Invention Grant
- Patent Title: Fiber weave skew assessment for printed circuit boards
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Application No.: US17556521Application Date: 2021-12-20
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Publication No.: US11761755B2Publication Date: 2023-09-19
- Inventor: Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- The original application number of the division: US16868383 2020.05.06
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01N21/956 ; G01B11/26 ; H05K3/00
Abstract:
In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.
Public/Granted literature
- US20220120558A1 FIBER WEAVE SKEW ASSESSMENT FOR PRINTED CIRCUIT BOARDS Public/Granted day:2022-04-21
Information query
