公开(公告)号：US20240238905A1

公开(公告)日：2024-07-18

申请号：US18014819

申请日：2021-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU ,  Takafumi OGIWARA

IPC: B23K26/38

CPC classification number: B23K26/38

Abstract: This laser processing apparatus includes an irradiation unit and a controller. The irradiation unit has a spatial light modulator and a converging part. The controller executes first control for causing the laser light to be modulated by the spatial light modulator such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays of processing light are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that the modified region is present between a converging point of non-modulated light of the laser light and an opposite surface on a side opposite to a laser light incidence surface of the object in the irradiation direction.

公开(公告)号：US20230294212A1

公开(公告)日：2023-09-21

申请号：US18014806

申请日：2021-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU ,  Takafumi OGIWARA

IPC: B23K26/40 ,  B23K26/067 ,  B23K26/08 ,  B23K26/06

CPC classification number: B23K26/40 ,  B23K26/0676 ,  B23K26/0884 ,  B23K26/0648 ,  B23K26/0643 ,  B23K2101/40

Abstract: This laser processing apparatus includes a controller. The controller executes first control for causing the laser light to be modulated such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that, in the irradiation direction, the converging point of each of the plurality of rays is positioned on a side opposite to a converging point of non-modulated light of the laser light with respect to an ideal converging point of the processing light, or the converging point of each of the plurality of rays is positioned on a side opposite to the ideal converging point with respect to the converging point of the non-modulated light.

公开(公告)号：US20210053157A1

公开(公告)日：2021-02-25

申请号：US16605292

申请日：2018-04-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Tomoya TAGUCHI

IPC: B23K26/364 ,  B23K26/38 ,  B23K26/53 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/311

Abstract: An object cutting method includes: a first step of preparing an object including a single crystal silicon substrate and a functional device layer provided on a first main surface side; a second step of irradiating the object with laser light to form at least one row of modified regions in the single crystal silicon substrate and to form a fracture in the object so as to extend between the at least one row of modified regions and a second main surface of the object; and a third step of performing dry etching on the object from the second main surface side to form a groove opening to the second main surface. In the third step, in a state in which an etching protection layer having a gas passing region formed, is formed on the second main surface, the dry etching is performed by using a xenon difluoride gas.

公开(公告)号：US20250105011A1

公开(公告)日：2025-03-27

申请号：US18726138

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: H01L21/268

Abstract: A laser processing method including: a first step of preparing a wafer having a first region and a second region; a second step of irradiating the street with a predetermined first laser beam; and a third step of irradiating the street with a predetermined second laser beam after the second step, the first laser beam being a laser beam having processing energy for removing a part of the insulating film in the first region to leave the other part, completely removing the metal structure in the second region, and removing a part of the insulating film in the second region to leave the other part, and the second laser beam being a laser beam having processing energy for completely removing the insulating film in the first region and the insulating film in the second region after the second step.

公开(公告)号：US20240082959A1

公开(公告)日：2024-03-14

申请号：US18268652

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/364 ,  H01L21/268

CPC classification number: B23K26/53 ,  B23K26/032 ,  B23K26/364 ,  H01L21/268 ,  B23K2103/56

Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.

公开(公告)号：US20220410311A1

公开(公告)日：2022-12-29

申请号：US17781146

申请日：2020-12-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Tsubasa HIROSE ,  Takeshi SAKAMOTO

IPC: B23K26/06

Abstract: A laser processing device comprising: a light source configured to output laser light; a spatial light modulator configured to display a modulation pattern for modulating the laser light output from the light source; a condenser lens configured to condense the laser light modulated by the spatial light modulator, on an object; and a control unit configured to control the spatial light modulator to adjust the modulation pattern in accordance with a traveling direction of a condensing point of the laser light with respect to the object.

公开(公告)号：US20220355413A1

公开(公告)日：2022-11-10

申请号：US17641533

申请日：2020-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Takeshi SAKAMOTO

IPC: B23K26/067 ,  B23K26/03

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in a Y direction.

公开(公告)号：US20240375210A1

公开(公告)日：2024-11-14

申请号：US18568919

申请日：2022-06-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA

IPC: B23K26/062

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, a moving part, and a control part. When a relative movement direction of a first converging point of first processing light and a second converging point of second processing light is set to an X direction, and a direction perpendicular to a Z direction and the X direction is set to a Y direction, the control part controls the spatial light modulator and the moving part such that the first converging point and the second converging point relatively move along a first line and a second line in the object in a state where the first converging point and the second converging point are shifted from each other in each of the X direction and the Y direction.

公开(公告)号：US20240207978A1

公开(公告)日：2024-06-27

申请号：US18288613

申请日：2022-01-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Hayate JOAN

IPC: B23K26/53 ,  B23K26/073

CPC classification number: B23K26/53 ,  B23K26/073

Abstract: A laser processing device includes: a laser irradiation unit; and a control unit. The control unit is configured to execute a first control to control the laser irradiation unit to form modified regions for division along each of lines extending in an X direction and cracks extending from the modified regions in a direction of a surface, a second control to control the laser irradiation unit to form modified regions for division along each of a plurality of lines in a Y direction and cracks extending from the modified regions in the direction of the surface, and a third control to control the laser irradiation unit to form cracks extending from a plurality of modified regions for suppressing warpage before the second control, the cracks being formed to reach a back surface and not to be continuous with the cracks extending from the modified regions for division.

公开(公告)号：US20230146811A1

公开(公告)日：2023-05-11

申请号：US17914863

申请日：2021-03-04

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuta KONDOH ,  Takafumi OGIWARA

IPC: B23K26/066 ,  B23K26/53 ,  B23K26/073

CPC classification number: B23K26/066 ,  B23K26/53 ,  B23K26/073

Abstract: A laser processing device includes: a stage that supports a wafer having a front surface, on which a plurality of functional elements are formed and a street region extends so as to pass between adjacent functional elements, and a back surface on a side opposite to the front surface; a light source that emits laser light to the wafer from the front surface side to form one or more modified regions inside the wafer; a spatial light modulator as a beam width adjusting unit; and a control unit that controls the spatial light modulator so that the beam width of the laser light is adjusted to be equal to or less than the width of the street region and a target beam width according to surface information including the position and height of a structure forming a functional element adjacent to the street region.