公开(公告)号：US20250025963A1

公开(公告)日：2025-01-23

申请号：US18715221

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364

Abstract: A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.

公开(公告)号：US20240033859A1

公开(公告)日：2024-02-01

申请号：US18268383

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/38 ,  B23K37/00

CPC classification number: B23K26/38 ,  B23K37/00

Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.

公开(公告)号：US20180236608A1

公开(公告)日：2018-08-23

申请号：US15753311

申请日：2016-08-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Yo SUGIMOTO

IPC: B23K26/53 ,  B23K26/364 ,  B23K26/00 ,  B23K26/06

CPC classification number: B23K26/53 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/083 ,  B23K26/364

Abstract: A laser processing device includes: a support table configured to support an object to be processed; a laser light source configured to emit laser light; a converging optical system configured to converge the laser light at the object; an imaging unit configured to image a front surface of the object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the substrate along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the substrate on the basis of an image of the crack.

公开(公告)号：US20180236597A1

公开(公告)日：2018-08-23

申请号：US15752685

申请日：2016-08-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Yo SUGIMOTO

IPC: B23K26/00 ,  B23K26/53 ,  B23K26/03

Abstract: The object to be processed cutting method includes: a crystal orientation identifying step of identifying a crystal orientation of the substrate; a line to cut setting step of setting, for the object to be processed, a line to cut passing through a street region formed between adjacent functional devices, after the crystal orientation identifying step; and a cutting step of cutting the object to be processed along the line to cut, after the line to cut setting step. In the line to cut setting step, in a case where an extending direction of the street region does not match the crystal orientation, the line to cut parallel to the crystal orientation and inclined with respect to the extending direction of the street region, is set for the object to be processed.

公开(公告)号：US20250105011A1

公开(公告)日：2025-03-27

申请号：US18726138

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: H01L21/268

Abstract: A laser processing method including: a first step of preparing a wafer having a first region and a second region; a second step of irradiating the street with a predetermined first laser beam; and a third step of irradiating the street with a predetermined second laser beam after the second step, the first laser beam being a laser beam having processing energy for removing a part of the insulating film in the first region to leave the other part, completely removing the metal structure in the second region, and removing a part of the insulating film in the second region to leave the other part, and the second laser beam being a laser beam having processing energy for completely removing the insulating film in the first region and the insulating film in the second region after the second step.

公开(公告)号：US20250100085A1

公开(公告)日：2025-03-27

申请号：US18727716

申请日：2022-10-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Yuta KONDOH ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/04 ,  B23K26/38 ,  B23K101/40

Abstract: There is provided a processing condition acquisition method for acquiring conditions of laser processing for forming a weakened region in a functional element layer by irradiating an object with laser light from a first surface side, the object including a substrate including a first surface and a second surface opposite to the first surface, and the functional element layer provided on the second surface of the substrate, the method including: a first step of performing first processing as the laser processing a plurality of times at different positions in the first surface while changing a converging position of the laser light in a Z direction intersecting the first surface within a range including an interface between the substrate and the functional element layer.

公开(公告)号：US20240082959A1

公开(公告)日：2024-03-14

申请号：US18268652

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/364 ,  H01L21/268

CPC classification number: B23K26/53 ,  B23K26/032 ,  B23K26/364 ,  H01L21/268 ,  B23K2103/56

Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.

公开(公告)号：US20250050454A1

公开(公告)日：2025-02-13

申请号：US18718561

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364 ,  B23K26/53 ,  B23K101/40

Abstract: A laser processing method includes: a step of forming a first groove in an object along a line by irradiating the object with laser light; a step of forming a second groove in the object along the line by irradiating the object with laser light, the second groove overlapping an end portion of the first groove in the width direction of the first groove; and a step of forming a modified region inside the object along the line by irradiating the object with laser light and extending a crack from the modified region after forming a composite groove including the first groove and the second groove in the object.

公开(公告)号：US20240253154A1

公开(公告)日：2024-08-01

申请号：US18289269

申请日：2022-03-24

Applicant: HAMAMATSU PHOTONICS K.K. ,  Tokyo Electron Limited

Inventor： Yo SUGIMOTO ,  Yohei YAMASHITA

IPC: B23K26/0622 ,  B23K26/03 ,  B23K31/12 ,  B23K101/40

CPC classification number: B23K26/0622 ,  B23K26/032 ,  B23K31/12 ,  B23K2101/40

Abstract: Provided is a laser processing apparatus configured to irradiate a substrate including a first main surface and a second main surface opposite to the first main surface with processing laser light. The laser processing apparatus includes: a processing irradiation unit configured to irradiate the substrate with the processing laser light from the second main surface side; an observation irradiation unit configured to irradiate the substrate with observation transmission light from the second main surface side; an imaging element configured to image the observation transmission light from the substrate; and a controller configured to execute a processing process of irradiating the substrate with the processing laser light by controlling the processing irradiation unit, and a characteristic acquisition process of irradiating the substrate with the observation transmission light, imaging the observation transmission light from the substrate.

公开(公告)号：US20240181560A1

公开(公告)日：2024-06-06

申请号：US18285520

申请日：2022-03-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO

IPC: B23K26/0622 ,  B23K26/38

CPC classification number: B23K26/0622 ,  B23K26/38

Abstract: A laser machining method performed by a laser machining device includes: a first step of flattening an irradiation surface through laser annealing by irradiating a surface or a back surface of an object with a laser beam, the object including a functional element layer on a surface side; and a second step of forming a modified layer inside the object by irradiating the irradiation surface, which is flattened in the first step, with a laser beam. A pulse pitch of the laser beam is shorter than a pulse pitch of the laser beam.