公开(公告)号：US20150270102A1

公开(公告)日：2015-09-24

申请号：US14665410

申请日：2015-03-23

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Tatsuya ASAHATA ,  Hidekazu SUZUKI ,  Makoto SATO

IPC: H01J37/317 ,  H01J37/22 ,  H01J37/244

CPC classification number: H01J37/317 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J37/3005 ,  H01J2237/221 ,  H01J2237/2448 ,  H01J2237/30466 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: A focused ion beam apparatus includes: a focused ion beam tube configured to irradiate a focused ion beam onto a sample; a detector configured to detect secondary particles generated from the sample due to the irradiation and to output detection information regarding detected secondary particles; an image forming unit configured to form an observation image of the sample based on the detection information; a storage unit configured to store positional relation between a first processing area set on an observation image of a first sample and a cross-section surface of the first sample; and a processing area setting unit configured to automatically set a second processing area on an observation image of a second sample based on the positional relation stored in the storage unit and a position of a cross-section surface of the second sample on the observation image of the second sample.

Abstract translation: 聚焦离子束装置包括：聚焦离子束管，被配置为将聚焦的离子束照射到样品上; 检测器，其被配置为检测由于所述照射而从所述样品产生的二次粒子，并输出关于检测到的二次粒子的检测信息; 图像形成单元，被配置为基于所述检测信息形成所述样本的观察图像; 存储单元，被配置为存储设置在第一样本的观察图像上的第一处理区域和第一样本的截面之间的位置关系; 以及处理区域设定单元，被配置为基于存储在存储单元中的位置关系和第二样本的横截表面的位置来自动设置第二样本的观察图像上的第二处理区域， 第二个样本。

公开(公告)号：US20150115156A1

公开(公告)日：2015-04-30

申请号：US14520595

申请日：2014-10-22

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Hidekazu SUZUKI ,  Tatsuya ASAHATA ,  Atsushi UEMOTO

IPC: H01J37/26 ,  H01J37/305 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/3056 ,  G01N1/32 ,  H01J37/304 ,  H01J2237/31745

Abstract: A cross section processing method and a cross section processing apparatus are provided in which it is possible to form a flat cross section in a sample composed of a plurality of substances having different hardness by a focused ion beam. The etching of a processing area is performed while variably controlling the irradiation interval, the irradiation time, or the like of a focused ion beam based on cross section information of an SEM image obtained by the observation of a cross section. In this way, even if a sample is composed of a plurality of substances having different hardness, it is possible to form a flat observation surface with a uniform etching rate.

Abstract translation: 提供一种横截面加工方法和横截面加工装置，其中可以在通过聚焦离子束由具有不同硬度的多种物质组成的样品中形成平坦的横截面。 基于通过观察截面获得的SEM图像的横截面信息，可以可变地控制聚焦离子束的照射间隔，照射时间等进行处理区域的蚀刻。 以这种方式，即使样品由具有不同硬度的多种物质组成，也可以形成具有均匀蚀刻速率的平坦观察面。

公开(公告)号：US20130248710A1

公开(公告)日：2013-09-26

申请号：US13842404

申请日：2013-03-15

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Makoto SATO ,  Tatsuya ASAHATA ,  Hidekazu SUZUKI

IPC: H01J37/26

CPC classification number: H01J37/261 ,  H01J37/304 ,  H01J37/3056 ,  H01J2237/221 ,  H01J2237/30466

Abstract: Provided is a cross-section processing and observation apparatus, including a control portion for repeatedly executing a process including slice processing by an ion beam and acquisition of a SIM image by a secondary electron emitted from a cross-section formed by the slice processing, in which the control portion divides an observation image into a plurality of areas, and finishes the process when a change has occurred between an image in one area of the plurality of areas and an image in an area, which corresponds to the one area, of an observation image of another cross-section acquired by the process.

Abstract translation: 本发明提供一种横截面处理和观察装置，包括用于重复执行包括通过离子束进行切片处理的处理的控制部分和通过由切片处理形成的横截面发射的二次电子获取SIM图像的控制部分， 所述控制部将观察图像分割为多个区域，并且当在所述多个区域的一个区域中的图像与对应于所述一个区域的区域中的图像之间发生变化时完成所述处理 通过该过程获得的另一横截面的观察图像。

公开(公告)号：US20250140518A1

公开(公告)日：2025-05-01

申请号：US18692790

申请日：2021-09-28

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Toshiyuki NAGAMINE ,  Atsushi UEMOTO ,  Tatsuya ASAHATA ,  Xin MAN

IPC: H01J37/304 ,  H01J37/26 ,  H01J37/30 ,  H01J37/305

Abstract: This machining method includes: a machining step of irradiating a sample constituted from a stack of multiple layers with a focused ion beam so as to machine a cross-section of the sample by a predetermined amount; an image generation step of generating an observation image of the cross-section of the sample by irradiating the sample with an electron beam after the machining step is ended; and a specific-layer determination step of determining whether a specific layer of the multiple layers is exposed based on the observation image.

公开(公告)号：US20250014859A1

公开(公告)日：2025-01-09

申请号：US18687252

申请日：2021-09-01

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Ayana MURAKI ,  Tatsuya ASAHATA ,  Satoshi TOMIMATSU ,  Makoto SATO

IPC: H01J37/302 ,  H01J37/28

Abstract: The present invention provides a computer, a program, and a charged particle beam processing system, with which it is possible to reduce adjustment and setting work of conditions for observation or machining by an operator in an FIB-SEM composite device. This computer comprises: an information acquisition unit that acquires information related to a recipe to be executed by a charged particle beam device provided with a charged particle irradiation optical system; and an information management unit that generates recipe management information based on the information acquired by the information acquisition unit and stores the recipe management information in a storage unit.

公开(公告)号：US20240379323A1

公开(公告)日：2024-11-14

申请号：US18692789

申请日：2021-09-28

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Toshiyuki NAGAMINE ,  Atsushi UEMOTO ,  Tatsuya ASAHATA ,  Xin MAN

IPC: H01J37/22 ,  H01J37/26

Abstract: The present invention provides a control method for a charged particle beam device for irradiating a sample in which a plurality of layers is laminated with a focused ion beam to process a cross-section of the sample at a processing angle that is a prescribed angle. The control method includes: an image generation step for irradiating the sample with an electron beam, detecting secondary electrons or reflected electrons generated from the sample, and generating an observation image of a cross-section of the sample based on results of detection; an angle deviation calculation step for calculating the angle deviation between the angle of the cross-section and the processing angle based on the observation image; and a control step for controlling orientation of the sample or a direction of radiation with the electron beam so as to eliminate the angle deviation calculated in the angle deviation calculation step.

公开(公告)号：US20240087841A1

公开(公告)日：2024-03-14

申请号：US18272200

申请日：2021-10-21

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Tatsuya ASAHATA

IPC: H01J37/20 ,  H01J37/22

CPC classification number: H01J37/20 ,  H01J37/226 ,  H01J2237/202 ,  H01J2237/24578

Abstract: This sample piece relocating device (10) includes an optical interferometry device (11), a sample piece carrying device (13), and a control device (21). The control device (21) controls the sample piece carrying device (13) based on information relating to processing in which a charged-particle beam device is used to irradiate a sample (S) with a charged-particle beam, thereby preparing a sample piece. The sample piece carrying device (13) controlled by the control device (21) separates and extracts the sample piece from the sample (S) and holds and carries the sample piece to a sample piece holder.

公开(公告)号：US20210293668A1

公开(公告)日：2021-09-23

申请号：US17202761

申请日：2021-03-16

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Xin MAN ,  Tatsuya ASAHATA

IPC: G01N1/28 ,  G01N23/2251 ,  G01N1/30

Abstract: A method for observing a biological tissue sample includes: forming a sample block; cutting up the sample block into a plurality of sample pieces and fixing each of the sample pieces to a sample piece placement member to form a plurality of observation samples; specifying an observation target area for performing precise observation; specifying and registering a coordinate of the observation target area on the sample piece for each of the observation samples; milling including irradiating the observation target area of the sample piece with an ion beam using gas as an ion source or a neutral particle beam with reference to the coordinate and exposing an observation surface inside the sample piece; and obtaining a SEM image of the observation surface with a scanning electron microscope.

公开(公告)号：US20180076001A1

公开(公告)日：2018-03-15

申请号：US15696445

申请日：2017-09-06

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Tatsuya ASAHATA

IPC: H01J37/02 ,  H05H3/00 ,  H01J37/29 ,  H01J37/141 ,  H01J37/305

CPC classification number: H01J37/026 ,  H01J37/141 ,  H01J37/292 ,  H01J37/3056 ,  H01J2237/1405 ,  H05H3/00

Abstract: Disclosed is a composite beam apparatus capable of suppressing the influence of charge build-up, or electric field or magnetic field leakage from an electron beam column when subjecting a sample to cross-section processing with a focused ion beam and then performing finishing processing with another beam. The Composite beam apparatus includes: an electron beam column irradiating an electron beam onto a sample; a focused ion beam column irradiating a focused ion beam onto the sample to form a cross section; a neutral particle beam column having an acceleration voltage set lower than that of the focused ion beam column, and irradiating a neutral particle beam onto the sample to perform finish processing of the cross section, wherein the electron beam column, the focused ion beam column, and the neutral particle beam column are arranged such that the beams of the columns cross each other at an irradiation point.

公开(公告)号：US20160343541A1

公开(公告)日：2016-11-24

申请号：US15162133

申请日：2016-05-23

Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

Inventor： Xin MAN ,  Tatsuya ASAHATA ,  Atsushi UEMOTO

IPC: H01J37/22 ,  H01J37/29 ,  H01J37/305

CPC classification number: H01J37/222 ,  G01N1/32 ,  G01N23/20091 ,  G01N23/2202 ,  G01N23/2251 ,  G01N2223/418 ,  H01J37/28 ,  H01J37/292 ,  H01J37/3053 ,  H01J37/3056 ,  H01J2237/2811 ,  H01J2237/31749

Abstract: A cross-section processing-and-observation method includes: a cross-section exposure step of irradiating a sample with a focused ion beam to expose a cross-section of the sample; a cross-sectional image acquisition step of irradiating the cross-section with an electron beam to acquire a cross-sectional image of the cross-section; and a step of repeatedly performing the cross-section exposure step and the cross-sectional image acquisition step along a predetermined direction of the sample at a setting interval to acquire a plurality of cross-sectional images of the sample. In the cross-sectional image acquisition step, a cross-sectional image is acquired under different condition settings for a plurality of regions of the cross-section.