公开(公告)号：US20230049038A1

公开(公告)日：2023-02-16

申请号：US17975894

申请日：2022-10-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a fan-out region and a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line disposed on the other side of the interposer substrate. The bonding connection line includes a first lead and a second lead that are insulated from each other. The interposer substrate is provided with a first interposer via hole and a second interposer via hole. The first lead is electrically connected to the thin-film transistor by a conductive structure in the first interposer via hole and the fan-out region, and the second lead is electrically connected to the thin-film transistor by a conductive structure in the second interposer via hole and the fan-out region.

公开(公告)号：US11502153B2

公开(公告)日：2022-11-15

申请号：US16761823

申请日：2019-03-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

公开(公告)号：US20200273786A1

公开(公告)日：2020-08-27

申请号：US16530605

申请日：2019-08-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Muxin Di ,  Zhiwei Liang ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao ,  Renquan Gu ,  Qi Yao ,  Jaiil Ryu

IPC: H01L23/498 ,  H01L21/48

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

公开(公告)号：US11121068B2

公开(公告)日：2021-09-14

申请号：US16530605

申请日：2019-08-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Muxin Di ,  Zhiwei Liang ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao ,  Renquan Gu ,  Qi Yao ,  Jaiil Ryu

IPC: H01L23/498 ,  H01L21/48

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

公开(公告)号：US20210217837A1

公开(公告)日：2021-07-15

申请号：US16761823

申请日：2019-03-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

公开(公告)号：US11386837B2

公开(公告)日：2022-07-12

申请号：US17254088

申请日：2020-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Yingwei Liu ,  Zhiwei Liang ,  Muxin Di ,  Wusheng Li

IPC: G09G3/3225 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.

公开(公告)号：US20220020864A1

公开(公告)日：2022-01-20

申请号：US17210615

申请日：2021-03-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Lizhen ZHANG ,  Zhi Wang ,  Yi Zhou ,  Wei He ,  Sheng XU ,  Huili Wu ,  Fang He ,  Xuefei Zhao ,  Shipei Li ,  Renquan Gu ,  Wusheng Li ,  Qi Yao ,  Jaiil Ryu

IPC: H01L29/66 ,  H01L29/06 ,  H01L29/417 ,  H01L29/786

Abstract: The present disclosure discloses a thin film transistor, a method for manufacturing thereof, an array substrate and a display device. The method for manufacturing the thin film transistor includes: forming a nanowire active layer on one side of a base substrate; forming a conductive protective layer on one side of the nanowire active layer away from the base substrate; forming an insulating layer on one side of the protective layer away from the nanowire active layer; etching the insulating layer using a dry etching process to form a first via hole exposing a first region of the protective layer and a second via hole exposing a second region of the protective layer; and forming a source-drain layer on one side of the insulating layer away from the protective layer, wherein the source-drain layer includes a first electrode and a second electrode.