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公开(公告)号：US11706870B2
公开(公告)日：2023-07-18
申请号：US17503690
申请日：2021-10-18
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
CPC classification number: H05K1/09 , H05K3/4644 , H05K2201/0323 , H05K2201/0338 , H05K2203/1545
Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US20210337666A1
公开(公告)日：2021-10-28
申请号：US17006016
申请日：2020-08-28
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
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公开(公告)号：US12289831B2
公开(公告)日：2025-04-29
申请号：US18305489
申请日：2023-04-24
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US12160948B2
公开(公告)日：2024-12-03
申请号：US18337724
申请日：2023-06-20
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC: H05K1/02
Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).
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5.发明公开公开(公告)号：US20230354505A1
公开(公告)日：2023-11-02
申请号：US18337724
申请日：2023-06-20
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC: H05K1/02
CPC classification number: H05K1/0239 , H05K1/0242 , H05K2201/09245
Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).
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Patent Agency Ranking
6.发明公开公开(公告)号：US20230269873A1
公开(公告)日：2023-08-24
申请号：US18305489
申请日：2023-04-24
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
CPC classification number: H05K1/09 , H05K3/4644 , H05K2203/1545 , H05K2201/0323 , H05K2201/0338
Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US20220217837A1
公开(公告)日：2022-07-07
申请号：US17703051
申请日：2022-03-24
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC: H05K1/02
Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
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公开(公告)号：US20220039257A1
公开(公告)日：2022-02-03
申请号：US17503690
申请日：2021-10-18
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US11202368B2
公开(公告)日：2021-12-14
申请号：US17006016
申请日：2020-08-28
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
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公开(公告)号：US20250151198A1
公开(公告)日：2025-05-08
申请号：US18434943
申请日：2024-02-07
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Elizabeth Kochuparambil , Scott Hinaga , Kameron Rose Hurst , Mike Sapozhnikov , Shobhana Punjabi , David Nozadze , Marco Croci
Abstract: Techniques to move high current power distribution layers for integrated circuit core power and serializer-deserializer (SERDES) power into a center area of the integrated circuit footprint. This provides a more reliable and higher current distribution into the center of a large integrated circuit footprint, without causing disruption of high speed signal routing or increased signal integrity burden to the high speed signals. Arrangements and methods for routing out the core power area of a main printed circuit board under an integrated circuit and replacing it with a custom power printed circuit board (power plug) that is attached by a metalized paste sintering process. This provides a more reliable and higher current distribution into the center of a large integrated circuit or other high-power component, without causing disruption of high speed signal routing.
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