公开(公告)号：US09094593B2

公开(公告)日：2015-07-28

申请号：US14339623

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H04N5/225 ,  H01L25/00

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。

公开(公告)号：US20150034975A1

公开(公告)日：2015-02-05

申请号：US14339657

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L31/16 ,  H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。

公开(公告)号：US20140125849A1

公开(公告)日：2014-05-08

申请号：US14064550

申请日：2013-10-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: G02B27/00 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。

公开(公告)号：US10199426B2

公开(公告)日：2019-02-05

申请号：US15828664

申请日：2017-12-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US09899251B2

公开(公告)日：2018-02-20

申请号：US15698991

申请日：2017-09-08

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Stephan Heimgartner ,  John A. Vidallon

IPC: H01L21/68 ,  H01L21/683 ,  B32B37/18 ,  B32B38/18 ,  B32B37/12

CPC classification number: H01L21/6838 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1858 ,  B32B2457/00 ,  B32B2551/00

Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

公开(公告)号：US20170317126A1

公开(公告)日：2017-11-02

申请号：US15651510

申请日：2017-07-17

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H01L27/146 ,  H01L31/18 ,  H01L31/0232 ,  G02B27/00 ,  H01L31/0216 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US09748297B2

公开(公告)日：2017-08-29

申请号：US14177552

申请日：2014-02-11

Applicant: Heptagon Micro Optics Pte. Ltd. ,  Franco Rinaldo

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H04N5/225 ,  H01L27/146 ,  G02B27/00 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US20160241749A1

公开(公告)日：2016-08-18

申请号：US15024133

申请日：2014-09-17

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasimiö ,  Stephan Heimgartner

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2924/19105 ,  H04N5/2252 ,  H05K3/284 ,  H01L2924/00014

Abstract: Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located. In some cases, the thickness of a transmissive substrate in the module can be reduced near its periphery to provide more head room for the bond wires, which can result in a smaller overall footprint for the module.

Abstract translation: 紧凑型相机模块可以包括辅助间隔件，以便于使用阻塞和灌装封装技术。 设置在辅助间隔物的侧边缘上的密封剂可以封闭辅助间隔件和安装有图像传感器的支撑件之间的间隙，从而基本上密封接合线或其它部件所在的区域。 在一些情况下，模块中的透射基板的厚度可以在其周边附近减小以为接合线提供更多的头部空间，这可以导致模块的更小的总体占地面积。

公开(公告)号：US10186540B2

公开(公告)日：2019-01-22

申请号：US14743073

申请日：2015-06-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H04N5/225 ,  H01L25/00 ,  G02B13/00 ,  G02B5/22 ,  F21V5/04 ,  G02B7/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L23/00 ,  H01L31/054 ,  H01L33/58 ,  F21Y115/10

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

公开(公告)号：US20180005864A1

公开(公告)日：2018-01-04

申请号：US15698991

申请日：2017-09-08

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Stephan Heimgartner ,  John A. Vidallon

IPC: H01L21/683 ,  B32B37/18 ,  B32B37/12 ,  B32B38/18

CPC classification number: H01L21/6838 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1858 ,  B32B2457/00 ,  B32B2551/00

Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.