公开(公告)号：US11287245B2

公开(公告)日：2022-03-29

申请号：US16868423

申请日：2020-05-06

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/24 ,  G01N21/956 ,  G01B11/26 ,  H05K3/00

Abstract: In one embodiment, a method includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.

公开(公告)号：US20200263976A1

公开(公告)日：2020-08-20

申请号：US16868383

申请日：2020-05-06

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/24 ,  H05K3/00 ,  G01B11/26 ,  G01N21/956

Abstract: In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.

公开(公告)号：US10684123B2

公开(公告)日：2020-06-16

申请号：US15872163

申请日：2018-01-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/04 ,  G01B11/24 ,  G01N21/956 ,  G01B11/26 ,  H05K3/00

Abstract: In one embodiment, a method generally comprises importing a layout identifying routing information for a plurality of differential pair traces on a printed circuit board at a skew assessment module, receiving values for a plurality of skew parameters associated with fiber weave skew, receiving variation parameters from a database comprising data collected on fiber weave variation for one or more of the skew parameters, calculating a skew estimate for the printed circuit board based on the skew parameters and the variation parameters at the skew assessment module, and determining if the skew estimate is within a specified skew allowance for the printed circuit board.

公开(公告)号：US11894296B2

公开(公告)日：2024-02-06

申请号：US17446729

申请日：2021-09-02

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Amendra Koul ,  David Nozadze ,  Upendranadh R. Kareti ,  Joel R. Goergen

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/498 ,  H05K7/20

CPC classification number: H01L23/50 ,  H01L23/3672 ,  H01L23/49838 ,  H05K7/209

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

公开(公告)号：US11777239B2

公开(公告)日：2023-10-03

申请号：US17653466

申请日：2022-03-04

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Amendra Koul ,  David Nozadze ,  Upendranadh R. Kareti ,  Joel R. Goergen

IPC: H01R12/75 ,  H01R12/72

CPC classification number: H01R12/727 ,  H01R12/75

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.

公开(公告)号：US11751322B2

公开(公告)日：2023-09-05

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US20220393776A1

公开(公告)日：2022-12-08

申请号：US17342316

申请日：2021-06-08

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  David Nozadze ,  Mike Sapozhnikov ,  Joel Goergen ,  Arnav Shailesh Shah

IPC: H04B17/15 ,  H04B10/071 ,  H04B17/24

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

公开(公告)号：US11330702B2

公开(公告)日：2022-05-10

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US20220128350A1

公开(公告)日：2022-04-28

申请号：US17573219

申请日：2022-01-11

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  Yaochao Yang ,  Mike Sapozhnikov ,  Joel Richard Goergen ,  Kartheek Nalla

IPC: G01B11/24 ,  G01N21/956 ,  G01B11/26 ,  H05K3/00

Abstract: A method is provided that includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.

公开(公告)号：US20210337657A1

公开(公告)日：2021-10-28

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.