Abstract:
A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.
Abstract:
A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.
Abstract:
The disclosure provides aluminum alloys with high tensile strength and appealing cosmetics and improved tensile yield strength. The aluminum alloys include 0.5 to 3.0 wt % Mg and 0.2 to 3.0 wt % Si. The alloys have a weight ratio of Mg to Si ranging from 2 to 4.
Abstract:
The disclosure is directed to Zr and Hf bearing alloys that are capable of forming a metallic glass, and more particularly metallic glass rods with diameters at least 1 mm and as large as 5 mm or larger. The disclosure is further directed to Zr and Hf bearing alloys that demonstrate a favorable combination of glass forming ability, strength, toughness, bending ductility, and/or corrosion resistance.
Abstract:
A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.
Abstract:
The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.
Abstract:
A housing for an electronic device can include a metallic component at least partially defining an external surface of the device. The metallic component can have an average grain size less than 45 nanometers in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average grain size greater than 45 nanometers in a second region adjacent to the first surface.
Abstract:
The disclosure is directed to aluminum alloys made from recycled components. The alloys have copper (Cu) from 0.051 to 0.10 wt %, chromium (Cr) from 0.01 to 0.10 wt %, zinc (Zn) from 0.02 to 0.20 wt %, manganese (Mn) from 0.03 to 0.10 wt %, iron (Fe) in an amount of at least 0.10 wt %, silicon (Si) in an amount of at least 0.35 wt %, magnesium (Mg) in amount of at least 0.45 wt %, and the remaining wt % being Al and incidental impurities. In other aspects, the disclosure is directed to aluminum alloys having copper (Cu) from 0.010 to 0.050 wt %, chromium (Cr) from 0.01 to 0.10 wt %, zinc (Zn) from 0.01 to 0.20 wt %, manganese (Mn) from 0.03 to 0.10 wt %, iron (Fe) in an amount of at least 0.10 wt %, silicon (Si) in an amount of at least 0.35 wt %, magnesium (Mg) in amount of at least 0.45 wt %, and the remaining wt % being Al and incidental impurities. The b* color of the alloys ranges from −2 to 2, and the L* color ranges from 70 to 100.
Abstract:
A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.