    发明授权
    Adaptive numerical aperture control method and system 有权

    公开(公告)号：US10678226B1

    公开(公告)日：2020-06-09

    申请号：US15214371

    申请日：2016-07-19

    Applicant: KLA-Tencor Corporation

    Inventor： Qiang Wang ,  Liequan Lee ,  Xin Li ,  Qiang Zhao

    IPC: G05B19/418 ,  H01L21/67 ,  H01L21/66 ,  G01B11/00 ,  G01N21/956

    Abstract: Systems and methods for providing efficient modeling and measurement of critical dimensions and/or overlay registrations of wafers are disclosed. Efficiency is improved in both spectral dimension and temporal dimension. In the spectral dimension, efficiency can be improved by allowing different numerical aperture (NA) models to be used for different wavelengths in electromagnetic calculations, effectively providing a balance between computation speed and accuracy. In the temporal dimension, different NA models may be used at different iterations/stages in the process, effectively improving the computation speed without sacrificing the quality of the final result.

    Measurement library optimization in semiconductor metrology
    14.
    发明授权
    Measurement library optimization in semiconductor metrology 有权

    公开(公告)号：US10345721B1

    公开(公告)日：2019-07-09

    申请号：US15184782

    申请日：2016-06-16

    Applicant: KLA-Tencor Corporation

    Inventor： Meng Cao ,  Lie-Quan Lee ,  Qiang Zhao ,  Heyin Li ,  Mengmeng Ye

    IPC: G03F9/00

    Abstract: Methods and systems for optimizing a set of measurement library control parameters for a particular metrology application are presented herein. Measurement signals are collected from one or more metrology targets by a target measurement system. Values of user selected parameters of interest are resolved by fitting a pre-computed measurement library function to the measurement signals for a given set of library control parameters. Values of one or more library control parameters are optimized such that differences between the values of the parameters of interest estimated by the library based measurement and reference values associated with trusted measurements of the parameters of interest are minimized. The optimization of the library control parameter values is performed without recalculating the pre-computed measurement library. Subsequent library based measurements are performed by the target measurement system using the optimized set of measurement library control parameters with improved measurement performance.

    Model building and analysis engine for combined X-ray and optical metrology
    16.
    发明授权
    Model building and analysis engine for combined X-ray and optical metrology 有权

    公开(公告)号：US10013518B2

    公开(公告)日：2018-07-03

    申请号：US13935275

    申请日：2013-07-03

    Applicant: KLA-Tencor Corporation

    Inventor： Michael S. Bakeman ,  Andrei V. Shchegrov ,  Qiang Zhao ,  Zhengquan Tan

    IPC: G06F17/50 ,  G03F7/20 ,  G03F1/70

    CPC classification number: G06F17/5068 ,  G03F1/70 ,  G03F7/70608 ,  G03F7/70625

    Abstract: Structural parameters of a specimen are determined by fitting models of the response of the specimen to measurements collected by different measurement techniques in a combined analysis. Models of the response of the specimen to at least two different measurement technologies share at least one common geometric parameter. In some embodiments, a model building and analysis engine performs x-ray and optical analyses wherein at least one common parameter is coupled during the analysis. The fitting of the response models to measured data can be done sequentially, in parallel, or by a combination of sequential and parallel analyses. In a further aspect, the structure of the response models is altered based on the quality of the fit between the models and the corresponding measurement data. For example, a geometric model of the specimen is restructured based on the fit between the response models and corresponding measurement data.

    Automated Metrology System Selection
    17.
    发明申请
    Automated Metrology System Selection 审中-公开
    自动计量系统选择

    公开(公告)号：US20170023491A1

    公开(公告)日：2017-01-26

    申请号：US15166897

    申请日：2016-05-27

    Applicant: KLA-Tencor Corporation

    Inventor： Meng Cao ,  Lie-Quan Lee ,  Qiang Zhao ,  Heyin Li ,  Mengmeng Ye

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01B21/04 ,  G01B2210/56 ,  G01N21/211 ,  G01N2021/213 ,  G03F7/705 ,  G03F7/70625 ,  G03F7/70633

    Abstract: Methods and systems for evaluating and ranking the measurement efficacy of multiple sets of measurement system combinations and recipes for a particular metrology application are presented herein. Measurement efficacy is based on estimates of measurement precision, measurement accuracy, correlation to a reference measurement, measurement time, or any combination thereof. The automated the selection of measurement system combinations and recipes reduces time to measurement and improves measurement results. Measurement efficacy is quantified by a set of measurement performance metrics associated with each measurement system and recipe. In one example, the sets of measurement system combinations and recipes most capable of measuring the desired parameter of interest are presented to the user in rank order based on corresponding values of one or more measurement performance metrics. A user is able to select the appropriate measurement system combination in an objective, quantitative manner.

    Abstract translation: 本文介绍了用于评估和评估特定测量应用的多组测量系统组合和配方的测量功能的方法和系统。 测量功效基于测量精度，测量精度，与参考测量的相关性，测量时间或其任何组合的估计。 自动化测量系统组合和配方的选择减少了测量时间并提高了测量结果。 通过与每个测量系统和配方相关联的一组测量性能指标量化测量功效。 在一个示例中，基于一个或多个测量性能度量的对应值，以等级顺序向用户呈现最能测量所需感兴趣参数的测量系统组合和配方的集合。 用户能够以客观，定量的方式选择合适的测量系统组合。

    Semiconductor device models including re-usable sub-structures
    18.
    发明授权
    Semiconductor device models including re-usable sub-structures 有权
    包括可重复使用的子结构的半导体器件模型

    公开(公告)号：US09553033B2

    公开(公告)日：2017-01-24

    申请号：US14594917

    申请日：2015-01-12

    Applicant: KLA-Tencor Corporation

    Inventor： Jonathan Iloreta ,  Matthew A. Laffin ,  Leonid Poslavsky ,  Torsten Kaack ,  Qiang Zhao ,  Lie-Quan Lee

    IPC: G06F17/50 ,  H01L21/66

    CPC classification number: H01L22/12

    Abstract: Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.

    Abstract translation: 提出了基于可重复使用的参数模型生成复杂设备结构测量模型的方法和工具。 采用这些模型的计量系统被配置为测量与不同半导体制造工艺相关联的结构和材料特性。 可重复使用的参数子结构模型由模型构建工具的用户输入的一组独立参数完全定义。 与模型形状相关联的所有其他变量和组成几何元素之间的内部约束在模型中被预先定义。 在一些实施例中，将一个或多个可重复使用的参数模型集成到复合半导体器件的测量模型中。 在另一方面，模型构建工具基于来自用户的输入生成可重复使用的参数子结构模型。 所得到的模型可以导出到其他人可以使用的文件，并且可能包括用于控制与特定用户共享敏感知识产权的安全功能。

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