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公开(公告)号：US11959819B2
公开(公告)日：2024-04-16
申请号：US17317337
申请日：2021-05-11
Inventor： Su Jae Lee , Seong Hyun Kim , Chan Woo Park , Jae Bon Koo , Bock Soon Na , Ji-Young Oh
Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.
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公开(公告)号：US11621389B2
公开(公告)日：2023-04-04
申请号：US17023730
申请日：2020-09-17
Inventor： Kang-Ho Park , Seongdeok Ahn , Jong Tae Lim , Chan Woo Park , Ji-Young Oh
IPC: H01L41/047 , H01L41/053 , H01L41/083
Abstract: Provided is a low frequency vibrating actuator device. The low frequency vibrating actuator device includes a substrate including a pair of connection electrodes, an actuator provided on the pair of connection electrodes to generate vibration, a support provided on the actuator, a vibration membrane provided on the support to vibrate according to the actuator, and a vibrating mass provided on the vibration membrane to vibrate according to the vibration membrane. The actuator includes a plurality of laminated insulating layers and internal electrodes that are alternately laminated between the insulating layers adjacent to each other, and a top surface of the support, which contacts the vibration membrane, has an area that is equal to or less than that of a bottom surface of the support, which contacts the actuator.
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公开(公告)号：US11424299B2
公开(公告)日：2022-08-23
申请号：US16842396
申请日：2020-04-07
Inventor： Ji-Young Oh , Seung Youl Kang , Seongdeok Ahn , Jeong Ik Lee , Chi-Sun Hwang , Byoung-Hwa Kwon , Tae-Youb Kim , Jeho Na , Sooji Nam , Jaehyun Moon , Young Sam Park , Chan Woo Park , Doo-Hee Cho , Chul Woong Joo , Jae-Eun Pi
Abstract: Provided is a pressure sensitive display device including a sensing substrate, a reaction substrate provided on the sensing substrate, and spacers provided between the sensing substrate and the reaction substrate to space the sensing substrate apart from the reaction substrate. Here, the sensing substrate includes a flexible substrate and a touch electrode provided on one surface of the flexible substrate, which faces the reaction substrate. The reaction substrate includes a transparent substrate, a transparent electrode provided on one surface of the transparent substrate, which faces the sensing substrate, and a light emitting layer disposed on the transparent electrode.
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公开(公告)号：US09842669B2
公开(公告)日：2017-12-12
申请号：US15220866
申请日：2016-07-27
Inventor： Chan Woo Park , Jae Bon Koo , Bock Soon Na , Rae-Man Park , Ji-Young Oh , Sang Seok Lee , Soon-Won Jung
IPC: H01B7/00 , H01B7/06 , H01B13/008 , H05K1/02
CPC classification number: H01B7/06 , H01B13/008 , H05K1/0283 , H05K3/007 , H05K3/107 , H05K3/20 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2203/016 , H05K2203/0568 , H05K2203/128
Abstract: A stretchable wire including a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.
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公开(公告)号：US11832486B2
公开(公告)日：2023-11-28
申请号：US17943528
申请日：2022-09-13
Inventor： Jong-Heon Yang , Seung Youl Kang , Yong Hae Kim , Hee-ok Kim , Jeho Na , Jaehyun Moon , Chan Woo Park , Himchan Oh , Seong-Mok Cho , Sung Haeng Cho , Ji Hun Choi , Jae-Eun Pi , Chi-Sun Hwang
IPC: H10K59/131 , G09G3/3225 , G09G3/3266 , H10K59/124
CPC classification number: H10K59/131 , G09G3/3225 , G09G3/3266 , G09G2300/0426 , G09G2300/0814 , G09G2300/0842 , H10K59/124
Abstract: Provided are a semiconductor device, a display panel, and a display device including the same. The semiconductor device includes a lower electrode on one side of a substrate, a spacer on another side of the substrate, a middle electrode on the spacer, a lower channel layer on portions of a sidewall of the spacer, the middle electrode, and the lower electrode, a lower gate insulating layer on the lower channel layer, a common gate electrode on the gate insulating layer, an upper gate insulating layer on the common gate electrode, an upper electrode on the spacer and the upper gate insulating layer of the middle electrode, an upper channel layer connected to the upper electrode and disposed on a sidewall of the upper gate insulating layer, and a contact electrode connected to a portion of the upper channel layer and passing through the lower gate insulating layer and the upper gate insulating layer outside the common gate electrode so as to be connected to the lower electrode.
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Patent Agency Ranking
公开(公告)号：US11706946B2
公开(公告)日：2023-07-18
申请号：US17191276
申请日：2021-03-03
Inventor： Ji-Young Oh , Himchan Oh , Chul Woong Joo , Seung Youl Kang , Chan Woo Park , Seongdeok Ahn , Jae-Eun Pi , Chi-Sun Hwang
CPC classification number: H10K50/844 , H10K77/111 , H10K85/324 , H10K85/615 , H10K85/654 , H10K85/6565 , H10K85/6572 , H10K50/15 , H10K50/16
Abstract: Provided is a stretchable display device. The stretchable display device includes a substrate and a base pattern on the substrate, wherein the base pattern comprises a first portion, a second portion, and a connection portion configured to connect the first portion to the second portion. The stretchable display device includes a lower electrode on the first portion of the base pattern; an upper electrode on the lower electrode, a light emitting structure between the lower electrode and the upper electrode, and a protective layer configured to cover top and side surfaces of the upper electrode, side surfaces of the light emitting structure, a side surface of the lower electrode, and a portion of a side surface of the base pattern. The upper electrode extends to a top surface of the connection portion and a top surface of the second portion of the base pattern, and the first portion and the second portion of the base pattern extend in a first direction parallel to a top surface of the substrate. The first portion and the second portion are parallel to the top surface of the substrate and are spaced apart from each other in a second direction crossing the first direction. The connection portion extends in the second direction. A level of the lowermost surface of the protective layer is disposed between a bottom surface of the lower electrode and a bottom surface of the base pattern.
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公开(公告)号：US10026844B2
公开(公告)日：2018-07-17
申请号：US15461567
申请日：2017-03-17
Inventor： Kyoung Ik Cho , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Seok Lee , Sang Chul Lim , Soon-Won Jung , Hye Yong Chu
IPC: H01L29/10 , H01L29/786 , H01L29/66 , H01L27/12 , H01L21/3105 , H01L21/311
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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18.发明授权公开(公告)号：US09865559B2
公开(公告)日：2018-01-09
申请号：US15220145
申请日：2016-07-26
Inventor： Chan Woo Park , Jae Bon Koo , Bock Soon Na , Rae-Man Park , Ji-Young Oh , Sang Seok Lee , Soon-Won Jung
IPC: H01L23/00 , H01L21/683
CPC classification number: H01L24/43 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L2221/6835 , H01L2224/24137 , H01L2924/00014 , H01L2224/45099
Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.
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公开(公告)号：US09807886B2
公开(公告)日：2017-10-31
申请号：US13772288
申请日：2013-02-20
Inventor： Chan Woo Park , Jae Bon Koo , Sang Chul Lim , Ji-Young Oh , Soon-Won Jung
CPC classification number: H05K3/10 , H05K1/0283 , H05K1/0287 , H05K1/181 , H05K3/0014 , H05K3/284
Abstract: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.
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公开(公告)号：US09634120B2
公开(公告)日：2017-04-25
申请号：US14610410
申请日：2015-01-30
Inventor： Kyoung Ik Cho , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Seok Lee , Sang Chul Lim , Soon-Won Jung , Hye Yong Chu
IPC: H01L29/10 , H01L29/66 , H01L29/786 , H01L27/12 , H01L21/3105
CPC classification number: H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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