公开(公告)号：US20060006888A1

公开(公告)日：2006-01-12

申请号：US10949738

申请日：2004-09-24

Applicant: Ezekiel Kruglick ,  Christopher Bang ,  Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Kieun Kim ,  Richard Chen ,  Gang Zhang

Inventor： Ezekiel Kruglick ,  Christopher Bang ,  Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Kieun Kim ,  Richard Chen ,  Gang Zhang

IPC: G01R31/02

CPC classification number: G01R1/06716 ,  G01R1/0483 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R31/2886

Abstract: Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.

Abstract translation: 用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。 在一些实施例中，提供了多个探针的阵列。

公开(公告)号：US20050221529A1

公开(公告)日：2005-10-06

申请号：US11139391

申请日：2005-05-27

Applicant: Christopher Bang ,  Adam Cohen ,  Michael Lockard ,  John Evans

Inventor： Christopher Bang ,  Adam Cohen ,  Michael Lockard ,  John Evans

IPC: B81C1/00 ,  C25D1/00 ,  C25D5/02 ,  H01L21/4763 ,  H01L23/52 ,  H02N1/00

CPC classification number: H02N1/008 ,  B33Y10/00 ,  B81C1/0019 ,  C25D1/003

Abstract: Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™).

Abstract translation: 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB TM）形成器件。

公开(公告)号：US20050202180A1

公开(公告)日：2005-09-15

申请号：US11029165

申请日：2005-01-03

Applicant: Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

Inventor： Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

IPC: B05D1/38 ,  C08K3/00 ,  C25D3/30 ,  C25D3/38 ,  C25D3/48 ,  C25D5/02 ,  C25D5/10 ,  C25D21/12 ,  H01L21/288 ,  H01L21/301 ,  H01L21/302 ,  H01L21/4763 ,  H01L21/768

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and/or pre-machining depositions to within a small increment of desired surface level (e.g. using lapping or a rough cutting operation) and then using diamond fly cutting to complete he process, and/or forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.

Abstract translation: 公开了用于形成单层和多层中尺度和微结构的电化学制造方法，其包括使用金刚石加工（例如飞切或车削）来平坦化层。 一些实施例集中于可用于电化学制造的牺牲和结构材料的系统，并且可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn， 和Au和Sn-Pb），其中第一材料或材料是结构材料，第二材料是牺牲材料）。 一些实施例着重于在使用金刚石加工以平面化使用难以加工的材料进行电化学制造的结构（例如，通过沉积难以机械材料选择性且潜在地具有少量多余电镀厚度和/或预加工沉积 到所需表面水平的小增量（例如使用研磨或粗切割操作），然后使用金刚石飞切切割来完成其加工，和/或从硬质材料的薄壁区域形成结构或部分结构 而不是结构材料的宽固体区域。

公开(公告)号：US20050189959A1

公开(公告)日：2005-09-01

申请号：US11029182

申请日：2005-01-03

Applicant: Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

Inventor： Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

IPC: G01R31/02 ,  H01L21/20

CPC classification number: B81C1/00111 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R3/00

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

Abstract translation: 本发明的一些实施方案涉及由芯材料和部分涂覆探针的表面的材料形成的微针的电化学制造。 其它实施方案涉及由核心材料形成的微结构的电化学制造，以及完全涂覆形成探针的每个层的表面的材料，包括中间层区域。 这些前两组实施例在形成每个层期间都包括芯材料和涂层材料。 另外的其它实施例涉及在后层形成涂覆过程中由电介质材料部分封装的微探针阵列的电化学制造。 在甚至进一步的实施方案中，来自两种或更多种材料的微结构的电化学制造可以通过在结构的每一层周围并入涂层材料而不将涂层材料定位在层间区域中而进行。

公开(公告)号：US20050171402A1

公开(公告)日：2005-08-04

申请号：US10765842

申请日：2004-01-29

Applicant: Adam Cohen ,  John Golden ,  Liem Vu

Inventor： Adam Cohen ,  John Golden ,  Liem Vu

IPC: A61B1/00 ,  A61B1/018 ,  A61B10/00 ,  A61B17/34 ,  A61M39/00 ,  A61M39/06

CPC classification number: A61B1/00137 ,  A61B1/018 ,  A61B17/3462 ,  A61M39/0606

Abstract: The invention relates to an endoscope channel cap that may be used separately with two or more endoscopes each having a cap interface portion with a different configuration. The channel cap also may include one or more seals to maintain insufflation pressure both when an endoscopic instrument is inserted in a working channel of the endoscope and when the instrument is not inserted in the channel.

Abstract translation: 本发明涉及一种内窥镜通道盖，其可以与两个或更多个内窥镜分开使用，每个内窥镜具有不同构型的盖接口部分。 当内窥镜器械插入到内窥镜的工作通道中并且当仪器未插入通道中时，通道盖还可以包括一个或多个密封件，以保持吹入压力。

公开(公告)号：US20050142739A1

公开(公告)日：2005-06-30

申请号：US11028958

申请日：2005-01-03

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang

IPC: H01L21/8242

CPC classification number: G01R3/00 ,  G01R1/06738 ,  G01R1/07378

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。

公开(公告)号：US20050126916A1

公开(公告)日：2005-06-16

申请号：US10949744

申请日：2004-09-24

Applicant: Michael Lockard ,  Adam Cohen ,  Vacit Arat ,  Dennis Smalley

Inventor： Michael Lockard ,  Adam Cohen ,  Vacit Arat ,  Dennis Smalley

IPC: C25D1/00 ,  C25D1/08 ,  C25D5/02 ,  C25D5/10 ,  C25D7/00 ,  H01M4/02

CPC classification number: C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

Abstract: Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

Abstract translation: 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

公开(公告)号：US20050053849A1

公开(公告)日：2005-03-10

申请号：US10883891

申请日：2004-07-02

Applicant: Adam Cohen ,  Michael Lockard ,  Christopher Bang ,  Marvin Kilgo

Inventor： Adam Cohen ,  Michael Lockard ,  Christopher Bang ,  Marvin Kilgo

IPC: B23H3/00 ,  B23H9/00 ,  C25D1/00 ,  C25D5/02 ,  C25D5/10 ,  G03F7/00 ,  G03F9/00

CPC classification number: C25D1/003 ,  B23H3/00 ,  B23H9/00 ,  C25D5/022 ,  C25D5/10 ,  G03F7/00

Abstract: Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.

Abstract translation: 本发明的实施例涉及使用电化学制造技术形成束状结构，其中束状结构具有窄区域和较宽区域，使得获得所需柔性束。 在一些实施例中，光束的较窄区域比最小特征尺寸更薄，但是由于较厚的区域而可形成。 在一些实施例中，束状结构由多个粘附层形成。

公开(公告)号：US06517428B1

公开(公告)日：2003-02-11

申请号：US09705682

申请日：2000-11-03

Applicant: Dale Murray ,  Thomas Darby ,  Eric Dietrich ,  Adam Cohen ,  Josh Tang

Inventor： Dale Murray ,  Thomas Darby ,  Eric Dietrich ,  Adam Cohen ,  Josh Tang

IPC: A01K100

CPC classification number: A01K1/031 ,  A01K13/00

Abstract: A work station having an environmental controller for maintaining air flow in and through the work station at a user-selected level. The work station includes a pressure cabinet and a perforated work surface forming the top of the pressure cabinet. A pressure inducing assembly is located within the cabinet below the work surface to draw air into the cabinet and create a negative pressure in a work space defined above the work surface. A support coupled to two sides of the pressure cabinet provides a channel for air flow from the pressure cabinet to an air chamber located above the work surface. Air is drawn from the air chamber generally downward toward the work surface by the negative pressure created in the work space to provide an air curtain substantially surrounding the work surface.

Abstract translation: 具有环境控制器的工作站，用于在用户选择的水平上保持和通过工作站的气流。 工作站包括压力柜和形成压力柜顶部的穿孔工作表面。 压力引导组件位于工作表面下方的机柜内，以将空气吸入机柜，并在工作表面上方定义的工作空间中产生负压。 耦合到压力柜的两侧的支撑件提供用于从压力柜到位于工作表面上方的空气室的气流的通道。 通过在工作空间中产生的负压，空气从空气室大体向下朝向工作表面抽出，以提供基本上围绕工作表面的气幕。

公开(公告)号：US20190125126A1

公开(公告)日：2019-05-02

申请号：US16182563

申请日：2018-11-06

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: A47J36/32 ,  B65D83/00

Abstract: Methods and apparatus for automatically preparing food for consumption in which preparation comprises dispensing, manipulation, heating, and other operations using a wide variety of ingredients. The methods and apparatus described use ingredients efficiently and maintain their quality, while avoiding contact between ingredients and apparatus to minimize the risk of system contamination.