公开(公告)号：US10678226B1

公开(公告)日：2020-06-09

申请号：US15214371

申请日：2016-07-19

Applicant: KLA-Tencor Corporation

Inventor： Qiang Wang ,  Liequan Lee ,  Xin Li ,  Qiang Zhao

IPC: G05B19/418 ,  H01L21/67 ,  H01L21/66 ,  G01B11/00 ,  G01N21/956

Abstract: Systems and methods for providing efficient modeling and measurement of critical dimensions and/or overlay registrations of wafers are disclosed. Efficiency is improved in both spectral dimension and temporal dimension. In the spectral dimension, efficiency can be improved by allowing different numerical aperture (NA) models to be used for different wavelengths in electromagnetic calculations, effectively providing a balance between computation speed and accuracy. In the temporal dimension, different NA models may be used at different iterations/stages in the process, effectively improving the computation speed without sacrificing the quality of the final result.