-
公开(公告)号：US10831249B2
公开(公告)日：2020-11-10
申请号：US16490822
申请日：2017-07-31
Applicant: Huawei Technologies Co., Ltd.
Inventor： Huawen Jiang , Linfang Jin
Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.
-
公开(公告)号：US10729036B2
公开(公告)日：2020-07-28
申请号：US16337052
申请日：2017-09-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Guo Yang , Shuainan Lin
IPC: H05K7/20
Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
-
公开(公告)号：US10409340B2
公开(公告)日：2019-09-10
申请号：US15311927
申请日：2014-06-04
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Xiaowei Hui , Xiangyang Yang , Shaoxin Zhou
Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
-
公开(公告)号：US12117871B2
公开(公告)日：2024-10-15
申请号：US17954203
申请日：2022-09-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhi Yuan , Jian Shi , Hanru Yu , Linfang Jin
CPC classification number: G06F1/1652 , G06F1/203
Abstract: Example mobile terminals are disclosed. One example terminal includes a rotating member, a flexible screen, a bending support part, and a temperature equalization plate. The flexible screen includes two unfolded regions and a bent region that is disposed opposite to the rotating member. The bending support part is located between the flexible screen and the rotating member. The temperature equalization plate is configured to balance temperatures in the two unfolded regions and includes two temperature equalization parts opposite to the two unfolded regions in a one-to-one correspondence and a flexible connection part that connects the two temperature equalization parts. The flexible connection part is located on a side of the bending support part and away from the flexible screen.
-
公开(公告)号：US11665816B2
公开(公告)日：2023-05-30
申请号：US17598530
申请日：2020-03-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
CPC classification number: H05K1/0272 , H05K1/0203 , H05K1/0219 , H05K3/4644 , H05K2201/064 , H05K2201/10121
Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
-
Patent Agency Ranking
公开(公告)号：US10736237B2
公开(公告)日：2020-08-04
申请号：US16175703
申请日：2018-10-30
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yan Xu , Linfang Jin
IPC: F28F7/00 , H05K7/20 , H01L23/373 , B32B9/00 , F28F21/02
Abstract: A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.
-
公开(公告)号：US20240081026A1
公开(公告)日：2024-03-07
申请号：US18505673
申请日：2023-11-09
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongwang Xiao , Linfang Jin , Hualin Li , Naixiang Xu , Guoping Wang
CPC classification number: H05K7/20336 , G06F1/203 , H05K7/20481 , H04M1/026
Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly, where the first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.
-
公开(公告)号：US20220183146A1
公开(公告)日：2022-06-09
申请号：US17598530
申请日：2020-03-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
IPC: H05K1/02
Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
-
公开(公告)号：US11144101B2
公开(公告)日：2021-10-12
申请号：US16529075
申请日：2019-08-01
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Xiaowei Hui , Xiangyang Yang , Shaoxin Zhou
Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
-
公开(公告)号：US10088879B2
公开(公告)日：2018-10-02
申请号：US15508890
申请日：2014-06-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Nanbo Kang , Jie Zou , Xiaowei Hui
IPC: G06F1/20 , F28D15/02 , H01L23/427 , F28D15/04
Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.
-
-
-
-
-
-
-
-
-
Search Results
22
records
(took 0.022 seconds)
