公开(公告)号：US20220304175A1

公开(公告)日：2022-09-22

申请号：US17805641

申请日：2022-06-06

Applicant: Apple Inc.

Inventor： Eric W. Hamann ,  Abhijeet Misra ,  Anthony D. Prescenzi ,  Brian M. Gable ,  Christopher D. Prest ,  Hoishun Li ,  James A. Yurko ,  Lee E. Hooton ,  Michael B. Wittenberg ,  Richard H. Dinh ,  Jennifer D. Schuler

IPC: H05K5/04 ,  H05K5/00 ,  H05K5/02

Abstract: A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.