公开(公告)号：US20170133110A1

公开(公告)日：2017-05-11

申请号：US15323116

申请日：2015-05-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nakahiro SATOH ,  Ryo YOSHIMURA ,  Masaru TAKAGI ,  Toshiyuki KAWASHIMA ,  Hirofumi KAN

IPC: G21B1/19 ,  B01J13/04

CPC classification number: G21B1/19 ,  B01J13/04 ,  B01J13/06 ,  B01J13/12 ,  B01J13/14 ,  B01J13/203 ,  C08J3/14 ,  G21B1/15

Abstract: The present invention relates to a method for manufacturing a fuel capsule for laser fusion, the method including a liquid droplet formation step, using a combined nozzle 3 equipped with a first nozzle 6 and a second nozzle 7 having a discharge port surrounding a discharge port 61 of the first nozzle, of discharging water 8 from the first nozzle and organic liquids 9A, 9B containing an organic solvent from the second nozzle simultaneously into a stabilizing liquid 13 to thereby form liquid droplets 12 in which the water is covered with the organic liquids, an organic solvent removal step of removing the organic solvent from the liquid droplets, and a water removal step of removing the water covered with the organic liquid having formed the liquid droplets. The first organic polymer and the second organic polymer are used which can be mutually phase-separated.

公开(公告)号：US20250105011A1

公开(公告)日：2025-03-27

申请号：US18726138

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: H01L21/268

Abstract: A laser processing method including: a first step of preparing a wafer having a first region and a second region; a second step of irradiating the street with a predetermined first laser beam; and a third step of irradiating the street with a predetermined second laser beam after the second step, the first laser beam being a laser beam having processing energy for removing a part of the insulating film in the first region to leave the other part, completely removing the metal structure in the second region, and removing a part of the insulating film in the second region to leave the other part, and the second laser beam being a laser beam having processing energy for completely removing the insulating film in the first region and the insulating film in the second region after the second step.

公开(公告)号：US20240082959A1

公开(公告)日：2024-03-14

申请号：US18268652

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/364 ,  H01L21/268

CPC classification number: B23K26/53 ,  B23K26/032 ,  B23K26/364 ,  H01L21/268 ,  B23K2103/56

Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.

公开(公告)号：US20250050454A1

公开(公告)日：2025-02-13

申请号：US18718561

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364 ,  B23K26/53 ,  B23K101/40

Abstract: A laser processing method includes: a step of forming a first groove in an object along a line by irradiating the object with laser light; a step of forming a second groove in the object along the line by irradiating the object with laser light, the second groove overlapping an end portion of the first groove in the width direction of the first groove; and a step of forming a modified region inside the object along the line by irradiating the object with laser light and extending a crack from the modified region after forming a composite groove including the first groove and the second groove in the object.

公开(公告)号：US20240051067A1

公开(公告)日：2024-02-15

申请号：US18266842

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/351 ,  B23K26/064 ,  B23K26/04

CPC classification number: B23K26/351 ,  B23K26/064 ,  B23K26/048

Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.

公开(公告)号：US20250025963A1

公开(公告)日：2025-01-23

申请号：US18715221

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364

Abstract: A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.

公开(公告)号：US20240033859A1

公开(公告)日：2024-02-01

申请号：US18268383

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/38 ,  B23K37/00

CPC classification number: B23K26/38 ,  B23K37/00

Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.

公开(公告)号：US20230226639A1

公开(公告)日：2023-07-20

申请号：US18007808

申请日：2021-06-04

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Ryo YOSHIMURA

IPC: B23K26/0622 ,  B23K26/356 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/356 ,  C21D10/005

Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

公开(公告)号：US20240030672A1

公开(公告)日：2024-01-25

申请号：US18032403

申请日：2021-09-29

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Ryo YOSHIMURA ,  Ryo MAKINO ,  Yuu TAKIGUCHI

IPC: H01S3/00 ,  G02F1/133 ,  G02F1/137 ,  G02F1/01 ,  B23K26/064

CPC classification number: H01S3/0085 ,  H01S3/0014 ,  G02F1/13318 ,  G02F1/137 ,  G02F1/0136 ,  B23K26/064

Abstract: Disclosed is a laser device including: a laser light source configured to emit laser light; a phase control unit configured to receive the laser light emitted from the laser light source, to control a spatial phase of a portion of the laser light, to emit the portion of the light as control light, and to emit another portion of the laser light as non-control light; a first optical system configured to irradiate an object with the control light emitted from the phase control unit; a detector configured to detect the non-control light emitted from the phase control unit; a second optical system configured to cause the non-control light emitted from the phase control unit to converge toward a detection surface of the detector.

公开(公告)号：US20230330779A1

公开(公告)日：2023-10-19

申请号：US18027440

申请日：2021-07-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuki KABEYA ,  Takashi KURITA ,  Ryo YOSHIMURA ,  Takeshi WATARI

IPC: B23K26/082 ,  B23K26/38

CPC classification number: B23K26/38 ,  B23K26/082

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.