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公开(公告)号：US20140299362A1
公开(公告)日：2014-10-09
申请号：US14244087
申请日：2014-04-03
Inventor： Chan Woo PARK , Jae Bon KOO , Soon-Won JUNG , Sang Chul LIM , Ji-Young OH , Bock Soon NA , Sang Seok LEE , Hye Yong CHU
CPC classification number: H05K1/0283 , H01L2224/04105 , H01L2224/96 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K2201/0162 , H05K2201/2009 , Y10T29/4913
Abstract: Provided are a stretchable electric circuit and a manufacturing method thereof The method for manufacturing the stretchable electric circuit includes forming a mold substrate, forming a stretchable substrate having a first flat surface and a first corrugated surface outside the first flat surface on the mold substrate, removing the mold substrate, forming a corrugated wire on the first corrugated surface, and forming an electric device connected to the corrugated wire on the first flat surface.
Abstract translation: 本发明提供一种伸缩性电路及其制造方法本发明的拉伸电路的制造方法包括：形成模具基板，在模具基板的第一平面的外侧形成具有第一平坦面和第一波纹状表面的伸缩性基板， 所述模具基板在所述第一波纹状表面上形成波纹状线，以及在所述第一平坦表面上形成连接到所述波纹状电线的电气装置。
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公开(公告)号：US20170186876A1
公开(公告)日：2017-06-29
申请号：US15461567
申请日：2017-03-17
Inventor： Kyoung Ik CHO , Jae Bon KOO , Chan Woo PARK , Bock Soon NA , Sang Seok LEE , Sang Chul LIM , Soon-Won JUNG , Hye Yong CHU
IPC: H01L29/786 , H01L21/311 , H01L29/66
CPC classification number: H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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13.发明申请公开(公告)号：US20170053894A1
公开(公告)日：2017-02-23
申请号：US15220145
申请日：2016-07-26
Inventor： Chan Woo PARK , Jae Bon KOO , Bock Soon NA , Rae-Man PARK , Ji-Young OH , Sang Seok LEE , Soon-Won JUNG
IPC: H01L23/00
CPC classification number: H01L24/43 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L2221/6835 , H01L2224/24137 , H01L2924/00014 , H01L2224/45099
Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.
Abstract translation: 本发明提供一种拉伸线的制造方法，其特征在于，除去基板上的光致抗蚀剂层的一部分，形成包含至少一个图案狭缝的光致抗蚀剂图案，在所述光致抗蚀剂图案上涂布液相导电材料，形成液体 在导电结构上形成可拉伸的第一绝缘层，去除光致抗蚀剂图案，并将液相导电结构和第一绝缘层与基片分开。
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公开(公告)号：US20160246151A1
公开(公告)日：2016-08-25
申请号：US15007844
申请日：2016-01-27
Inventor： Ji-Young OH , Jae Bon KOO , Joo Yeon KIM , Bock Soon NA , Chan Woo PARK , Sang Seok LEE , Soon-Won JUNG , Seong-Mok CHO , Hye Yong CHU
IPC: G02F1/155
CPC classification number: G02F1/155 , G02F2001/1519
Abstract: Provided is a color changeable device which includes a first substrate and a second substrate that are spaced apart from each other, a first transparent electrode disposed on the first substrate, a second transparent electrode disposed on the second substrate, an electrochromic layer disposed between the first transparent electrode and the second transparent electrode, an organic layer disposed between the first transparent electrode and the electrochromic layer. The organic layer may include a hole injection layer or an electron injection layer. The organic layer may further include a hole transport layer or an electron transport layer.
Abstract translation: 提供了一种可变色装置，其包括彼此间隔开的第一基板和第二基板，设置在第一基板上的第一透明电极，设置在第二基板上的第二透明电极，设置在第一基板之间的电致变色层 透明电极和第二透明电极，设置在第一透明电极和电致变色层之间的有机层。 有机层可以包括空穴注入层或电子注入层。 有机层还可以包括空穴传输层或电子传输层。
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15.发明申请公开(公告)号：US20150048375A1
公开(公告)日：2015-02-19
申请号：US14243768
申请日：2014-04-02
Inventor： Ji-Young OH , Jae Bon KOO , Sang Chul LIM , Chan Woo PARK , Soon-Won JUNG , Bock Soon NA , Sang Seok LEE , Hye Yong CHU
IPC: H01L29/786 , B29C59/16 , B29C43/02 , B29C59/02
CPC classification number: H01L29/78603 , B29C35/0266 , B29C43/021 , B29C43/18 , B29C43/203 , B29C59/02 , B29C71/04 , B29K2021/00 , B29K2075/00 , B29K2083/00 , H01L27/1218 , H01L27/1225 , H01L27/1262 , H01L29/7869 , Y10T428/19
Abstract: Provided is a method of manufacturing a gradually stretchable substrate. The method includes forming convex regions and concave regions on a top surface of a stretchable substrate by compressing a mold onto the stretchable substrate and forming non-stretchable patterns by filling the concave regions of the stretchable substrate. The stretchable substrate includes a stretchable region defined by the non-stretchable patterns, the non-stretchable patterns have side surfaces in contact with the stretchable region, and the side surfaces of the non-stretchable patterns are formed of protrusions and a non-protrusion between the protrusions repetitively connected to one another.
Abstract translation: 提供一种制造逐渐拉伸基材的方法。 该方法包括通过将模具压缩到可拉伸基底上并在可伸缩基底的凹部填充而形成不可拉伸图案，在可拉伸基底的顶表面上形成凸区域和凹区域。 可拉伸基材包括由不可拉伸图案限定的可拉伸区域，不可拉伸图案具有与可拉伸区域接触的侧表面，并且不可拉伸图案的侧表面由突起和非伸缩图案之间的非突起形成 突起重复地彼此连接。
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Patent Agency Ranking
公开(公告)号：US20140205747A1
公开(公告)日：2014-07-24
申请号：US14225745
申请日：2014-03-26
Inventor： Yong Suk YANG , In-Kyu YOU , Jae Bon KOO , Su Jae LEE , Taeyoub KIM , Soon-Won JUNG , Kang-Jun BAEG
CPC classification number: H01B13/06 , H01B3/421 , H01B7/0838 , H01B7/0861 , H01B13/0013
Abstract: A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer.
Abstract translation: 一种柔性扁平电缆，包括线芯，围绕线芯的绝缘涂层，围绕绝缘涂层的屏蔽涂层，形成在屏蔽涂层上的上绝缘板层，形成在屏蔽涂层下面的下绝缘板层，以及 与上绝缘板层相对，以及形成在下绝缘板层下方的屏蔽板层。
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公开(公告)号：US20180277684A1
公开(公告)日：2018-09-27
申请号：US15994097
申请日：2018-05-31
Inventor： Kyoung Ik CHO , Jae Bon KOO , Chan Woo PARK , Bock Soon NA , Sang Seok LEE , Sang Chul LIM , Soon-Won JUNG , Hye Yong CHU
IPC: H01L29/786 , H01L27/12 , H01L21/311 , H01L21/3105 , H01L29/66
CPC classification number: H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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公开(公告)号：US20150349136A1
公开(公告)日：2015-12-03
申请号：US14611142
申请日：2015-01-30
Inventor： Jae Bon KOO , Chan Woo PARK , Soon-Won JUNG , Bock Soon NA , Sang Chul LIM , Sang Seok LEE , Kyoung Ik CHO , Hye Yong CHU
IPC: H01L29/786 , H01L21/428 , H01L21/02 , H01L29/66
CPC classification number: H01L29/78603 , H01L21/428 , H01L21/7813 , H01L27/1218 , H01L27/124 , H01L27/1248 , H01L27/1266 , H01L27/1292 , H01L29/66969 , H01L29/7869
Abstract: Methods for manufacturing semiconductor devices according to embodiments of the present invention may include providing a sacrificial substrate including a wiring region and a device region, sequentially forming a sacrificial layer and a buffer layer on the sacrificial substrate, forming a thin-film transistor on the buffer layer of the device region, forming a device protection element surrounding the thin-film transistor within the device region, forming a flexible substrate on the buffer layer, and exposing a surface of the buffer layer by separating the sacrificial substrate by removing the sacrificial layer. Since typical semiconductor process technologies may be directly used, the process compatibility may be improved, and semiconductor devices having high resolution and high performance may be manufactured. Furthermore, since the thin-film transistor is protected by the device protection element, the deformation of semiconductor devices under flexibility conditions may be prevented, thereby improving the reliability of the semiconductor devices.
Abstract translation: 根据本发明的实施例的制造半导体器件的方法可以包括提供包括布线区域和器件区域的牺牲衬底，在牺牲衬底上依次形成牺牲层和缓冲层，在缓冲器上形成薄膜晶体管 在器件区域内形成围绕薄膜晶体管的器件保护元件，在缓冲层上形成柔性衬底，并通过去除牺牲层来分离牺牲衬底来暴露缓冲层的表面。 由于可以直接使用典型的半导体工艺技术，因此可以提高工艺兼容性，并且可以制造具有高分辨率和高性能的半导体器件。 此外，由于薄膜晶体管被器件保护元件保护，所以可以防止半导体器件在柔性条件下的变形，从而提高半导体器件的可靠性。
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公开(公告)号：US20150171354A1
公开(公告)日：2015-06-18
申请号：US14280578
申请日：2014-05-17
Inventor： Sang Seok LEE , Kyoung Ik CHO , Bock Soon NA , Sang Chul LIM , Chan Woo PARK , Soon-Won JUNG , Jae Bon KOO , Hye Yong CHU
CPC classification number: H01L27/3244 , H01L51/003 , H01L51/0094 , H01L51/0097 , H01L51/56 , Y02E10/549
Abstract: Provided is a method for fabricating a flexible display device. The method includes attaching a shape memory alloy film memorizing a shape thereof as a curved shape at a shape memory temperature or lower to a flexible substrate at a temperature higher than the shape memory temperature, forming a display device on the flexible substrate, and returning the shape memory alloy to the curved shape to remove the shape memory alloy film from the flexible substrate.
Abstract translation: 提供一种制造柔性显示装置的方法。 该方法包括将形状记忆合金膜在高于形状记忆温度的温度下将其形状记忆温度保持为形状记忆温度以下的形状记忆合金薄膜，形成柔性基板，在柔性基板上形成显示装置， 形状记忆合金到弯曲形状，以从柔性基底去除形状记忆合金膜。
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公开(公告)号：US20140085840A1
公开(公告)日：2014-03-27
申请号：US13772288
申请日：2013-02-20
Inventor： Chan Woo PARK , Jae Bon KOO , Sang Chul LIM , Ji-Young OH , Soon-Won JUNG
CPC classification number: H05K3/10 , H05K1/0283 , H05K1/0287 , H05K1/181 , H05K3/0014 , H05K3/284
Abstract: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.
Abstract translation: 提供一种电子电路，其包括具有平坦器件区域和弯曲互连区域的衬底。 导线可以沿着互连区域中的不平坦部分延伸并且可以是弯曲的。 不平坦部分和导电线可以具有波浪形状。 施加到电子电路的外力可能被不平坦部分和导电线吸收。 电子设备可能不受外力的影响。 因此，可以保持电子电路的功能。 根据本发明的制造电子电路的方法可以容易地调整互连区域和器件区域的面积和位置。
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