SELF-TERMINATING BACKPLANE CONNECTOR
    2.
    发明申请

    公开(公告)号:US20180261959A1

    公开(公告)日:2018-09-13

    申请号:US15455281

    申请日:2017-03-10

    Abstract: In one embodiment, an apparatus includes a contact contained within a connector configured to couple with a mating connection to provide a communications data path through the connector, a ground shroud extending over a portion of the contact, and a self-terminating element connected to one of the contact and the ground shroud and configured for engagement with the other of the contact and the ground shroud when in an engaged position with the connector uncoupled from the mating connection to terminate signals transmitted to the connector, and disengagement when in a disengaged position with the connector coupled with the mating connection.

    Self-terminating backplane connector

    公开(公告)号:US10135192B2

    公开(公告)日:2018-11-20

    申请号:US15455281

    申请日:2017-03-10

    Abstract: In one embodiment, an apparatus includes a contact contained within a connector configured to couple with a mating connection to provide a communications data path through the connector, a ground shroud extending over a portion of the contact, and a self-terminating element connected to one of the contact and the ground shroud and configured for engagement with the other of the contact and the ground shroud when in an engaged position with the connector uncoupled from the mating connection to terminate signals transmitted to the connector, and disengagement when in a disengaged position with the connector coupled with the mating connection.

    Temperature-dependent printed circuit board trace analyzer

    公开(公告)号:US10387607B2

    公开(公告)日:2019-08-20

    申请号:US15237179

    申请日:2016-08-15

    Abstract: Techniques are disclosed to determine the temperature-dependent insertion loss and propagation delay of traces in a printed circuit board design. For example, an example method includes determining a first temperature at a first portion of a trace of a PCB design based on a thermal map of the PCB design. The method further includes determining a second temperature at a second portion of the trace based on the thermal map. The method further includes calculating a temperature-dependent property of the PCB at the first portion based on the first temperature. The method further includes calculating the temperature-dependent property of the PCB at the second portion based on the second temperature. The method further includes calculating at least one of a signal loss and propagation delay on the trace based on the temperature-dependent property of the PCB at the first portion and the second portion.

    FIBER WEAVE SKEW ASSESSMENT FOR PRINTED CIRCUIT BOARDS

    公开(公告)号:US20190219385A1

    公开(公告)日:2019-07-18

    申请号:US15872163

    申请日:2018-01-16

    Abstract: In one embodiment, a method generally comprises importing a layout identifying routing information for a plurality of differential pair traces on a printed circuit board at a skew assessment module, receiving values for a plurality of skew parameters associated with fiber weave skew, receiving variation parameters from a database comprising data collected on fiber weave variation for one or more of the skew parameters, calculating a skew estimate for the printed circuit board based on the skew parameters and the variation parameters at the skew assessment module, and determining if the skew estimate is within a specified skew allowance for the printed circuit board.

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