公开(公告)号：US20180281116A1

公开(公告)日：2018-10-04

申请号：US15763915

申请日：2016-08-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Yuta KONDOH

IPC: B23K26/53 ,  B23K26/04 ,  B23K26/00 ,  B23K26/38 ,  B23K26/08

Abstract: Provided is a laser processing method including a first step of forming a first modified region along a cutting line by converging laser light on an object having a surface and a back surface with the back surface as an incident surface and moving a first converging point along the cutting line set to pass between an effective region and an ineffective region adjacent to each other while maintaining a distance between a surface and the first converging point at a first distance, and a second step of forming a second modified region along the cutting line by converging the laser light on the object with the back surface as the incident surface and moving a second converging point along the cutting line while maintaining a distance between the surface and the second converging point at a second distance larger than the first distance.

公开(公告)号：US20180272465A1

公开(公告)日：2018-09-27

申请号：US15762174

申请日：2016-08-17

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Yuta KONDOH

IPC: B23K26/00 ,  B23K26/04 ,  B23K26/08 ,  B23K26/53

CPC classification number: B23K26/0869 ,  B23K26/0006 ,  B23K26/04 ,  B23K26/048 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/53 ,  H01L21/78

Abstract: A laser processing method includes: a first step of converging laser light having a wavelength larger than 1064 nm on an object to be processed with a rear face of a silicon substrate as a laser light entrance surface and moving a first converging point of the laser light along a line to cut, and thereby forming a first modified region along the line to cut; and a second step of converging the laser light having a wavelength larger than 1064 nm on the object to be processed with the rear face as the laser light entrance surface after the first step and moving a second converging point of the laser light along the line to cut while offsetting the second converging point with respect to a position where the first converging point is aligned, and there by forming a second modified region along the line to cut.

公开(公告)号：US20250025963A1

公开(公告)日：2025-01-23

申请号：US18715221

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364

Abstract: A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.

公开(公告)号：US20240238897A1

公开(公告)日：2024-07-18

申请号：US18014828

申请日：2021-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU ,  Takafumi OGIWARA

IPC: B23K26/067 ,  B23K26/04 ,  B23K26/53

CPC classification number: B23K26/0676 ,  B23K26/04 ,  B23K26/53

Abstract: This laser processing apparatus includes an irradiation unit and a controller. The irradiation unit has a spatial light modulator and a converging part. The controller executes first control for causing the laser light to be modulated such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that fractures that extend from a plurality of modified spots constituting the modified region and stretch along the virtual plane to be connected to each other are present between a converging point of non-modulated light of the laser light and an opposite surface on a side opposite to a laser light incidence surface of the object in the irradiation direction.

公开(公告)号：US20240033859A1

公开(公告)日：2024-02-01

申请号：US18268383

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/38 ,  B23K37/00

CPC classification number: B23K26/38 ,  B23K37/00

Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.

公开(公告)号：US20230154774A1

公开(公告)日：2023-05-18

申请号：US17916837

申请日：2021-03-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Iku SANO

IPC: H01L21/67 ,  H01L21/66 ,  B23K26/53

CPC classification number: H01L21/67253 ,  H01L22/12 ,  H01L22/24 ,  B23K26/53

Abstract: An inspection device includes: a laser irradiation unit; an imaging unit; and a control unit. The control unit is configured to execute a processing process of controlling the laser irradiation unit according to a recipe set such that a plurality of modified regions are formed inside a wafer by irradiating the wafer with a laser beam and a full-cut state where cracks extending from the modified regions have reached a back surface and a surface is attained; an identification process of identifying a state of the crack on the back surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal; and a determination process of determining whether or not a dicing force applied to the wafer according to the recipe is proper, based on information identified in the identification process.

公开(公告)号：US20230113051A1

公开(公告)日：2023-04-13

申请号：US17908293

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Iku SANO

IPC: H01L21/67 ,  H01L21/66

Abstract: This inspection device includes: a laser irradiation unit that irradiates a wafer having a back surface and a front surface with a laser beam from the back surface side of the wafer; an imaging unit that outputs light having permeability to the wafer and detects the light propagating through the wafer; and a control part configured to perform a first process of controlling the laser irradiation unit so that a modified region is formed inside the wafer by irradiating the wafer with the laser beam and a second process of deriving a position of the modified region on the basis of a signal output from the imaging unit that detects the light and deriving a thickness of the wafer on the basis of the derived position of the modified region and a set recipe.

公开(公告)号：US20170106476A1

公开(公告)日：2017-04-20

申请号：US15301451

申请日：2015-03-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA

IPC: B23K26/53 ,  C03B33/02 ,  B23K26/082 ,  B23K26/03 ,  B23K26/064

CPC classification number: B23K26/53 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0738 ,  B23K26/082 ,  B23K2101/40 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/07

Abstract: A laser processing device includes a laser light source, a converging optical system, a controller, and a reflective spatial light modulator. The controller and the reflective spatial light modulator, while using an aberration as a reference aberration, the aberration occurring when laser light is converged at a converging position with an amount of aberration correction in a state in which an ideal converging position is shifted by a predetermined distance to a laser light entrance side from the converging position, adjusts the aberration such that a first converging length longer than a reference converging length of the reference aberration is obtained and a first converging intensity less than a reference converging intensity of the reference aberration is obtained, when a modified region is formed within a first region closest to a front face of an object to be processed.

公开(公告)号：US20250050454A1

公开(公告)日：2025-02-13

申请号：US18718561

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364 ,  B23K26/53 ,  B23K101/40

Abstract: A laser processing method includes: a step of forming a first groove in an object along a line by irradiating the object with laser light; a step of forming a second groove in the object along the line by irradiating the object with laser light, the second groove overlapping an end portion of the first groove in the width direction of the first groove; and a step of forming a modified region inside the object along the line by irradiating the object with laser light and extending a crack from the modified region after forming a composite groove including the first groove and the second groove in the object.

公开(公告)号：US20240051067A1

公开(公告)日：2024-02-15

申请号：US18266842

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/351 ,  B23K26/064 ,  B23K26/04

CPC classification number: B23K26/351 ,  B23K26/064 ,  B23K26/048

Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.