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11.发明公开公开(公告)号：US20230352897A1
公开(公告)日：2023-11-02
申请号：US18337362
申请日：2023-06-19
申请人： Ayar Labs, Inc.
发明人： Milos Popovic , Rajeev Ram , Vladimir Stojanovic , Chen Sun , Mark Taylor Wade , Alexandra Carroll Wright
IPC分类号： H04B10/40 , H04B10/572 , H01S3/08 , H04B10/50 , H01S3/00 , H01S3/23 , H04J14/02 , H01S3/04 , H04B10/25
CPC分类号： H01S3/08086 , H01S3/005 , H01S3/0405 , H01S3/2391 , H04B10/25 , H04B10/40 , H04B10/503 , H04B10/506 , H04B10/572 , H04J14/02 , H04J14/025 , H04J2014/0253 , H04J14/0282
摘要： A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.
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公开(公告)号：US11493708B2
公开(公告)日：2022-11-08
申请号：US17021805
申请日：2020-09-15
申请人： Ayar Labs, Inc.
摘要： A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.
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公开(公告)号：US20220171142A1
公开(公告)日：2022-06-02
申请号：US17671525
申请日：2022-02-14
申请人： Ayar Labs, Inc.
发明人： Alexandra Wright , Mark Wade , Chen Sun , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Roy Edward Meade , Derek Van Orden
摘要： An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
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公开(公告)号：US20220166533A1
公开(公告)日：2022-05-26
申请号：US17527483
申请日：2021-11-16
申请人： Ayar Labs, Inc.
IPC分类号： H04J14/02 , H04L12/931 , H04Q11/00
摘要： A network switch system-in-package includes a carrier substrate with a network switch chip and a plurality of photonic input/output modules disposed on the carrier substrate. Each of the plurality of photonic input/output modules includes a module substrate and a plurality of photonic chip pods disposed on the module substrate. Each photonic chip pod includes a pod substrate with a photonic input/output chiplet and a gearbox chiplet attached to the pod substrate. The photonic input/output chiplet includes a parallel electrical interface, a photonic interface, and a plurality of optical macros implemented between the photonic interface and the parallel electrical interface. The gearbox chiplet electrically connects with the parallel electrical interface of the photonic input/output chiplet and a serial electrical interface of the network switch chip. The gearbox chiplet converts between the parallel electrical interface of the photonic input/output chiplet and the serial electrical interface of the network switch chip.
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15.发明申请公开(公告)号：US20220149582A1
公开(公告)日：2022-05-12
申请号：US17582814
申请日：2022-01-24
申请人： Ayar Labs, Inc.
发明人： Milos Popovic , Rajeev Ram , Vladimir Stojanovic , Chen Sun , Mark Taylor Wade , Alexandra Carroll Wright
IPC分类号： H01S3/08 , H04B10/50 , H04J14/02 , H01S3/00 , H01S3/04 , H01S3/23 , H04B10/25 , H04B10/40 , H04B10/572
摘要： A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.
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公开(公告)号：US11233580B2
公开(公告)日：2022-01-25
申请号：US17175678
申请日：2021-02-14
申请人： Ayar Labs, Inc.
发明人： Roy Edward Meade , Vladimir Stojanovic , Chen Sun , Mark Wade , Hugo Saleh , Charles Wuischpard
IPC分类号： G11C5/04 , G11C5/06 , G11C11/42 , H04B10/80 , H04B10/516
摘要： A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
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公开(公告)号：US20210286129A1
公开(公告)日：2021-09-16
申请号：US17184537
申请日：2021-02-24
申请人： Ayar Labs, Inc.
发明人： John Fini , Vladimir Stojanovic , Chen Sun , Derek van Orden , Mark Taylor Wade
摘要： An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.
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公开(公告)号：US20200021384A1
公开(公告)日：2020-01-16
申请号：US16510824
申请日：2019-07-12
申请人： Ayar Labs, Inc.
发明人： Vladimir Stojanovic , Alexandra Wright , Chen Sun , Mark Wade , Roy Edward Meade
摘要： A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.
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公开(公告)号：US20180019820A1
公开(公告)日：2018-01-18
申请号：US15650586
申请日：2017-07-14
申请人： Ayar Labs, Inc.
发明人： Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden
摘要： A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.
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公开(公告)号：US20240310589A1
公开(公告)日：2024-09-19
申请号：US18675112
申请日：2024-05-27
申请人： Ayar Labs, Inc.
发明人： Alexandra Wright , Mark Wade , Chen Sun , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Roy Edward Meade , Derek Van Orden
CPC分类号： G02B6/4202 , G02B6/2934 , G02B6/4216 , G02B6/4219 , G02B6/4287
摘要： An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
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