公开(公告)号：US20160307782A1

公开(公告)日：2016-10-20

申请号：US15099760

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67754 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68764 ,  H01L21/68771

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

Abstract translation: 描述了包括机器人，转盘和至少一个用于批处理室的加热模块的缓冲室。 描述了用于快速和可重复地移动晶片进出缓冲室的机器人配置和结合缓冲室和机器人的集群工具。

公开(公告)号：US20140271054A1

公开(公告)日：2014-09-18

申请号：US14211123

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。

公开(公告)号：US20160218028A1

公开(公告)日：2016-07-28

申请号：US15001716

申请日：2016-01-20

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David T. Blahnik ,  William T. Weaver

IPC: H01L21/673

CPC classification number: H01L21/67017 ,  H01L21/67109 ,  H01L21/6732 ,  H01L21/68742

Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

Abstract translation: 晶片盒和使用方法为多个晶片提供加热冷却以减少处理室中的晶片切换之间的时间。 晶片支撑在晶片升降机上，其可以将所有晶片移动到一起或独立的提升销上，该提升销可移动各个晶片以进行加热和冷却。

公开(公告)号：US20140271057A1

公开(公告)日：2014-09-18

申请号：US14212665

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Malcolm N. Daniel, JR. ,  Robert B. Vopat ,  Jeffrey C. Blahnik ,  Joseph Yudovsky

IPC: H01L21/677

Abstract: Embodiments of substrate handling systems capable of heating and/or cooling batches of substrates being transferred into and out of various substrate processing chambers are provided. Methods of substrate handling are also provided, as are numerous other aspects.

Abstract translation: 提供了能够加热和/或冷却转移到各种基板处理室中的基板批量的基板处理系统的实施例。 还提供了衬底处理的方法，以及许多其它方面。

公开(公告)号：US12002649B2

公开(公告)日：2024-06-04

申请号：US17547623

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Robert Mitchell ,  Frank Sinclair ,  Joseph C. Olson ,  William T. Weaver ,  Nick Parisi

IPC: H01J37/20 ,  C23C14/48 ,  C23C14/50 ,  H01J37/317 ,  H01L21/683

CPC classification number: H01J37/20 ,  C23C14/48 ,  C23C14/505 ,  H01J37/3171 ,  H01L21/6833 ,  H01J2237/20214

Abstract: A system comprising a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on the spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The plurality of platens may also be capable of rotation. The central hub also controls the rotation of each of the platens about an axis orthogonal to the rotation axis of the central hub. In this way, variable angle implants may be performed. Additionally, this allows the workpieces to be mounted while in a horizontal orientation.

公开(公告)号：US11817332B2

公开(公告)日：2023-11-14

申请号：US17028281

申请日：2020-09-22

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Andrew J. Constant ,  Shay Assaf ,  Jacob Newman

IPC: H01L21/67

CPC classification number: H01L21/67201

Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.

公开(公告)号：US20210090917A1

公开(公告)日：2021-03-25

申请号：US17028281

申请日：2020-09-22

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Andrew J. Constant ,  Shay Assaf ,  Jacob Newman

IPC: H01L21/67

Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.

公开(公告)号：US10586720B2

公开(公告)日：2020-03-10

申请号：US16292790

申请日：2019-03-05

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, Jr. ,  Robert Mitchell

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

公开(公告)号：US20190198368A1

公开(公告)日：2019-06-27

申请号：US16292790

申请日：2019-03-05

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

公开(公告)号：US10283379B2

公开(公告)日：2019-05-07

申请号：US15001716

申请日：2016-01-20

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David T. Blahnik ,  William T. Weaver

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/673 ,  H01L21/687

Abstract: Apparatus and methods for heating and cooling a plurality of substrate wafers are provided. LED lamps are positioned against the back sides of a plurality of cold plates. In some embodiments, wafers are supported on a wafer lift which can move all wafers together. In some embodiments, wafers are supported on independent lift pins which can move individual wafers for heating and cooling. Some embodiments of the disclosure provide for decreased time between wafer switching in a processing chamber.