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    STRETCHABLE ELECTRONIC DEVICE
    1.
    发明公开
    STRETCHABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230384832A1

    公开(公告)日：2023-11-30

    申请号：US18315247

    申请日：2023-05-10

    Applicant: Electronics and Telecommunications Research Institute

    Inventor： Jae Bon KOO ,  Ji-Young OH ,  Himchan OH ,  Chan Woo PARK

    IPC: G06F1/16

    CPC classification number: G06F1/1652

    Abstract: Provided is a stretchable electronic device. The stretchable electronic device includes: a substrate; a plurality of electronic elements disposed on the substrate; and a line part configured to connect the electronic elements on the substrate and having a curved portion. Here, the line part includes: an insulator; and a plurality of metal lines disposed on the insulator, and the metal lines include: outermost metal lines adjacent to edges of the insulator; and inner metal lines disposed between the outermost metal lines. Also, a first ratio of a first distance between the outermost metal lines and the edges of the insulator to a first width of each of the outermost metal lines is greater than a second ratio of a second distance between the inner metal lines to a second width of each of the inner metal lines.

    FLEXIBLE TOUCH PANEL AND METHOD OF MANUFACTURING THEREOF
    2.
    发明公开
    FLEXIBLE TOUCH PANEL AND METHOD OF MANUFACTURING THEREOF 审中-公开

    公开(公告)号：US20230152930A1

    公开(公告)日：2023-05-18

    申请号：US17903145

    申请日：2022-09-06

    Applicant: Electronics and Telecommunications Research Institute

    Inventor： Chan Woo PARK ,  Sang Hoon CHEON ,  Tae-Youb KIM ,  Bock Soon NA ,  Ji-Young OH ,  Su Jae LEE

    IPC: G06F3/044

    CPC classification number: G06F3/0446 ,  G06F2203/04111 ,  G06F2203/04112 ,  G06F2203/04102 ,  G06F2203/04103

    Abstract: Provided is a flexible touch panel. The flexible touch panel includes a first sensor part extending in a first direction on a substrate, a second sensor part extending in a second direction crossing the first direction on the substrate, and a protective layer surrounding the first and second sensor parts, wherein the first sensor part includes first sensor patterns spaced apart from each other in the first direction, a first connection electrode disposed between the first sensor patterns adjacent to each other, and first connection patterns connecting the first connection electrode and the first sensor patterns to each other, wherein each of the first sensor patterns includes first electrode patterns spaced apart from each other in a form of a mesh and first wiring patterns connecting the adjacent first electrode patterns to each other, wherein each of the first wiring patterns and the first connection patterns has a serpentine structure, wherein the first electrode patterns and the first wiring patterns include the same material as each other.

    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
    5.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    电子设备及其制造方法

    公开(公告)号：US20150348800A1

    公开(公告)日：2015-12-03

    申请号：US14610410

    申请日：2015-01-30

    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

    Inventor： Kyoung Ik CHO ,  Jae Bon KOO ,  Chan Woo PARK ,  Bock Soon NA ,  Sang Seok LEE ,  Sang Chul LIM ,  Soon-Won JUNG ,  Hye Yong CHU

    IPC: H01L21/311 ,  H01L29/66 ,  H01L29/786

    CPC classification number: H01L29/78603 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31144 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/66742

    Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

    Abstract translation: 本发明提供一种电子器件的制造方法，该方法包括：制备包括元件区域和布线区域的载体衬底; 在载体基板上形成牺牲层; 在元件区域的牺牲层上形成电子元件; 在布线区域的第一弹性层上形成具有波纹状表面的第一弹性层; 在布线区域的第一弹性层上形成电连接电子元件的金属配线; 在所述第一弹性层上形成覆盖所述金属布线的第二弹性层; 在所述电子元件上方的所述第二弹性层的凹部中形成高刚性图案，以与所述电子元件重叠，并具有波纹状表面; 在第二弹性层上形成第三弹性层和高刚性图案; 并分离载体衬底。

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