公开(公告)号：US20240088170A1

公开(公告)日：2024-03-14

申请号：US18518526

申请日：2023-11-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/1251 ,  H01L27/127

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11894394B2

公开(公告)日：2024-02-06

申请号：US17281015

申请日：2020-01-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng Cao ,  Yingwei Liu ,  Ke Wang ,  Guocai Zhang ,  Jianguo Wang ,  Zhiwei Liang ,  Haixu Li ,  Muxin Di

IPC: H01L27/12 ,  H01L27/15 ,  C25D7/12 ,  C25D17/00

CPC classification number: H01L27/124 ,  C25D7/123 ,  C25D17/007 ,  H01L27/127 ,  H01L27/156

Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

公开(公告)号：US11424232B2

公开(公告)日：2022-08-23

申请号：US16920771

申请日：2020-07-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Ke Wang ,  Zhiwei Liang ,  Muxin Di ,  Zhanfeng Cao ,  Shuang Liang ,  Guangcai Yuan ,  Qi Yao ,  Dongni Liu

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

公开(公告)号：US11387291B2

公开(公告)日：2022-07-12

申请号：US16605493

申请日：2019-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuang Liang ,  Yingwei Liu ,  Zhanfeng Cao ,  Zhiwei Liang ,  Muxin Di

IPC: H01L27/32 ,  H01L41/113

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.

公开(公告)号：US12062744B2

公开(公告)日：2024-08-13

申请号：US16975771

申请日：2019-10-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin Di ,  Ke Wang ,  Guoqiang Wang ,  Zhiwei Liang ,  Renquan Gu ,  Yingwei Liu ,  Qi Yao ,  Zhanfeng Cao

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/387 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

公开(公告)号：US12021173B2

公开(公告)日：2024-06-25

申请号：US17435016

申请日：2020-11-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Mingxing Wang ,  Binbin Tong ,  Lizhen Zhang ,  Chenyang Zhang ,  Zhen Zhang ,  Xiawei Yun ,  Guangcai Yuan ,  Xue Dong ,  Muxin Di ,  Zhiwei Liang ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/46 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.

公开(公告)号：US11869897B2

公开(公告)日：2024-01-09

申请号：US17057546

申请日：2020-03-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/127 ,  H01L27/1251

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11728202B2

公开(公告)日：2023-08-15

申请号：US16758074

申请日：2019-01-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhanfeng Cao ,  Muxin Di ,  Ke Wang ,  Zhiwei Liang ,  Renquan Gu

IPC: B32B43/00 ,  H01L21/683 ,  H01L21/677 ,  H01L33/62

CPC classification number: H01L21/6838 ,  H01L21/67742 ,  H01L33/62 ,  B32B43/006 ,  Y10T156/1168 ,  Y10T156/19

Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

公开(公告)号：US11488987B2

公开(公告)日：2022-11-01

申请号：US16650690

申请日：2019-10-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Shuang Liang ,  Zhiwei Liang ,  Muxin Di ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L27/12 ,  H01L25/065 ,  H01L25/16 ,  H01L27/15 ,  H01L25/075

Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.

公开(公告)号：US11386837B2

公开(公告)日：2022-07-12

申请号：US17254088

申请日：2020-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Yingwei Liu ,  Zhiwei Liang ,  Muxin Di ,  Wusheng Li

IPC: G09G3/3225 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.